Products

1. Built-in magnetic base securely locks the positioning plate and dedicated middle-layer stencil.2. Enables rapid and precise alignment of solder pads and stencil, effectively reducing manual offset errors, improving ball placement consistency, and enhancing daily work efficiency in the repair workshop.3. High-temperature resistant, suitable for hot air gun reflow soldering.4. Employs gradient temperature hot air heating to complete solder joint reflow molding, specifically designed for Android high-end motherboard layer repair scenarios.5. Compact desktop design, saving repair table space.6. Specifically designed for Huawei Mate60 and Mate60 Pro dual-layer motherboards, effectively solving the ball placement needs of separated dual-layer motherboard interconnection pads during repair work.Specification: Package Weight One Package Weight 0.02kgs / 0.05lb One Package Size 10cm * 10cm * 5cm / 3.94inch * 3.94inch * 1.97inch Qty per Carton 240 Carton Weight 5.80kgs / 12.79lb Carton Size 62cm * 52cm * 42cm / 24.41inch * 20.47inch * 16.54inch Loading Container 20GP: 196 cartons * 240 pcs = 47040 pcs 40HQ: 457 cartons * 240 pcs = 109680 pcs

Read more less

1. Built-in magnetic base securely locks the positioning frame and stencil, enabling quick and precise alignment of the chip and stencil, preventing misalignment during ball placement.2. Compatible with two common rework processes: applying solder paste or directly placing solder balls.3. The stainless steel stencil can withstand direct heat from a hot air gun, and the robust clamping base ensures stability on the repair bench.4. Compact desktop design, ideal for laptop motherboard maintenance, GPU chip rework, and high-volume repair work.5. Specifically designed for laptop mobile RTX 3080 Ti GN20-E8 graphics chips.Specification: Package Weight One Package Weight 0.03kgs / 0.07lb One Package Size 10cm * 10cm * 5cm / 3.94inch * 3.94inch * 1.97inch Qty per Carton 240 Carton Weight 8.20kgs / 18.08lb Carton Size 62cm * 52cm * 42cm / 24.41inch * 20.47inch * 16.54inch Loading Container 20GP: 196 cartons * 240 pcs = 47040 pcs 40HQ: 457 cartons * 240 pcs = 109680 pcs

Read more less

1. Built-in magnetic base securely locks the positioning frame and stencil, enabling quick and precise alignment of the chip and stencil, preventing misalignment during ball placement.2. Compatible with two common rework processes: applying solder paste or directly placing solder balls.3. The stainless steel stencil can withstand direct heat from a hot air gun, and the robust clamping base ensures stability on the repair bench.4. Compact desktop design, ideal for laptop motherboard maintenance, GPU chip rework, and high-volume repair work.5. Specifically designed for laptop mobile RTX 3080 Ti GN20-E8 graphics chips.Specification: Package Weight One Package Weight 0.03kgs / 0.07lb One Package Size 10cm * 10cm * 5cm / 3.94inch * 3.94inch * 1.97inch Qty per Carton 240 Carton Weight 8.20kgs / 18.08lb Carton Size 62cm * 52cm * 42cm / 24.41inch * 20.47inch * 16.54inch Loading Container 20GP: 196 cartons * 240 pcs = 47040 pcs 40HQ: 457 cartons * 240 pcs = 109680 pcs

Read more less

1. Built-in magnetic base securely locks the positioning frame and stencil, enabling quick and precise alignment of the chip and stencil, preventing misalignment during ball placement.2. Compatible with two common rework processes: applying solder paste or directly placing solder balls.3. The stainless steel stencil can withstand direct heat from a hot air gun, and the robust clamping base ensures stability on the repair bench.4. Compact desktop design, ideal for laptop motherboard maintenance, GPU chip rework, and high-volume repair work.5. Specifically designed for laptop mobile RTX 3080 Ti GN20-E8 graphics chips.Specification: Package Weight One Package Weight 0.03kgs / 0.07lb One Package Size 10cm * 10cm * 5cm / 3.94inch * 3.94inch * 1.97inch Qty per Carton 240 Carton Weight 8.20kgs / 18.08lb Carton Size 62cm * 52cm * 42cm / 24.41inch * 20.47inch * 16.54inch Loading Container 20GP: 196 cartons * 240 pcs = 47040 pcs 40HQ: 457 cartons * 240 pcs = 109680 pcs

