Products
AMAOE 0.12mm Reballing Stencil For iPhone 14 Series
1. Featuring a 0.12mm ultra-thin design, it fits precisely to the chip surface, significantly improving reballing success rates and ensuring optimal performance for high-precision IC chip repairs.2. Made of high-quality stainless steel, it offers excellent heat resistance and corrosion resistance, maintaining its shape without bending or deforming even after prolonged use, ensuring consistent reballing results every time.3. Specifically designed for Apple chip models, fully compatible with CPUs, basebands, power management ICs, and other common chips, meeting diverse repair demands.4. Utilizing laser micron-level cutting technology, the stencil features uniform aperture sizes and highly accurate solder ball alignment, effectively minimizing misalignment, solder bridging, and enhancing overall soldering yield.5. Precisely aligned hole positions allow for quick and easy operation, greatly improving reballing efficiency, reducing rework rates, and making it suitable for both individual technicians and professional mass production environments.6. Highly durable and wear-resistant, easy to clean, and capable of withstanding hundreds of reuse cycles under normal conditions, offering excellent cost-effectiveness and significantly lowering repair costs.Specification: General Compatible with Apple: iPhone 14 Plus , iPhone 14 , iPhone 14 Pro , iPhone 14 Pro Max Package Weight One Package Weight 0.05kgs / 0.12lb One Package Size 10cm * 10cm * 1cm / 3.94inch * 3.94inch * 0.39inch Qty per Carton 360 Carton Weight 19.00kgs / 41.89lb Carton Size 42cm * 32cm * 32cm / 16.54inch * 12.6inch * 12.6inch Loading Container 20GP: 620 cartons * 360 pcs = 223200 pcs 40HQ: 1439 cartons * 360 pcs = 518040 pcs
83,11 kr
AMAOE 0.12mm Reballing Stencil For iPhone 15 Series
1. Featuring a 0.12mm ultra-thin design, it fits precisely to the chip surface, significantly improving reballing success rates and ensuring optimal performance for high-precision IC chip repairs.2. Made of high-quality stainless steel, it offers excellent heat resistance and corrosion resistance, maintaining its shape without bending or deforming even after prolonged use, ensuring consistent reballing results every time.3. Specifically designed for Apple chip models, fully compatible with CPUs, basebands, power management ICs, and other common chips, meeting diverse repair demands.4. Utilizing laser micron-level cutting technology, the stencil features uniform aperture sizes and highly accurate solder ball alignment, effectively minimizing misalignment, solder bridging, and enhancing overall soldering yield.5. Precisely aligned hole positions allow for quick and easy operation, greatly improving reballing efficiency, reducing rework rates, and making it suitable for both individual technicians and professional mass production environments.6. Highly durable and wear-resistant, easy to clean, and capable of withstanding hundreds of reuse cycles under normal conditions, offering excellent cost-effectiveness and significantly lowering repair costs.Specification: General Compatible with Apple: iPhone 15 Pro Max , iPhone 15 Pro , iPhone 15 , iPhone 15 Plus Package Weight One Package Weight 0.05kgs / 0.12lb One Package Size 10cm * 10cm * 1cm / 3.94inch * 3.94inch * 0.39inch Qty per Carton 360 Carton Weight 19.00kgs / 41.89lb Carton Size 42cm * 32cm * 32cm / 16.54inch * 12.6inch * 12.6inch Loading Container 20GP: 620 cartons * 360 pcs = 223200 pcs 40HQ: 1439 cartons * 360 pcs = 518040 pcs
84,79 kr
AMAOE 0.12mm Reballing Stencil For iPhone 16 Series
1. Featuring a 0.12mm ultra-thin design, it fits precisely to the chip surface, significantly improving reballing success rates and ensuring optimal performance for high-precision IC chip repairs.2. Made of high-quality stainless steel, it offers excellent heat resistance and corrosion resistance, maintaining its shape without bending or deforming even after prolonged use, ensuring consistent reballing results every time.3. Specifically designed for Apple chip models, fully compatible with CPUs, basebands, power management ICs, and other common chips, meeting diverse repair demands.4. Utilizing laser micron-level cutting technology, the stencil features uniform aperture sizes and highly accurate solder ball alignment, effectively minimizing misalignment, solder bridging, and enhancing overall soldering yield.5. Precisely aligned hole positions allow for quick and easy operation, greatly improving reballing efficiency, reducing rework rates, and making it suitable for both individual technicians and professional mass production environments.6. Highly durable and wear-resistant, easy to clean, and capable of withstanding hundreds of reuse cycles under normal conditions, offering excellent cost-effectiveness and significantly lowering repair costs.Specification: General Compatible with Apple: iPhone 16 Pro Max , iPhone 16 Plus , iPhone 16 , iPhone 16 Pro Package Weight One Package Weight 0.05kgs / 0.12lb One Package Size 10cm * 10cm * 1cm / 3.94inch * 3.94inch * 0.39inch Qty per Carton 360 Carton Weight 19.00kgs / 41.89lb Carton Size 42cm * 32cm * 32cm / 16.54inch * 12.6inch * 12.6inch Loading Container 20GP: 620 cartons * 360 pcs = 223200 pcs 40HQ: 1439 cartons * 360 pcs = 518040 pcs
84,79 kr
AMAOE 0.12mm Reballing Stencil For iPhone 6-15 Series Baseband
1. Featuring a 0.12mm ultra-thin design, it fits precisely to the chip surface, significantly improving reballing success rates and ensuring optimal performance for high-precision IC chip repairs.2. Made of high-quality stainless steel, it offers excellent heat resistance and corrosion resistance, maintaining its shape without bending or deforming even after prolonged use, ensuring consistent reballing results every time.3. Specifically designed for Apple chip models, fully compatible with CPUs, basebands, power management ICs, and other common chips, meeting diverse repair demands.4. Utilizing laser micron-level cutting technology, the stencil features uniform aperture sizes and highly accurate solder ball alignment, effectively minimizing misalignment, solder bridging, and enhancing overall soldering yield.5. Precisely aligned hole positions allow for quick and easy operation, greatly improving reballing efficiency, reducing rework rates, and making it suitable for both individual technicians and professional mass production environments.6. Highly durable and wear-resistant, easy to clean, and capable of withstanding hundreds of reuse cycles under normal conditions, offering excellent cost-effectiveness and significantly lowering repair costs.Specification: General Compatible with Apple: iPhone 15 Pro Max , iPhone 15 Pro , iPhone 15 , iPhone 15 Plus , iPhone 14 Plus , iPhone 14 , iPhone 14 Pro , iPhone 14 Pro Max , iPhone 13 Pro Max , iPhone 13 , iPhone 13 mini , iPhone 13 Pro , iPhone 12 , iPhone 12 Pro Max , iPhone 12 Pro , iPhone 12 mini , iPhone 11 Pro , iPhone 11 Pro Max , iPhone XS , iPhone XS Max , iPhone XR , iPhone 8 Plus , iPhone 8 , iPhone 7 , iPhone 7 Plus , iPhone 6s Plus , iPhone 6s , iPhone 6 Plus , iPhone 6 Package Weight One Package Weight 0.05kgs / 0.12lb One Package Size 10cm * 10cm * 1cm / 3.94inch * 3.94inch * 0.39inch Qty per Carton 360 Carton Weight 19.00kgs / 41.89lb Carton Size 42cm * 32cm * 32cm / 16.54inch * 12.6inch * 12.6inch Loading Container 20GP: 620 cartons * 360 pcs = 223200 pcs 40HQ: 1439 cartons * 360 pcs = 518040 pcs