Read more less

1. Specialized repair tool designed for mid-layer tin plating work on the S25 Ultra.2. Facilitates precise solder plating and restoration during advanced smartphone motherboard repair.3. Helps technicians perform controlled tin plating work on fine motherboard areas and connection points.4. Suitable for professional technicians handling PCB repair, solder restoration and component-level maintenance.5. A practical tool for mobile phone repair shops, motherboard technicians and electronics repair workstations.6. Note: Only for Samsung Galaxy S25 Ultra.Specification: Package Weight One Package Weight 0.05kgs / 0.12lb One Package Size 10cm * 10cm * 5cm / 3.94inch * 3.94inch * 1.97inch Qty per Carton 160 Carton Weight 9.00kgs / 19.84lb Carton Size 42cm * 42cm * 52cm / 16.54inch * 16.54inch * 20.47inch Loading Container 20GP: 290 cartons * 160 pcs = 46400 pcs 40HQ: 674 cartons * 160 pcs = 107840 pcs

Read more less

1. Specialized repair tool designed for mid-layer tin plating work on the S25 Ultra.2. Facilitates precise solder plating and restoration during advanced smartphone motherboard repair.3. Helps technicians perform controlled tin plating work on fine motherboard areas and connection points.4. Suitable for professional technicians handling PCB repair, solder restoration and component-level maintenance.5. A practical tool for mobile phone repair shops, motherboard technicians and electronics repair workstations.6. Note: Only for Samsung Galaxy S25 Ultra.Specification: Package Weight One Package Weight 0.05kgs / 0.12lb One Package Size 10cm * 10cm * 5cm / 3.94inch * 3.94inch * 1.97inch Qty per Carton 160 Carton Weight 9.00kgs / 19.84lb Carton Size 42cm * 42cm * 52cm / 16.54inch * 16.54inch * 20.47inch Loading Container 20GP: 290 cartons * 160 pcs = 46400 pcs 40HQ: 674 cartons * 160 pcs = 107840 pcs

Read more less

1. Specialized repair tool designed for mid-layer tin plating work on the S25 Ultra.2. Facilitates precise solder plating and restoration during advanced smartphone motherboard repair.3. Helps technicians perform controlled tin plating work on fine motherboard areas and connection points.4. Suitable for professional technicians handling PCB repair, solder restoration and component-level maintenance.5. A practical tool for mobile phone repair shops, motherboard technicians and electronics repair workstations.6. Note: Only for Samsung Galaxy S25 Ultra.Specification: Package Weight One Package Weight 0.05kgs / 0.12lb One Package Size 10cm * 10cm * 5cm / 3.94inch * 3.94inch * 1.97inch Qty per Carton 160 Carton Weight 9.00kgs / 19.84lb Carton Size 42cm * 42cm * 52cm / 16.54inch * 16.54inch * 20.47inch Loading Container 20GP: 290 cartons * 160 pcs = 46400 pcs 40HQ: 674 cartons * 160 pcs = 107840 pcs

Read more less

1. Specialized repair tool designed for mid-layer tin plating work on the S25 Ultra.2. Facilitates precise solder plating and restoration during advanced smartphone motherboard repair.3. Helps technicians perform controlled tin plating work on fine motherboard areas and connection points.4. Suitable for professional technicians handling PCB repair, solder restoration and component-level maintenance.5. A practical tool for mobile phone repair shops, motherboard technicians and electronics repair workstations.6. Note: Only for Samsung Galaxy S25 Ultra.Specification: Package Weight One Package Weight 0.05kgs / 0.12lb One Package Size 10cm * 10cm * 5cm / 3.94inch * 3.94inch * 1.97inch Qty per Carton 160 Carton Weight 9.00kgs / 19.84lb Carton Size 42cm * 42cm * 52cm / 16.54inch * 16.54inch * 20.47inch Loading Container 20GP: 290 cartons * 160 pcs = 46400 pcs 40HQ: 674 cartons * 160 pcs = 107840 pcs