84,79 kr
AMAOE 0.12mm Reballing Stencil For iPhone 7-15 Series
1. Featuring a 0.12mm ultra-thin design, it fits precisely to the chip surface, significantly improving reballing success rates and ensuring optimal performance for high-precision IC chip repairs.2. Made of high-quality stainless steel, it offers excellent heat resistance and corrosion resistance, maintaining its shape without bending or deforming even after prolonged use, ensuring consistent reballing results every time.3. Specifically designed for Apple chip models, fully compatible with CPUs, basebands, power management ICs, and other common chips, meeting diverse repair demands.4. Utilizing laser micron-level cutting technology, the stencil features uniform aperture sizes and highly accurate solder ball alignment, effectively minimizing misalignment, solder bridging, and enhancing overall soldering yield.5. Precisely aligned hole positions allow for quick and easy operation, greatly improving reballing efficiency, reducing rework rates, and making it suitable for both individual technicians and professional mass production environments.6. Highly durable and wear-resistant, easy to clean, and capable of withstanding hundreds of reuse cycles under normal conditions, offering excellent cost-effectiveness and significantly lowering repair costs.Specification: General Compatible with Apple: iPhone 15 Pro Max , iPhone 15 Pro , iPhone 15 , iPhone 15 Plus , iPhone 14 Plus , iPhone 14 , iPhone 14 Pro , iPhone 14 Pro Max , iPhone 13 Pro Max , iPhone 13 , iPhone 13 mini , iPhone 13 Pro , iPhone 12 , iPhone 12 Pro Max , iPhone 12 Pro , iPhone 12 mini , iPhone 11 Pro , iPhone 11 Pro Max , iPhone 11 , iPhone XS , iPhone XS Max , iPhone XR , iPhone X , iPhone 8 Plus , iPhone 8 , iPhone 7 , iPhone 7 Plus Package Weight One Package Weight 0.05kgs / 0.12lb One Package Size 10cm * 10cm * 1cm / 3.94inch * 3.94inch * 0.39inch Qty per Carton 360 Carton Weight 19.00kgs / 41.89lb Carton Size 42cm * 32cm * 32cm / 16.54inch * 12.6inch * 12.6inch Loading Container 20GP: 620 cartons * 360 pcs = 223200 pcs 40HQ: 1439 cartons * 360 pcs = 518040 pcs
84,79 kr
AMAOE 0.12mm Reballing Stencil For WiFi Comprehensive
1. Featuring a 0.12mm ultra-thin design, it fits precisely to the chip surface, significantly improving reballing success rates and ensuring optimal performance for high-precision IC chip repairs.2. Made of high-quality stainless steel, it offers excellent heat resistance and corrosion resistance, maintaining its shape without bending or deforming even after prolonged use, ensuring consistent reballing results every time.3. Specifically designed for Apple chip models, fully compatible with CPUs, basebands, power management ICs, and other common chips, meeting diverse repair demands.4. Utilizing laser micron-level cutting technology, the stencil features uniform aperture sizes and highly accurate solder ball alignment, effectively minimizing misalignment, solder bridging, and enhancing overall soldering yield.5. Precisely aligned hole positions allow for quick and easy operation, greatly improving reballing efficiency, reducing rework rates, and making it suitable for both individual technicians and professional mass production environments.6. Highly durable and wear-resistant, easy to clean, and capable of withstanding hundreds of reuse cycles under normal conditions, offering excellent cost-effectiveness and significantly lowering repair costs.Specification: Package Weight One Package Weight 0.05kgs / 0.12lb One Package Size 10cm * 10cm * 1cm / 3.94inch * 3.94inch * 0.39inch Qty per Carton 360 Carton Weight 19.00kgs / 41.89lb Carton Size 42cm * 32cm * 32cm / 16.54inch * 12.6inch * 12.6inch Loading Container 20GP: 620 cartons * 360 pcs = 223200 pcs 40HQ: 1439 cartons * 360 pcs = 518040 pcs
83,11 kr
AMAOE For Samsung BGA Reballing Stencil Soldering Repair Tool, Model: SAM15 S21/S21 Ultra
1. SAM15: Suitable for Qualcomm Snapdragon 888 SM8350/Exynos 2100 CPU series, Samsung S21/S21+/S21 Ultra G998U/G996U/Z Flip 3/Z Fold 3/W22, etc. 2. SAM16: Suitable for Exynos 1280/Samsung E8825 CPU universal series, A53/A536, etc. 3. SAM17: Suitable for Exynos 2200/E9925, Snapdragon 8 Gen 1/SM8450 CPU universal series, Samsung S22/S22 Plus/S22 Ultra/S901/S906/S908, etc. 4. SAM18: Suitable for Exynos 1330-E8535P/1380-E8835P CPU universal series, Samsung A14/A54, etc. 5. SAM19: Suitable for Snapdragon 8 Gen 2 SM8550/8 Gen 3 SM8650 CPU universal series, Samsung S23/S23 Ultra/S24/S24 Ultra, etc. 6. SAM20: Suitable for MediaTek Dimensity 6100+ MT6835V CPU universal series, Samsung A156U/A156E, etc. 7. SAM21: Suitable for Snapdragon 8 Ultimate Edition SM8750 CPU universal series, Samsung S25/S25 Plus, etc.Specification: General Compatible with Samsung: W22 5G , Galaxy Z Fold3 5G , Galaxy Z Flip3 5G , Galaxy S21+ 5G , Galaxy S21 Ultra 5G , Galaxy S21 5G Package Weight One Package Weight 0.05kgs / 0.12lb One Package Size 10cm * 10cm * 2cm / 3.94inch * 3.94inch * 0.79inch Qty per Carton 360 Carton Weight 19.00kgs / 41.89lb Carton Size 42cm * 32cm * 32cm / 16.54inch * 12.6inch * 12.6inch Loading Container 20GP: 620 cartons * 360 pcs = 223200 pcs 40HQ: 1439 cartons * 360 pcs = 518040 pcs
75,72 kr
AMAOE For Samsung BGA Reballing Stencil Soldering Repair Tool, Model: SAM16 A53/A536
1. SAM15: Suitable for Qualcomm Snapdragon 888 SM8350/Exynos 2100 CPU series, Samsung S21/S21+/S21 Ultra G998U/G996U/Z Flip 3/Z Fold 3/W22, etc. 2. SAM16: Suitable for Exynos 1280/Samsung E8825 CPU universal series, A53/A536, etc. 3. SAM17: Suitable for Exynos 2200/E9925, Snapdragon 8 Gen 1/SM8450 CPU universal series, Samsung S22/S22 Plus/S22 Ultra/S901/S906/S908, etc. 4. SAM18: Suitable for Exynos 1330-E8535P/1380-E8835P CPU universal series, Samsung A14/A54, etc. 5. SAM19: Suitable for Snapdragon 8 Gen 2 SM8550/8 Gen 3 SM8650 CPU universal series, Samsung S23/S23 Ultra/S24/S24 Ultra, etc. 6. SAM20: Suitable for MediaTek Dimensity 6100+ MT6835V CPU universal series, Samsung A156U/A156E, etc. 7. SAM21: Suitable for Snapdragon 8 Ultimate Edition SM8750 CPU universal series, Samsung S25/S25 Plus, etc.Specification: General Compatible with Samsung: Galaxy A53 5G , Galaxy A53 Package Weight One Package Weight 0.05kgs / 0.12lb One Package Size 10cm * 10cm * 2cm / 3.94inch * 3.94inch * 0.79inch Qty per Carton 360 Carton Weight 19.00kgs / 41.89lb Carton Size 42cm * 32cm * 32cm / 16.54inch * 12.6inch * 12.6inch Loading Container 20GP: 620 cartons * 360 pcs = 223200 pcs 40HQ: 1439 cartons * 360 pcs = 518040 pcs
75,72 kr
AMAOE For Samsung BGA Reballing Stencil Soldering Repair Tool, Model: SAM17 S22/S22 Ultra