Read more less

1. Built-in magnetic base securely locks the positioning plate and dedicated middle-layer stencil.2. Enables rapid and precise alignment of solder pads and stencil, effectively reducing manual offset errors, improving ball placement consistency, and enhancing daily work efficiency in the repair workshop.3. High-temperature resistant, suitable for hot air gun reflow soldering.4. Employs gradient temperature hot air heating to complete solder joint reflow molding, specifically designed for Android high-end motherboard layer repair scenarios.5. Compact desktop design, saving repair table space.Specification: Package Weight One Package Weight 0.05kgs / 0.12lb One Package Size 10cm * 10cm * 5cm / 3.94inch * 3.94inch * 1.97inch Qty per Carton 240 Carton Weight 13.00kgs / 28.66lb Carton Size 62cm * 52cm * 42cm / 24.41inch * 20.47inch * 16.54inch Loading Container 20GP: 196 cartons * 240 pcs = 47040 pcs 40HQ: 457 cartons * 240 pcs = 109680 pcs

Read more less

1. Built-in magnetic base securely locks the positioning plate and dedicated middle-layer stencil.2. Enables rapid and precise alignment of solder pads and stencil, effectively reducing manual offset errors, improving ball placement consistency, and enhancing daily work efficiency in the repair workshop.3. High-temperature resistant, suitable for hot air gun reflow soldering.4. Employs gradient temperature hot air heating to complete solder joint reflow molding, specifically designed for Android high-end motherboard layer repair scenarios.5. Compact desktop design, saving repair table space.Specification: Package Weight One Package Weight 0.05kgs / 0.12lb One Package Size 10cm * 10cm * 5cm / 3.94inch * 3.94inch * 1.97inch Qty per Carton 240 Carton Weight 13.00kgs / 28.66lb Carton Size 62cm * 52cm * 42cm / 24.41inch * 20.47inch * 16.54inch Loading Container 20GP: 196 cartons * 240 pcs = 47040 pcs 40HQ: 457 cartons * 240 pcs = 109680 pcs

Read more less

1. Built-in magnetic base securely locks the positioning plate and dedicated middle-layer stencil.2. Enables rapid and precise alignment of solder pads and stencil, effectively reducing manual offset errors, improving ball placement consistency, and enhancing daily work efficiency in the repair workshop.3. High-temperature resistant, suitable for hot air gun reflow soldering.4. Employs gradient temperature hot air heating to complete solder joint reflow molding, specifically designed for Android high-end motherboard layer repair scenarios.5. Compact desktop design, saving repair table space.Specification: Package Weight One Package Weight 0.05kgs / 0.12lb One Package Size 10cm * 10cm * 5cm / 3.94inch * 3.94inch * 1.97inch Qty per Carton 240 Carton Weight 13.00kgs / 28.66lb Carton Size 62cm * 52cm * 42cm / 24.41inch * 20.47inch * 16.54inch Loading Container 20GP: 196 cartons * 240 pcs = 47040 pcs 40HQ: 457 cartons * 240 pcs = 109680 pcs

Read more less

1. Built-in magnetic base securely locks the positioning plate and dedicated middle-layer stencil.2. Enables rapid and precise alignment of solder pads and stencil, effectively reducing manual offset errors, improving ball placement consistency, and enhancing daily work efficiency in the repair workshop.3. High-temperature resistant, suitable for hot air gun reflow soldering.4. Employs gradient temperature hot air heating to complete solder joint reflow molding, specifically designed for Android high-end motherboard layer repair scenarios.5. Compact desktop design, saving repair table space.Specification: Package Weight One Package Weight 0.05kgs / 0.12lb One Package Size 10cm * 10cm * 5cm / 3.94inch * 3.94inch * 1.97inch Qty per Carton 240 Carton Weight 13.00kgs / 28.66lb Carton Size 62cm * 52cm * 42cm / 24.41inch * 20.47inch * 16.54inch Loading Container 20GP: 196 cartons * 240 pcs = 47040 pcs 40HQ: 457 cartons * 240 pcs = 109680 pcs