1. SAM15: Suitable for Qualcomm Snapdragon 888 SM8350/Exynos 2100 CPU series, Samsung S21/S21+/S21 Ultra G998U/G996U/Z Flip 3/Z Fold 3/W22, etc. 2. SAM16: Suitable for Exynos 1280/Samsung E8825 CPU universal series, A53/A536, etc. 3. SAM17: Suitable for Exynos 2200/E9925, Snapdragon 8 Gen 1/SM8450 CPU universal series, Samsung S22/S22 Plus/S22 Ultra/S901/S906/S908, etc. 4. SAM18: Suitable for Exynos 1330-E8535P/1380-E8835P CPU universal series, Samsung A14/A54, etc. 5. SAM19: Suitable for Snapdragon 8 Gen 2 SM8550/8 Gen 3 SM8650 CPU universal series, Samsung S23/S23 Ultra/S24/S24 Ultra, etc. 6. SAM20: Suitable for MediaTek Dimensity 6100+ MT6835V CPU universal series, Samsung A156U/A156E, etc. 7. SAM21: Suitable for Snapdragon 8 Ultimate Edition SM8750 CPU universal series, Samsung S25/S25 Plus, etc.Specification: General Compatible with Samsung: Galaxy S22 5G , Galaxy S22 Ultra 5G , Galaxy S22+ 5G Package Weight One Package Weight 0.05kgs / 0.12lb One Package Size 10cm * 10cm * 2cm / 3.94inch * 3.94inch * 0.79inch Qty per Carton 360 Carton Weight 19.00kgs / 41.89lb Carton Size 42cm * 32cm * 32cm / 16.54inch * 12.6inch * 12.6inch Loading Container 20GP: 620 cartons * 360 pcs = 223200 pcs 40HQ: 1439 cartons * 360 pcs = 518040 pcs
75,72 kr
AMAOE For Samsung BGA Reballing Stencil Soldering Repair Tool, Model: SAM18 A14/A54
1. SAM15: Suitable for Qualcomm Snapdragon 888 SM8350/Exynos 2100 CPU series, Samsung S21/S21+/S21 Ultra G998U/G996U/Z Flip 3/Z Fold 3/W22, etc. 2. SAM16: Suitable for Exynos 1280/Samsung E8825 CPU universal series, A53/A536, etc. 3. SAM17: Suitable for Exynos 2200/E9925, Snapdragon 8 Gen 1/SM8450 CPU universal series, Samsung S22/S22 Plus/S22 Ultra/S901/S906/S908, etc. 4. SAM18: Suitable for Exynos 1330-E8535P/1380-E8835P CPU universal series, Samsung A14/A54, etc. 5. SAM19: Suitable for Snapdragon 8 Gen 2 SM8550/8 Gen 3 SM8650 CPU universal series, Samsung S23/S23 Ultra/S24/S24 Ultra, etc. 6. SAM20: Suitable for MediaTek Dimensity 6100+ MT6835V CPU universal series, Samsung A156U/A156E, etc. 7. SAM21: Suitable for Snapdragon 8 Ultimate Edition SM8750 CPU universal series, Samsung S25/S25 Plus, etc.Specification: General Compatible with Samsung: Galaxy A14 4G , Galaxy A54 5G Package Weight One Package Weight 0.05kgs / 0.12lb One Package Size 10cm * 10cm * 2cm / 3.94inch * 3.94inch * 0.79inch Qty per Carton 360 Carton Weight 19.00kgs / 41.89lb Carton Size 42cm * 32cm * 32cm / 16.54inch * 12.6inch * 12.6inch Loading Container 20GP: 620 cartons * 360 pcs = 223200 pcs 40HQ: 1439 cartons * 360 pcs = 518040 pcs
75,72 kr
AMAOE For Samsung BGA Reballing Stencil Soldering Repair Tool, Model: SAM19 S23/S24
1. SAM15: Suitable for Qualcomm Snapdragon 888 SM8350/Exynos 2100 CPU series, Samsung S21/S21+/S21 Ultra G998U/G996U/Z Flip 3/Z Fold 3/W22, etc. 2. SAM16: Suitable for Exynos 1280/Samsung E8825 CPU universal series, A53/A536, etc. 3. SAM17: Suitable for Exynos 2200/E9925, Snapdragon 8 Gen 1/SM8450 CPU universal series, Samsung S22/S22 Plus/S22 Ultra/S901/S906/S908, etc. 4. SAM18: Suitable for Exynos 1330-E8535P/1380-E8835P CPU universal series, Samsung A14/A54, etc. 5. SAM19: Suitable for Snapdragon 8 Gen 2 SM8550/8 Gen 3 SM8650 CPU universal series, Samsung S23/S23 Ultra/S24/S24 Ultra, etc. 6. SAM20: Suitable for MediaTek Dimensity 6100+ MT6835V CPU universal series, Samsung A156U/A156E, etc. 7. SAM21: Suitable for Snapdragon 8 Ultimate Edition SM8750 CPU universal series, Samsung S25/S25 Plus, etc.Specification: General Compatible with Samsung: Galaxy S24 Ultra 5G , Galaxy S24+ 5G , Galaxy S24 5G , Galaxy S23+ 5G , Galaxy S23 Ultra 5G , Galaxy S23 5G Package Weight One Package Weight 0.05kgs / 0.12lb One Package Size 10cm * 10cm * 2cm / 3.94inch * 3.94inch * 0.79inch Qty per Carton 360 Carton Weight 19.00kgs / 41.89lb Carton Size 42cm * 32cm * 32cm / 16.54inch * 12.6inch * 12.6inch Loading Container 20GP: 620 cartons * 360 pcs = 223200 pcs 40HQ: 1439 cartons * 360 pcs = 518040 pcs
75,72 kr
AMAOE For Samsung BGA Reballing Stencil Soldering Repair Tool, Model: SAM20 A156U/A156E
1. SAM15: Suitable for Qualcomm Snapdragon 888 SM8350/Exynos 2100 CPU series, Samsung S21/S21+/S21 Ultra G998U/G996U/Z Flip 3/Z Fold 3/W22, etc. 2. SAM16: Suitable for Exynos 1280/Samsung E8825 CPU universal series, A53/A536, etc. 3. SAM17: Suitable for Exynos 2200/E9925, Snapdragon 8 Gen 1/SM8450 CPU universal series, Samsung S22/S22 Plus/S22 Ultra/S901/S906/S908, etc. 4. SAM18: Suitable for Exynos 1330-E8535P/1380-E8835P CPU universal series, Samsung A14/A54, etc. 5. SAM19: Suitable for Snapdragon 8 Gen 2 SM8550/8 Gen 3 SM8650 CPU universal series, Samsung S23/S23 Ultra/S24/S24 Ultra, etc. 6. SAM20: Suitable for MediaTek Dimensity 6100+ MT6835V CPU universal series, Samsung A156U/A156E, etc. 7. SAM21: Suitable for Snapdragon 8 Ultimate Edition SM8750 CPU universal series, Samsung S25/S25 Plus, etc.Specification: General Compatible with Samsung: Galaxy A15 5G Package Weight One Package Weight 0.05kgs / 0.12lb One Package Size 10cm * 10cm * 2cm / 3.94inch * 3.94inch * 0.79inch Qty per Carton 360 Carton Weight 19.00kgs / 41.89lb Carton Size 42cm * 32cm * 32cm / 16.54inch * 12.6inch * 12.6inch Loading Container 20GP: 620 cartons * 360 pcs = 223200 pcs 40HQ: 1439 cartons * 360 pcs = 518040 pcs
75,72 kr
AMAOE For Samsung BGA Reballing Stencil Soldering Repair Tool, Model: SAM21 S25/S25+
1. SAM15: Suitable for Qualcomm Snapdragon 888 SM8350/Exynos 2100 CPU series, Samsung S21/S21+/S21 Ultra G998U/G996U/Z Flip 3/Z Fold 3/W22, etc. 2. SAM16: Suitable for Exynos 1280/Samsung E8825 CPU universal series, A53/A536, etc. 3. SAM17: Suitable for Exynos 2200/E9925, Snapdragon 8 Gen 1/SM8450 CPU universal series, Samsung S22/S22 Plus/S22 Ultra/S901/S906/S908, etc. 4. SAM18: Suitable for Exynos 1330-E8535P/1380-E8835P CPU universal series, Samsung A14/A54, etc. 5. SAM19: Suitable for Snapdragon 8 Gen 2 SM8550/8 Gen 3 SM8650 CPU universal series, Samsung S23/S23 Ultra/S24/S24 Ultra, etc. 6. SAM20: Suitable for MediaTek Dimensity 6100+ MT6835V CPU universal series, Samsung A156U/A156E, etc. 7. SAM21: Suitable for Snapdragon 8 Ultimate Edition SM8750 CPU universal series, Samsung S25/S25 Plus, etc.Specification: General Compatible with Samsung: Galaxy S25+ 5G , Galaxy S25 5G Package Weight One Package Weight 0.05kgs / 0.12lb One Package Size 10cm * 10cm * 2cm / 3.94inch * 3.94inch * 0.79inch Qty per Carton 360 Carton Weight 19.00kgs / 41.89lb Carton Size 42cm * 32cm * 32cm / 16.54inch * 12.6inch * 12.6inch Loading Container 20GP: 620 cartons * 360 pcs = 223200 pcs 40HQ: 1439 cartons * 360 pcs = 518040 pcs
75,72 kr
AMAOE Mid Layer Soldering Tool For Huawei Mate60/60 Pro, Model:Mate 60 Mid-frame Mesh Size 0.08
1. Built-in magnetic base securely locks the positioning plate and dedicated middle-layer stencil.2. Enables rapid and precise alignment of solder pads and stencil, effectively reducing manual offset errors, improving ball placement consistency, and enhancing daily work efficiency in the repair workshop.3. High-temperature resistant, suitable for hot air gun reflow soldering.4. Employs gradient temperature hot air heating to complete solder joint reflow molding, specifically designed for Android high-end motherboard layer repair scenarios.5. Compact desktop design, saving repair table space.6. Specifically designed for Huawei Mate60 and Mate60 Pro dual-layer motherboards, effectively solving the ball placement needs of separated dual-layer motherboard interconnection pads during repair work.Specification: Package Weight One Package Weight 0.02kgs / 0.05lb One Package Size 10cm * 10cm * 5cm / 3.94inch * 3.94inch * 1.97inch Qty per Carton 240 Carton Weight 5.80kgs / 12.79lb Carton Size 62cm * 52cm * 42cm / 24.41inch * 20.47inch * 16.54inch Loading Container 20GP: 196 cartons * 240 pcs = 47040 pcs 40HQ: 457 cartons * 240 pcs = 109680 pcs