Read more less

1. Built-in magnetic base securely locks the positioning plate and dedicated middle-layer stencil.2. Enables rapid and precise alignment of solder pads and stencil, effectively reducing manual offset errors, improving ball placement consistency, and enhancing daily work efficiency in the repair workshop.3. High-temperature resistant, suitable for hot air gun reflow soldering.4. Employs gradient temperature hot air heating to complete solder joint reflow molding, specifically designed for Android high-end motherboard layer repair scenarios.5. Compact desktop design, saving repair table space.Specification: Package Weight One Package Weight 0.05kgs / 0.12lb One Package Size 10cm * 10cm * 5cm / 3.94inch * 3.94inch * 1.97inch Qty per Carton 240 Carton Weight 13.00kgs / 28.66lb Carton Size 62cm * 52cm * 42cm / 24.41inch * 20.47inch * 16.54inch Loading Container 20GP: 196 cartons * 240 pcs = 47040 pcs 40HQ: 457 cartons * 240 pcs = 109680 pcs

Read more less

1. Built-in magnetic base securely locks the positioning plate and dedicated middle-layer stencil.2. Enables rapid and precise alignment of solder pads and stencil, effectively reducing manual offset errors, improving ball placement consistency, and enhancing daily work efficiency in the repair workshop.3. High-temperature resistant, suitable for hot air gun reflow soldering.4. Employs gradient temperature hot air heating to complete solder joint reflow molding, specifically designed for Android high-end motherboard layer repair scenarios.5. Compact desktop design, saving repair table space.Specification: Package Weight One Package Weight 0.05kgs / 0.12lb One Package Size 10cm * 10cm * 5cm / 3.94inch * 3.94inch * 1.97inch Qty per Carton 240 Carton Weight 13.00kgs / 28.66lb Carton Size 62cm * 52cm * 42cm / 24.41inch * 20.47inch * 16.54inch Loading Container 20GP: 196 cartons * 240 pcs = 47040 pcs 40HQ: 457 cartons * 240 pcs = 109680 pcs

Read more less

1. Built-in magnetic base securely locks the positioning plate and dedicated middle-layer stencil.2. Enables rapid and precise alignment of solder pads and stencil, effectively reducing manual offset errors, improving ball placement consistency, and enhancing daily work efficiency in the repair workshop.3. High-temperature resistant, suitable for hot air gun reflow soldering.4. Employs gradient temperature hot air heating to complete solder joint reflow molding, specifically designed for Android high-end motherboard layer repair scenarios.5. Compact desktop design, saving repair table space.Specification: Package Weight One Package Weight 0.05kgs / 0.12lb One Package Size 10cm * 10cm * 5cm / 3.94inch * 3.94inch * 1.97inch Qty per Carton 240 Carton Weight 13.00kgs / 28.66lb Carton Size 62cm * 52cm * 42cm / 24.41inch * 20.47inch * 16.54inch Loading Container 20GP: 196 cartons * 240 pcs = 47040 pcs 40HQ: 457 cartons * 240 pcs = 109680 pcs

Read more less

1. Built-in magnetic base securely locks the positioning plate and dedicated middle-layer stencil.2. Enables rapid and precise alignment of solder pads and stencil, effectively reducing manual offset errors, improving ball placement consistency, and enhancing daily work efficiency in the repair workshop.3. High-temperature resistant, suitable for hot air gun reflow soldering.4. Employs gradient temperature hot air heating to complete solder joint reflow molding, specifically designed for Android high-end motherboard layer repair scenarios.5. Compact desktop design, saving repair table space.Specification: Package Weight One Package Weight 0.05kgs / 0.12lb One Package Size 10cm * 10cm * 5cm / 3.94inch * 3.94inch * 1.97inch Qty per Carton 240 Carton Weight 13.00kgs / 28.66lb Carton Size 62cm * 52cm * 42cm / 24.41inch * 20.47inch * 16.54inch Loading Container 20GP: 196 cartons * 240 pcs = 47040 pcs 40HQ: 457 cartons * 240 pcs = 109680 pcs