75,87 kr
AMAOE Mid Layer Soldering Tool For Huawei Mate60/60 Pro, Model:Mate 60 Mid-frame Mesh Size 0.12
1. Built-in magnetic base securely locks the positioning plate and dedicated middle-layer stencil.2. Enables rapid and precise alignment of solder pads and stencil, effectively reducing manual offset errors, improving ball placement consistency, and enhancing daily work efficiency in the repair workshop.3. High-temperature resistant, suitable for hot air gun reflow soldering.4. Employs gradient temperature hot air heating to complete solder joint reflow molding, specifically designed for Android high-end motherboard layer repair scenarios.5. Compact desktop design, saving repair table space.6. Specifically designed for Huawei Mate60 and Mate60 Pro dual-layer motherboards, effectively solving the ball placement needs of separated dual-layer motherboard interconnection pads during repair work.Specification: Package Weight One Package Weight 0.02kgs / 0.05lb One Package Size 10cm * 10cm * 5cm / 3.94inch * 3.94inch * 1.97inch Qty per Carton 240 Carton Weight 5.80kgs / 12.79lb Carton Size 62cm * 52cm * 42cm / 24.41inch * 20.47inch * 16.54inch Loading Container 20GP: 196 cartons * 240 pcs = 47040 pcs 40HQ: 457 cartons * 240 pcs = 109680 pcs
76,02 kr
AMAOE Mid Layer Soldering Tool For Huawei Mate60/60 Pro, Model:Mate 60 Mid-layer Network Board 0.08
1. Built-in magnetic base securely locks the positioning plate and dedicated middle-layer stencil.2. Enables rapid and precise alignment of solder pads and stencil, effectively reducing manual offset errors, improving ball placement consistency, and enhancing daily work efficiency in the repair workshop.3. High-temperature resistant, suitable for hot air gun reflow soldering.4. Employs gradient temperature hot air heating to complete solder joint reflow molding, specifically designed for Android high-end motherboard layer repair scenarios.5. Compact desktop design, saving repair table space.6. Specifically designed for Huawei Mate60 and Mate60 Pro dual-layer motherboards, effectively solving the ball placement needs of separated dual-layer motherboard interconnection pads during repair work.Specification: Package Weight One Package Weight 0.02kgs / 0.05lb One Package Size 10cm * 10cm * 5cm / 3.94inch * 3.94inch * 1.97inch Qty per Carton 240 Carton Weight 5.80kgs / 12.79lb Carton Size 62cm * 52cm * 42cm / 24.41inch * 20.47inch * 16.54inch Loading Container 20GP: 196 cartons * 240 pcs = 47040 pcs 40HQ: 457 cartons * 240 pcs = 109680 pcs
76,02 kr
AMAOE Mid Layer Soldering Tool For Huawei Mate60/60 Pro, Model:Mate 60 Mid-layer Network Board 0.12
1. Built-in magnetic base securely locks the positioning plate and dedicated middle-layer stencil.2. Enables rapid and precise alignment of solder pads and stencil, effectively reducing manual offset errors, improving ball placement consistency, and enhancing daily work efficiency in the repair workshop.3. High-temperature resistant, suitable for hot air gun reflow soldering.4. Employs gradient temperature hot air heating to complete solder joint reflow molding, specifically designed for Android high-end motherboard layer repair scenarios.5. Compact desktop design, saving repair table space.6. Specifically designed for Huawei Mate60 and Mate60 Pro dual-layer motherboards, effectively solving the ball placement needs of separated dual-layer motherboard interconnection pads during repair work.Specification: Package Weight One Package Weight 0.02kgs / 0.05lb One Package Size 10cm * 10cm * 5cm / 3.94inch * 3.94inch * 1.97inch Qty per Carton 240 Carton Weight 5.80kgs / 12.79lb Carton Size 62cm * 52cm * 42cm / 24.41inch * 20.47inch * 16.54inch Loading Container 20GP: 196 cartons * 240 pcs = 47040 pcs 40HQ: 457 cartons * 240 pcs = 109680 pcs
76,02 kr
AMAOE Mid Layer Soldering Tool For Huawei Mate60/60 Pro, Model:Mate 60 Pro Mid-frame Mesh Size 0.08
1. Built-in magnetic base securely locks the positioning plate and dedicated middle-layer stencil.2. Enables rapid and precise alignment of solder pads and stencil, effectively reducing manual offset errors, improving ball placement consistency, and enhancing daily work efficiency in the repair workshop.3. High-temperature resistant, suitable for hot air gun reflow soldering.4. Employs gradient temperature hot air heating to complete solder joint reflow molding, specifically designed for Android high-end motherboard layer repair scenarios.5. Compact desktop design, saving repair table space.6. Specifically designed for Huawei Mate60 and Mate60 Pro dual-layer motherboards, effectively solving the ball placement needs of separated dual-layer motherboard interconnection pads during repair work.Specification: Package Weight One Package Weight 0.02kgs / 0.05lb One Package Size 10cm * 10cm * 5cm / 3.94inch * 3.94inch * 1.97inch Qty per Carton 240 Carton Weight 5.80kgs / 12.79lb Carton Size 62cm * 52cm * 42cm / 24.41inch * 20.47inch * 16.54inch Loading Container 20GP: 196 cartons * 240 pcs = 47040 pcs 40HQ: 457 cartons * 240 pcs = 109680 pcs
75,87 kr
AMAOE Mid Layer Soldering Tool For Huawei Mate60/60 Pro, Model:Mate 60 Pro Mid-frame Mesh Size 0.12
1. Built-in magnetic base securely locks the positioning plate and dedicated middle-layer stencil.2. Enables rapid and precise alignment of solder pads and stencil, effectively reducing manual offset errors, improving ball placement consistency, and enhancing daily work efficiency in the repair workshop.3. High-temperature resistant, suitable for hot air gun reflow soldering.4. Employs gradient temperature hot air heating to complete solder joint reflow molding, specifically designed for Android high-end motherboard layer repair scenarios.5. Compact desktop design, saving repair table space.6. Specifically designed for Huawei Mate60 and Mate60 Pro dual-layer motherboards, effectively solving the ball placement needs of separated dual-layer motherboard interconnection pads during repair work.Specification: Package Weight One Package Weight 0.02kgs / 0.05lb One Package Size 10cm * 10cm * 5cm / 3.94inch * 3.94inch * 1.97inch Qty per Carton 240 Carton Weight 5.80kgs / 12.79lb Carton Size 62cm * 52cm * 42cm / 24.41inch * 20.47inch * 16.54inch Loading Container 20GP: 196 cartons * 240 pcs = 47040 pcs 40HQ: 457 cartons * 240 pcs = 109680 pcs
75,87 kr
AMAOE Mid Layer Soldering Tool For Huawei Mate60/60 Pro, Model:Mate 60 Pro Mid-layer Mesh Board 0.08
1. Built-in magnetic base securely locks the positioning plate and dedicated middle-layer stencil.2. Enables rapid and precise alignment of solder pads and stencil, effectively reducing manual offset errors, improving ball placement consistency, and enhancing daily work efficiency in the repair workshop.3. High-temperature resistant, suitable for hot air gun reflow soldering.4. Employs gradient temperature hot air heating to complete solder joint reflow molding, specifically designed for Android high-end motherboard layer repair scenarios.5. Compact desktop design, saving repair table space.6. Specifically designed for Huawei Mate60 and Mate60 Pro dual-layer motherboards, effectively solving the ball placement needs of separated dual-layer motherboard interconnection pads during repair work.Specification: Package Weight One Package Weight 0.02kgs / 0.05lb One Package Size 10cm * 10cm * 5cm / 3.94inch * 3.94inch * 1.97inch Qty per Carton 240 Carton Weight 5.80kgs / 12.79lb Carton Size 62cm * 52cm * 42cm / 24.41inch * 20.47inch * 16.54inch Loading Container 20GP: 196 cartons * 240 pcs = 47040 pcs 40HQ: 457 cartons * 240 pcs = 109680 pcs