Read more less

1. Built-in magnetic base securely locks the positioning plate and dedicated middle-layer stencil.2. Enables rapid and precise alignment of solder pads and stencil, effectively reducing manual offset errors, improving ball placement consistency, and enhancing daily work efficiency in the repair workshop.3. High-temperature resistant, suitable for hot air gun reflow soldering.4. Employs gradient temperature hot air heating to complete solder joint reflow molding, specifically designed for Android high-end motherboard layer repair scenarios.5. Compact desktop design, saving repair table space.Specification: Package Weight One Package Weight 0.05kgs / 0.12lb One Package Size 10cm * 10cm * 5cm / 3.94inch * 3.94inch * 1.97inch Qty per Carton 240 Carton Weight 13.00kgs / 28.66lb Carton Size 62cm * 52cm * 42cm / 24.41inch * 20.47inch * 16.54inch Loading Container 20GP: 196 cartons * 240 pcs = 47040 pcs 40HQ: 457 cartons * 240 pcs = 109680 pcs

Read more less

1. Built-in magnetic base securely locks the positioning plate and dedicated middle-layer stencil.2. Enables rapid and precise alignment of solder pads and stencil, effectively reducing manual offset errors, improving ball placement consistency, and enhancing daily work efficiency in the repair workshop.3. High-temperature resistant, suitable for hot air gun reflow soldering.4. Employs gradient temperature hot air heating to complete solder joint reflow molding, specifically designed for Android high-end motherboard layer repair scenarios.5. Compact desktop design, saving repair table space.Specification: Package Weight One Package Weight 0.05kgs / 0.12lb One Package Size 10cm * 10cm * 5cm / 3.94inch * 3.94inch * 1.97inch Qty per Carton 240 Carton Weight 13.00kgs / 28.66lb Carton Size 62cm * 52cm * 42cm / 24.41inch * 20.47inch * 16.54inch Loading Container 20GP: 196 cartons * 240 pcs = 47040 pcs 40HQ: 457 cartons * 240 pcs = 109680 pcs

Read more less

1. Designed specifically for reinstalling CPU, RAM, NAND flash memory, and other BGA-packaged chips on smartphone motherboards.2. Built-in magnetic base securely holds the positioning plate and stencil, enabling fast and accurate chip stencil alignment.3. Excellent high-temperature resistance, suitable for hot air gun reflow soldering.4. Helps form uniform, rounded solder balls, reducing the risk of bridging or missing solder balls.5. Suitable for high-volume chip refurbishment in repair shops.6. Compact desktop design, for mobile phone repair shops and repair labs.Specification: Package Weight One Package Weight 0.03kgs / 0.07lb One Package Size 10cm * 10cm * 5cm / 3.94inch * 3.94inch * 1.97inch Qty per Carton 160 Carton Weight 5.80kgs / 12.79lb Carton Size 52cm * 42cm * 42cm / 20.47inch * 16.54inch * 16.54inch Loading Container 20GP: 290 cartons * 160 pcs = 46400 pcs 40HQ: 674 cartons * 160 pcs = 107840 pcs

Read more less

1. Designed specifically for reinstalling CPU, RAM, NAND flash memory, and other BGA-packaged chips on smartphone motherboards.2. Built-in magnetic base securely holds the positioning plate and stencil, enabling fast and accurate chip stencil alignment.3. Excellent high-temperature resistance, suitable for hot air gun reflow soldering.4. Helps form uniform, rounded solder balls, reducing the risk of bridging or missing solder balls.5. Suitable for high-volume chip refurbishment in repair shops.6. Compact desktop design, for mobile phone repair shops and repair labs.Specification: Package Weight One Package Weight 0.03kgs / 0.07lb One Package Size 10cm * 10cm * 5cm / 3.94inch * 3.94inch * 1.97inch Qty per Carton 160 Carton Weight 5.80kgs / 12.79lb Carton Size 52cm * 42cm * 42cm / 20.47inch * 16.54inch * 16.54inch Loading Container 20GP: 290 cartons * 160 pcs = 46400 pcs 40HQ: 674 cartons * 160 pcs = 107840 pcs