76,02 kr
AMAOE Mid Layer Soldering Tool For Huawei Mate60/60 Pro, Model:Mate 60 Pro Mid-layer Mesh Board 0.12
1. Built-in magnetic base securely locks the positioning plate and dedicated middle-layer stencil.2. Enables rapid and precise alignment of solder pads and stencil, effectively reducing manual offset errors, improving ball placement consistency, and enhancing daily work efficiency in the repair workshop.3. High-temperature resistant, suitable for hot air gun reflow soldering.4. Employs gradient temperature hot air heating to complete solder joint reflow molding, specifically designed for Android high-end motherboard layer repair scenarios.5. Compact desktop design, saving repair table space.6. Specifically designed for Huawei Mate60 and Mate60 Pro dual-layer motherboards, effectively solving the ball placement needs of separated dual-layer motherboard interconnection pads during repair work.Specification: Package Weight One Package Weight 0.02kgs / 0.05lb One Package Size 10cm * 10cm * 5cm / 3.94inch * 3.94inch * 1.97inch Qty per Carton 240 Carton Weight 5.80kgs / 12.79lb Carton Size 62cm * 52cm * 42cm / 24.41inch * 20.47inch * 16.54inch Loading Container 20GP: 196 cartons * 240 pcs = 47040 pcs 40HQ: 457 cartons * 240 pcs = 109680 pcs
75,87 kr
AMAOE RTX3080Ti Laptop Mobile Version Soldering Station, Model:Plant Tin Network
1. Built-in magnetic base securely locks the positioning frame and stencil, enabling quick and precise alignment of the chip and stencil, preventing misalignment during ball placement.2. Compatible with two common rework processes: applying solder paste or directly placing solder balls.3. The stainless steel stencil can withstand direct heat from a hot air gun, and the robust clamping base ensures stability on the repair bench.4. Compact desktop design, ideal for laptop motherboard maintenance, GPU chip rework, and high-volume repair work.5. Specifically designed for laptop mobile RTX 3080 Ti GN20-E8 graphics chips.Specification: Package Weight One Package Weight 0.03kgs / 0.07lb One Package Size 10cm * 10cm * 5cm / 3.94inch * 3.94inch * 1.97inch Qty per Carton 240 Carton Weight 8.20kgs / 18.08lb Carton Size 62cm * 52cm * 42cm / 24.41inch * 20.47inch * 16.54inch Loading Container 20GP: 196 cartons * 240 pcs = 47040 pcs 40HQ: 457 cartons * 240 pcs = 109680 pcs
101,87 kr
AMAOE RTX3080Ti Laptop Mobile Version Soldering Station, Model:Plantation
1. Built-in magnetic base securely locks the positioning frame and stencil, enabling quick and precise alignment of the chip and stencil, preventing misalignment during ball placement.2. Compatible with two common rework processes: applying solder paste or directly placing solder balls.3. The stainless steel stencil can withstand direct heat from a hot air gun, and the robust clamping base ensures stability on the repair bench.4. Compact desktop design, ideal for laptop motherboard maintenance, GPU chip rework, and high-volume repair work.5. Specifically designed for laptop mobile RTX 3080 Ti GN20-E8 graphics chips.Specification: Package Weight One Package Weight 0.03kgs / 0.07lb One Package Size 10cm * 10cm * 5cm / 3.94inch * 3.94inch * 1.97inch Qty per Carton 240 Carton Weight 8.20kgs / 18.08lb Carton Size 62cm * 52cm * 42cm / 24.41inch * 20.47inch * 16.54inch Loading Container 20GP: 196 cartons * 240 pcs = 47040 pcs 40HQ: 457 cartons * 240 pcs = 109680 pcs
463,60 kr
AMAOE RTX3080Ti Laptop Mobile Version Soldering Station, Model:Positioning Plate
1. Built-in magnetic base securely locks the positioning frame and stencil, enabling quick and precise alignment of the chip and stencil, preventing misalignment during ball placement.2. Compatible with two common rework processes: applying solder paste or directly placing solder balls.3. The stainless steel stencil can withstand direct heat from a hot air gun, and the robust clamping base ensures stability on the repair bench.4. Compact desktop design, ideal for laptop motherboard maintenance, GPU chip rework, and high-volume repair work.5. Specifically designed for laptop mobile RTX 3080 Ti GN20-E8 graphics chips.Specification: Package Weight One Package Weight 0.03kgs / 0.07lb One Package Size 10cm * 10cm * 5cm / 3.94inch * 3.94inch * 1.97inch Qty per Carton 240 Carton Weight 8.20kgs / 18.08lb Carton Size 62cm * 52cm * 42cm / 24.41inch * 20.47inch * 16.54inch Loading Container 20GP: 196 cartons * 240 pcs = 47040 pcs 40HQ: 457 cartons * 240 pcs = 109680 pcs
197,56 kr
AMAOE S938 Mid Layer Tin Plating Tool For Galaxy S25 Ultra, Model:Full Set
1. Specialized repair tool designed for mid-layer tin plating work on the S25 Ultra.2. Facilitates precise solder plating and restoration during advanced smartphone motherboard repair.3. Helps technicians perform controlled tin plating work on fine motherboard areas and connection points.4. Suitable for professional technicians handling PCB repair, solder restoration and component-level maintenance.5. A practical tool for mobile phone repair shops, motherboard technicians and electronics repair workstations.6. Note: Only for Samsung Galaxy S25 Ultra.Specification: Package Weight One Package Weight 0.05kgs / 0.12lb One Package Size 10cm * 10cm * 5cm / 3.94inch * 3.94inch * 1.97inch Qty per Carton 160 Carton Weight 9.00kgs / 19.84lb Carton Size 42cm * 42cm * 52cm / 16.54inch * 16.54inch * 20.47inch Loading Container 20GP: 290 cartons * 160 pcs = 46400 pcs 40HQ: 674 cartons * 160 pcs = 107840 pcs
398,94 kr
AMAOE S938 Mid Layer Tin Plating Tool For Galaxy S25 Ultra, Model:Only Base
1. Specialized repair tool designed for mid-layer tin plating work on the S25 Ultra.2. Facilitates precise solder plating and restoration during advanced smartphone motherboard repair.3. Helps technicians perform controlled tin plating work on fine motherboard areas and connection points.4. Suitable for professional technicians handling PCB repair, solder restoration and component-level maintenance.5. A practical tool for mobile phone repair shops, motherboard technicians and electronics repair workstations.6. Note: Only for Samsung Galaxy S25 Ultra.Specification: Package Weight One Package Weight 0.05kgs / 0.12lb One Package Size 10cm * 10cm * 5cm / 3.94inch * 3.94inch * 1.97inch Qty per Carton 160 Carton Weight 9.00kgs / 19.84lb Carton Size 42cm * 42cm * 52cm / 16.54inch * 16.54inch * 20.47inch Loading Container 20GP: 290 cartons * 160 pcs = 46400 pcs 40HQ: 674 cartons * 160 pcs = 107840 pcs
256,12 kr
AMAOE S938 Mid Layer Tin Plating Tool For Galaxy S25 Ultra, Model:Only Stencil
1. Specialized repair tool designed for mid-layer tin plating work on the S25 Ultra.2. Facilitates precise solder plating and restoration during advanced smartphone motherboard repair.3. Helps technicians perform controlled tin plating work on fine motherboard areas and connection points.4. Suitable for professional technicians handling PCB repair, solder restoration and component-level maintenance.5. A practical tool for mobile phone repair shops, motherboard technicians and electronics repair workstations.6. Note: Only for Samsung Galaxy S25 Ultra.Specification: Package Weight One Package Weight 0.05kgs / 0.12lb One Package Size 10cm * 10cm * 5cm / 3.94inch * 3.94inch * 1.97inch Qty per Carton 160 Carton Weight 9.00kgs / 19.84lb Carton Size 42cm * 42cm * 52cm / 16.54inch * 16.54inch * 20.47inch Loading Container 20GP: 290 cartons * 160 pcs = 46400 pcs 40HQ: 674 cartons * 160 pcs = 107840 pcs
79,22 kr
AMAOE S938 Mid Layer Tin Plating Tool For Galaxy S25 Ultra, Model:Positioning Plate
1. Specialized repair tool designed for mid-layer tin plating work on the S25 Ultra.2. Facilitates precise solder plating and restoration during advanced smartphone motherboard repair.3. Helps technicians perform controlled tin plating work on fine motherboard areas and connection points.4. Suitable for professional technicians handling PCB repair, solder restoration and component-level maintenance.5. A practical tool for mobile phone repair shops, motherboard technicians and electronics repair workstations.6. Note: Only for Samsung Galaxy S25 Ultra.Specification: Package Weight One Package Weight 0.05kgs / 0.12lb One Package Size 10cm * 10cm * 5cm / 3.94inch * 3.94inch * 1.97inch Qty per Carton 160 Carton Weight 9.00kgs / 19.84lb Carton Size 42cm * 42cm * 52cm / 16.54inch * 16.54inch * 20.47inch Loading Container 20GP: 290 cartons * 160 pcs = 46400 pcs 40HQ: 674 cartons * 160 pcs = 107840 pcs
164,77 kr
AMAOE Soldering Tool, Model:CXD90060GG Positioning Plate
1. Built-in magnetic base securely locks the positioning plate and dedicated middle-layer stencil.2. Enables rapid and precise alignment of solder pads and stencil, effectively reducing manual offset errors, improving ball placement consistency, and enhancing daily work efficiency in the repair workshop.3. High-temperature resistant, suitable for hot air gun reflow soldering.4. Employs gradient temperature hot air heating to complete solder joint reflow molding, specifically designed for Android high-end motherboard layer repair scenarios.5. Compact desktop design, saving repair table space.Specification: Package Weight One Package Weight 0.05kgs / 0.12lb One Package Size 10cm * 10cm * 5cm / 3.94inch * 3.94inch * 1.97inch Qty per Carton 240 Carton Weight 13.00kgs / 28.66lb Carton Size 62cm * 52cm * 42cm / 24.41inch * 20.47inch * 16.54inch Loading Container 20GP: 196 cartons * 240 pcs = 47040 pcs 40HQ: 457 cartons * 240 pcs = 109680 pcs
175,83 kr
AMAOE Soldering Tool, Model:CXD90060GG Stencil
1. Built-in magnetic base securely locks the positioning plate and dedicated middle-layer stencil.2. Enables rapid and precise alignment of solder pads and stencil, effectively reducing manual offset errors, improving ball placement consistency, and enhancing daily work efficiency in the repair workshop.3. High-temperature resistant, suitable for hot air gun reflow soldering.4. Employs gradient temperature hot air heating to complete solder joint reflow molding, specifically designed for Android high-end motherboard layer repair scenarios.5. Compact desktop design, saving repair table space.Specification: Package Weight One Package Weight 0.05kgs / 0.12lb One Package Size 10cm * 10cm * 5cm / 3.94inch * 3.94inch * 1.97inch Qty per Carton 240 Carton Weight 13.00kgs / 28.66lb Carton Size 62cm * 52cm * 42cm / 24.41inch * 20.47inch * 16.54inch Loading Container 20GP: 196 cartons * 240 pcs = 47040 pcs 40HQ: 457 cartons * 240 pcs = 109680 pcs
102,02 kr
AMAOE Soldering Tool, Model:CXD90060GG Tin Plant
1. Built-in magnetic base securely locks the positioning plate and dedicated middle-layer stencil.2. Enables rapid and precise alignment of solder pads and stencil, effectively reducing manual offset errors, improving ball placement consistency, and enhancing daily work efficiency in the repair workshop.3. High-temperature resistant, suitable for hot air gun reflow soldering.4. Employs gradient temperature hot air heating to complete solder joint reflow molding, specifically designed for Android high-end motherboard layer repair scenarios.5. Compact desktop design, saving repair table space.Specification: Package Weight One Package Weight 0.05kgs / 0.12lb One Package Size 10cm * 10cm * 5cm / 3.94inch * 3.94inch * 1.97inch Qty per Carton 240 Carton Weight 13.00kgs / 28.66lb Carton Size 62cm * 52cm * 42cm / 24.41inch * 20.47inch * 16.54inch Loading Container 20GP: 196 cartons * 240 pcs = 47040 pcs 40HQ: 457 cartons * 240 pcs = 109680 pcs
438,51 kr
AMAOE Soldering Tool, Model:CXD90061GG Planting Tin Network
1. Built-in magnetic base securely locks the positioning plate and dedicated middle-layer stencil.2. Enables rapid and precise alignment of solder pads and stencil, effectively reducing manual offset errors, improving ball placement consistency, and enhancing daily work efficiency in the repair workshop.3. High-temperature resistant, suitable for hot air gun reflow soldering.4. Employs gradient temperature hot air heating to complete solder joint reflow molding, specifically designed for Android high-end motherboard layer repair scenarios.5. Compact desktop design, saving repair table space.Specification: Package Weight One Package Weight 0.05kgs / 0.12lb One Package Size 10cm * 10cm * 5cm / 3.94inch * 3.94inch * 1.97inch Qty per Carton 240 Carton Weight 13.00kgs / 28.66lb Carton Size 62cm * 52cm * 42cm / 24.41inch * 20.47inch * 16.54inch Loading Container 20GP: 196 cartons * 240 pcs = 47040 pcs 40HQ: 457 cartons * 240 pcs = 109680 pcs
101,87 kr
AMAOE Soldering Tool, Model:CXD90061GG Tin Plant
1. Built-in magnetic base securely locks the positioning plate and dedicated middle-layer stencil.2. Enables rapid and precise alignment of solder pads and stencil, effectively reducing manual offset errors, improving ball placement consistency, and enhancing daily work efficiency in the repair workshop.3. High-temperature resistant, suitable for hot air gun reflow soldering.4. Employs gradient temperature hot air heating to complete solder joint reflow molding, specifically designed for Android high-end motherboard layer repair scenarios.5. Compact desktop design, saving repair table space.Specification: Package Weight One Package Weight 0.05kgs / 0.12lb One Package Size 10cm * 10cm * 5cm / 3.94inch * 3.94inch * 1.97inch Qty per Carton 240 Carton Weight 13.00kgs / 28.66lb Carton Size 62cm * 52cm * 42cm / 24.41inch * 20.47inch * 16.54inch Loading Container 20GP: 196 cartons * 240 pcs = 47040 pcs 40HQ: 457 cartons * 240 pcs = 109680 pcs
175,98 kr
AMAOE Soldering Tool, Model:CXD90061GG Tin Planting Platform