Read more less

1. Designed specifically for reinstalling CPU, RAM, NAND flash memory, and other BGA-packaged chips on smartphone motherboards.2. Built-in magnetic base securely holds the positioning plate and stencil, enabling fast and accurate chip stencil alignment.3. Excellent high-temperature resistance, suitable for hot air gun reflow soldering.4. Helps form uniform, rounded solder balls, reducing the risk of bridging or missing solder balls.5. Suitable for high-volume chip refurbishment in repair shops.6. Compact desktop design, for mobile phone repair shops and repair labs.Specification: Package Weight One Package Weight 0.03kgs / 0.07lb One Package Size 10cm * 10cm * 5cm / 3.94inch * 3.94inch * 1.97inch Qty per Carton 160 Carton Weight 5.80kgs / 12.79lb Carton Size 52cm * 42cm * 42cm / 20.47inch * 16.54inch * 16.54inch Loading Container 20GP: 290 cartons * 160 pcs = 46400 pcs 40HQ: 674 cartons * 160 pcs = 107840 pcs

Read more less

1. Designed specifically for reinstalling CPU, RAM, NAND flash memory, and other BGA-packaged chips on smartphone motherboards.2. Built-in magnetic base securely holds the positioning plate and stencil, enabling fast and accurate chip stencil alignment.3. Excellent high-temperature resistance, suitable for hot air gun reflow soldering.4. Helps form uniform, rounded solder balls, reducing the risk of bridging or missing solder balls.5. Suitable for high-volume chip refurbishment in repair shops.6. Compact desktop design, for mobile phone repair shops and repair labs.Specification: Package Weight One Package Weight 0.03kgs / 0.07lb One Package Size 10cm * 10cm * 5cm / 3.94inch * 3.94inch * 1.97inch Qty per Carton 160 Carton Weight 5.80kgs / 12.79lb Carton Size 52cm * 42cm * 42cm / 20.47inch * 16.54inch * 16.54inch Loading Container 20GP: 290 cartons * 160 pcs = 46400 pcs 40HQ: 674 cartons * 160 pcs = 107840 pcs

Read more less

1. Designed specifically for reinstalling CPU, RAM, NAND flash memory, and other BGA-packaged chips on smartphone motherboards.2. Built-in magnetic base securely holds the positioning plate and stencil, enabling fast and accurate chip stencil alignment.3. Excellent high-temperature resistance, suitable for hot air gun reflow soldering.4. Helps form uniform, rounded solder balls, reducing the risk of bridging or missing solder balls.5. Suitable for high-volume chip refurbishment in repair shops.6. Compact desktop design, for mobile phone repair shops and repair labs.Specification: Package Weight One Package Weight 0.03kgs / 0.07lb One Package Size 10cm * 10cm * 5cm / 3.94inch * 3.94inch * 1.97inch Qty per Carton 160 Carton Weight 5.80kgs / 12.79lb Carton Size 52cm * 42cm * 42cm / 20.47inch * 16.54inch * 16.54inch Loading Container 20GP: 290 cartons * 160 pcs = 46400 pcs 40HQ: 674 cartons * 160 pcs = 107840 pcs