1. Built-in magnetic base securely locks the positioning plate and dedicated middle-layer stencil.2. Enables rapid and precise alignment of solder pads and stencil, effectively reducing manual offset errors, improving ball placement consistency, and enhancing daily work efficiency in the repair workshop.3. High-temperature resistant, suitable for hot air gun reflow soldering.4. Employs gradient temperature hot air heating to complete solder joint reflow molding, specifically designed for Android high-end motherboard layer repair scenarios.5. Compact desktop design, saving repair table space.Specification: Package Weight One Package Weight 0.05kgs / 0.12lb One Package Size 10cm * 10cm * 5cm / 3.94inch * 3.94inch * 1.97inch Qty per Carton 240 Carton Weight 13.00kgs / 28.66lb Carton Size 62cm * 52cm * 42cm / 24.41inch * 20.47inch * 16.54inch Loading Container 20GP: 196 cartons * 240 pcs = 47040 pcs 40HQ: 457 cartons * 240 pcs = 109680 pcs
412,97 kr
AMAOE Soldering Tool, Model:CXD90062GG Planting Tin Network
1. Built-in magnetic base securely locks the positioning plate and dedicated middle-layer stencil.2. Enables rapid and precise alignment of solder pads and stencil, effectively reducing manual offset errors, improving ball placement consistency, and enhancing daily work efficiency in the repair workshop.3. High-temperature resistant, suitable for hot air gun reflow soldering.4. Employs gradient temperature hot air heating to complete solder joint reflow molding, specifically designed for Android high-end motherboard layer repair scenarios.5. Compact desktop design, saving repair table space.Specification: Package Weight One Package Weight 0.05kgs / 0.12lb One Package Size 10cm * 10cm * 5cm / 3.94inch * 3.94inch * 1.97inch Qty per Carton 240 Carton Weight 13.00kgs / 28.66lb Carton Size 62cm * 52cm * 42cm / 24.41inch * 20.47inch * 16.54inch Loading Container 20GP: 196 cartons * 240 pcs = 47040 pcs 40HQ: 457 cartons * 240 pcs = 109680 pcs
102,02 kr
AMAOE Soldering Tool, Model:CXD90062GG Positioning Plate
1. Built-in magnetic base securely locks the positioning plate and dedicated middle-layer stencil.2. Enables rapid and precise alignment of solder pads and stencil, effectively reducing manual offset errors, improving ball placement consistency, and enhancing daily work efficiency in the repair workshop.3. High-temperature resistant, suitable for hot air gun reflow soldering.4. Employs gradient temperature hot air heating to complete solder joint reflow molding, specifically designed for Android high-end motherboard layer repair scenarios.5. Compact desktop design, saving repair table space.Specification: Package Weight One Package Weight 0.05kgs / 0.12lb One Package Size 10cm * 10cm * 5cm / 3.94inch * 3.94inch * 1.97inch Qty per Carton 240 Carton Weight 13.00kgs / 28.66lb Carton Size 62cm * 52cm * 42cm / 24.41inch * 20.47inch * 16.54inch Loading Container 20GP: 196 cartons * 240 pcs = 47040 pcs 40HQ: 457 cartons * 240 pcs = 109680 pcs
175,98 kr
AMAOE Soldering Tool, Model:CXD90062GG Tin Planting Platform
1. Built-in magnetic base securely locks the positioning plate and dedicated middle-layer stencil.2. Enables rapid and precise alignment of solder pads and stencil, effectively reducing manual offset errors, improving ball placement consistency, and enhancing daily work efficiency in the repair workshop.3. High-temperature resistant, suitable for hot air gun reflow soldering.4. Employs gradient temperature hot air heating to complete solder joint reflow molding, specifically designed for Android high-end motherboard layer repair scenarios.5. Compact desktop design, saving repair table space.Specification: Package Weight One Package Weight 0.05kgs / 0.12lb One Package Size 10cm * 10cm * 5cm / 3.94inch * 3.94inch * 1.97inch Qty per Carton 240 Carton Weight 13.00kgs / 28.66lb Carton Size 62cm * 52cm * 42cm / 24.41inch * 20.47inch * 16.54inch Loading Container 20GP: 196 cartons * 240 pcs = 47040 pcs 40HQ: 457 cartons * 240 pcs = 109680 pcs
412,51 kr
AMAOE Soldering Tool, Model:Double Magnet Base
1. Built-in magnetic base securely locks the positioning plate and dedicated middle-layer stencil.2. Enables rapid and precise alignment of solder pads and stencil, effectively reducing manual offset errors, improving ball placement consistency, and enhancing daily work efficiency in the repair workshop.3. High-temperature resistant, suitable for hot air gun reflow soldering.4. Employs gradient temperature hot air heating to complete solder joint reflow molding, specifically designed for Android high-end motherboard layer repair scenarios.5. Compact desktop design, saving repair table space.Specification: Package Weight One Package Weight 0.05kgs / 0.12lb One Package Size 10cm * 10cm * 5cm / 3.94inch * 3.94inch * 1.97inch Qty per Carton 240 Carton Weight 13.00kgs / 28.66lb Carton Size 62cm * 52cm * 42cm / 24.41inch * 20.47inch * 16.54inch Loading Container 20GP: 196 cartons * 240 pcs = 47040 pcs 40HQ: 457 cartons * 240 pcs = 109680 pcs
224,55 kr
AMAOE Tin Plating Tool, Model:A18/18Pro/A19 Upper-layer RAM
1. Designed specifically for reinstalling CPU, RAM, NAND flash memory, and other BGA-packaged chips on smartphone motherboards.2. Built-in magnetic base securely holds the positioning plate and stencil, enabling fast and accurate chip stencil alignment.3. Excellent high-temperature resistance, suitable for hot air gun reflow soldering.4. Helps form uniform, rounded solder balls, reducing the risk of bridging or missing solder balls.5. Suitable for high-volume chip refurbishment in repair shops.6. Compact desktop design, for mobile phone repair shops and repair labs.Specification: Package Weight One Package Weight 0.03kgs / 0.07lb One Package Size 10cm * 10cm * 5cm / 3.94inch * 3.94inch * 1.97inch Qty per Carton 160 Carton Weight 5.80kgs / 12.79lb Carton Size 52cm * 42cm * 42cm / 20.47inch * 16.54inch * 16.54inch Loading Container 20GP: 290 cartons * 160 pcs = 46400 pcs 40HQ: 674 cartons * 160 pcs = 107840 pcs
78,92 kr
AMAOE Tin Plating Tool, Model:A19 Lower Half-Engraving Edition
1. Designed specifically for reinstalling CPU, RAM, NAND flash memory, and other BGA-packaged chips on smartphone motherboards.2. Built-in magnetic base securely holds the positioning plate and stencil, enabling fast and accurate chip stencil alignment.3. Excellent high-temperature resistance, suitable for hot air gun reflow soldering.4. Helps form uniform, rounded solder balls, reducing the risk of bridging or missing solder balls.5. Suitable for high-volume chip refurbishment in repair shops.6. Compact desktop design, for mobile phone repair shops and repair labs.Specification: Package Weight One Package Weight 0.03kgs / 0.07lb One Package Size 10cm * 10cm * 5cm / 3.94inch * 3.94inch * 1.97inch Qty per Carton 160 Carton Weight 5.80kgs / 12.79lb Carton Size 52cm * 42cm * 42cm / 20.47inch * 16.54inch * 16.54inch Loading Container 20GP: 290 cartons * 160 pcs = 46400 pcs 40HQ: 674 cartons * 160 pcs = 107840 pcs
79,38 kr
AMAOE Tin Plating Tool, Model:A19 Lower Layer Engraved Plate
1. Designed specifically for reinstalling CPU, RAM, NAND flash memory, and other BGA-packaged chips on smartphone motherboards.2. Built-in magnetic base securely holds the positioning plate and stencil, enabling fast and accurate chip stencil alignment.3. Excellent high-temperature resistance, suitable for hot air gun reflow soldering.4. Helps form uniform, rounded solder balls, reducing the risk of bridging or missing solder balls.5. Suitable for high-volume chip refurbishment in repair shops.6. Compact desktop design, for mobile phone repair shops and repair labs.Specification: Package Weight One Package Weight 0.03kgs / 0.07lb One Package Size 10cm * 10cm * 5cm / 3.94inch * 3.94inch * 1.97inch Qty per Carton 160 Carton Weight 5.80kgs / 12.79lb Carton Size 52cm * 42cm * 42cm / 20.47inch * 16.54inch * 16.54inch Loading Container 20GP: 290 cartons * 160 pcs = 46400 pcs 40HQ: 674 cartons * 160 pcs = 107840 pcs
79,38 kr
AMAOE Tin Plating Tool, Model:A19 Pro Lower Half-Engraving
1. Designed specifically for reinstalling CPU, RAM, NAND flash memory, and other BGA-packaged chips on smartphone motherboards.2. Built-in magnetic base securely holds the positioning plate and stencil, enabling fast and accurate chip stencil alignment.3. Excellent high-temperature resistance, suitable for hot air gun reflow soldering.4. Helps form uniform, rounded solder balls, reducing the risk of bridging or missing solder balls.5. Suitable for high-volume chip refurbishment in repair shops.6. Compact desktop design, for mobile phone repair shops and repair labs.Specification: Package Weight One Package Weight 0.03kgs / 0.07lb One Package Size 10cm * 10cm * 5cm / 3.94inch * 3.94inch * 1.97inch Qty per Carton 160 Carton Weight 5.80kgs / 12.79lb Carton Size 52cm * 42cm * 42cm / 20.47inch * 16.54inch * 16.54inch Loading Container 20GP: 290 cartons * 160 pcs = 46400 pcs 40HQ: 674 cartons * 160 pcs = 107840 pcs
79,38 kr
AMAOE Tin Plating Tool, Model:A19 Pro Lower Layer Engraving
1. Designed specifically for reinstalling CPU, RAM, NAND flash memory, and other BGA-packaged chips on smartphone motherboards.2. Built-in magnetic base securely holds the positioning plate and stencil, enabling fast and accurate chip stencil alignment.3. Excellent high-temperature resistance, suitable for hot air gun reflow soldering.4. Helps form uniform, rounded solder balls, reducing the risk of bridging or missing solder balls.5. Suitable for high-volume chip refurbishment in repair shops.6. Compact desktop design, for mobile phone repair shops and repair labs.Specification: Package Weight One Package Weight 0.03kgs / 0.07lb One Package Size 10cm * 10cm * 5cm / 3.94inch * 3.94inch * 1.97inch Qty per Carton 160 Carton Weight 5.80kgs / 12.79lb Carton Size 52cm * 42cm * 42cm / 20.47inch * 16.54inch * 16.54inch Loading Container 20GP: 290 cartons * 160 pcs = 46400 pcs 40HQ: 674 cartons * 160 pcs = 107840 pcs
79,22 kr
AMAOE Tin Plating Tool, Model:A19 Pro Upper-layer RAM
1. Designed specifically for reinstalling CPU, RAM, NAND flash memory, and other BGA-packaged chips on smartphone motherboards.2. Built-in magnetic base securely holds the positioning plate and stencil, enabling fast and accurate chip stencil alignment.3. Excellent high-temperature resistance, suitable for hot air gun reflow soldering.4. Helps form uniform, rounded solder balls, reducing the risk of bridging or missing solder balls.5. Suitable for high-volume chip refurbishment in repair shops.6. Compact desktop design, for mobile phone repair shops and repair labs.Specification: Package Weight One Package Weight 0.03kgs / 0.07lb One Package Size 10cm * 10cm * 5cm / 3.94inch * 3.94inch * 1.97inch Qty per Carton 160 Carton Weight 5.80kgs / 12.79lb Carton Size 52cm * 42cm * 42cm / 20.47inch * 16.54inch * 16.54inch Loading Container 20GP: 290 cartons * 160 pcs = 46400 pcs 40HQ: 674 cartons * 160 pcs = 107840 pcs
78,92 kr
AMAOE Tin Plating Tool, Model:A19/Pro 1 Board 2 Mesh Half-cut
1. Designed specifically for reinstalling CPU, RAM, NAND flash memory, and other BGA-packaged chips on smartphone motherboards.2. Built-in magnetic base securely holds the positioning plate and stencil, enabling fast and accurate chip stencil alignment.3. Excellent high-temperature resistance, suitable for hot air gun reflow soldering.4. Helps form uniform, rounded solder balls, reducing the risk of bridging or missing solder balls.5. Suitable for high-volume chip refurbishment in repair shops.6. Compact desktop design, for mobile phone repair shops and repair labs.Specification: Package Weight One Package Weight 0.03kgs / 0.07lb One Package Size 10cm * 10cm * 5cm / 3.94inch * 3.94inch * 1.97inch Qty per Carton 160 Carton Weight 5.80kgs / 12.79lb Carton Size 52cm * 42cm * 42cm / 20.47inch * 16.54inch * 16.54inch Loading Container 20GP: 290 cartons * 160 pcs = 46400 pcs 40HQ: 674 cartons * 160 pcs = 107840 pcs
201,60 kr
AMAOE Tin Plating Tool, Model:A19/Pro 1 Board 2 Mesh Printing
1. Designed specifically for reinstalling CPU, RAM, NAND flash memory, and other BGA-packaged chips on smartphone motherboards.2. Built-in magnetic base securely holds the positioning plate and stencil, enabling fast and accurate chip stencil alignment.3. Excellent high-temperature resistance, suitable for hot air gun reflow soldering.4. Helps form uniform, rounded solder balls, reducing the risk of bridging or missing solder balls.5. Suitable for high-volume chip refurbishment in repair shops.6. Compact desktop design, for mobile phone repair shops and repair labs.Specification: Package Weight One Package Weight 0.03kgs / 0.07lb One Package Size 10cm * 10cm * 5cm / 3.94inch * 3.94inch * 1.97inch Qty per Carton 160 Carton Weight 5.80kgs / 12.79lb Carton Size 52cm * 42cm * 42cm / 20.47inch * 16.54inch * 16.54inch Loading Container 20GP: 290 cartons * 160 pcs = 46400 pcs 40HQ: 674 cartons * 160 pcs = 107840 pcs
201,60 kr
AMAOE Tin Plating Tool, Model:A19/Pro Plating Stand Half-Cut
1. Designed specifically for reinstalling CPU, RAM, NAND flash memory, and other BGA-packaged chips on smartphone motherboards.2. Built-in magnetic base securely holds the positioning plate and stencil, enabling fast and accurate chip stencil alignment.3. Excellent high-temperature resistance, suitable for hot air gun reflow soldering.4. Helps form uniform, rounded solder balls, reducing the risk of bridging or missing solder balls.5. Suitable for high-volume chip refurbishment in repair shops.6. Compact desktop design, for mobile phone repair shops and repair labs.Specification: Package Weight One Package Weight 0.03kgs / 0.07lb One Package Size 10cm * 10cm * 5cm / 3.94inch * 3.94inch * 1.97inch Qty per Carton 160 Carton Weight 5.80kgs / 12.79lb Carton Size 52cm * 42cm * 42cm / 20.47inch * 16.54inch * 16.54inch Loading Container 20GP: 290 cartons * 160 pcs = 46400 pcs 40HQ: 674 cartons * 160 pcs = 107840 pcs
359,06 kr
AMAOE Tin Plating Tool, Model:A19/Pro Plating Station Engraving
1. Designed specifically for reinstalling CPU, RAM, NAND flash memory, and other BGA-packaged chips on smartphone motherboards.2. Built-in magnetic base securely holds the positioning plate and stencil, enabling fast and accurate chip stencil alignment.3. Excellent high-temperature resistance, suitable for hot air gun reflow soldering.4. Helps form uniform, rounded solder balls, reducing the risk of bridging or missing solder balls.5. Suitable for high-volume chip refurbishment in repair shops.6. Compact desktop design, for mobile phone repair shops and repair labs.Specification: Package Weight One Package Weight 0.03kgs / 0.07lb One Package Size 10cm * 10cm * 5cm / 3.94inch * 3.94inch * 1.97inch Qty per Carton 160 Carton Weight 5.80kgs / 12.79lb Carton Size 52cm * 42cm * 42cm / 20.47inch * 16.54inch * 16.54inch Loading Container 20GP: 290 cartons * 160 pcs = 46400 pcs 40HQ: 674 cartons * 160 pcs = 107840 pcs
359,06 kr