Read more less

1. Designed specifically for reinstalling CPU, RAM, NAND flash memory, and other BGA-packaged chips on smartphone motherboards.2. Built-in magnetic base securely holds the positioning plate and stencil, enabling fast and accurate chip stencil alignment.3. Excellent high-temperature resistance, suitable for hot air gun reflow soldering.4. Helps form uniform, rounded solder balls, reducing the risk of bridging or missing solder balls.5. Suitable for high-volume chip refurbishment in repair shops.6. Compact desktop design, for mobile phone repair shops and repair labs.Specification: Package Weight One Package Weight 0.03kgs / 0.07lb One Package Size 10cm * 10cm * 5cm / 3.94inch * 3.94inch * 1.97inch Qty per Carton 160 Carton Weight 5.80kgs / 12.79lb Carton Size 52cm * 42cm * 42cm / 20.47inch * 16.54inch * 16.54inch Loading Container 20GP: 290 cartons * 160 pcs = 46400 pcs 40HQ: 674 cartons * 160 pcs = 107840 pcs

Read more less

1. Designed specifically for reinstalling CPU, RAM, NAND flash memory, and other BGA-packaged chips on smartphone motherboards.2. Built-in magnetic base securely holds the positioning plate and stencil, enabling fast and accurate chip stencil alignment.3. Excellent high-temperature resistance, suitable for hot air gun reflow soldering.4. Helps form uniform, rounded solder balls, reducing the risk of bridging or missing solder balls.5. Suitable for high-volume chip refurbishment in repair shops.6. Compact desktop design, for mobile phone repair shops and repair labs.Specification: Package Weight One Package Weight 0.03kgs / 0.07lb One Package Size 10cm * 10cm * 5cm / 3.94inch * 3.94inch * 1.97inch Qty per Carton 160 Carton Weight 5.80kgs / 12.79lb Carton Size 52cm * 42cm * 42cm / 20.47inch * 16.54inch * 16.54inch Loading Container 20GP: 290 cartons * 160 pcs = 46400 pcs 40HQ: 674 cartons * 160 pcs = 107840 pcs

Read more less

1. Designed specifically for reinstalling CPU, RAM, NAND flash memory, and other BGA-packaged chips on smartphone motherboards.2. Built-in magnetic base securely holds the positioning plate and stencil, enabling fast and accurate chip stencil alignment.3. Excellent high-temperature resistance, suitable for hot air gun reflow soldering.4. Helps form uniform, rounded solder balls, reducing the risk of bridging or missing solder balls.5. Suitable for high-volume chip refurbishment in repair shops.6. Compact desktop design, for mobile phone repair shops and repair labs.Specification: Package Weight One Package Weight 0.03kgs / 0.07lb One Package Size 10cm * 10cm * 5cm / 3.94inch * 3.94inch * 1.97inch Qty per Carton 160 Carton Weight 5.80kgs / 12.79lb Carton Size 52cm * 42cm * 42cm / 20.47inch * 16.54inch * 16.54inch Loading Container 20GP: 290 cartons * 160 pcs = 46400 pcs 40HQ: 674 cartons * 160 pcs = 107840 pcs

Read more less

1. Designed specifically for reinstalling CPU, RAM, NAND flash memory, and other BGA-packaged chips on smartphone motherboards.2. Built-in magnetic base securely holds the positioning plate and stencil, enabling fast and accurate chip stencil alignment.3. Excellent high-temperature resistance, suitable for hot air gun reflow soldering.4. Helps form uniform, rounded solder balls, reducing the risk of bridging or missing solder balls.5. Suitable for high-volume chip refurbishment in repair shops.6. Compact desktop design, for mobile phone repair shops and repair labs.Specification: Package Weight One Package Weight 0.03kgs / 0.07lb One Package Size 10cm * 10cm * 5cm / 3.94inch * 3.94inch * 1.97inch Qty per Carton 160 Carton Weight 5.80kgs / 12.79lb Carton Size 52cm * 42cm * 42cm / 20.47inch * 16.54inch * 16.54inch Loading Container 20GP: 290 cartons * 160 pcs = 46400 pcs 40HQ: 674 cartons * 160 pcs = 107840 pcs

Read more less

1. Designed specifically for reinstalling CPU, RAM, NAND flash memory, and other BGA-packaged chips on smartphone motherboards.2. Built-in magnetic base securely holds the positioning plate and stencil, enabling fast and accurate chip stencil alignment.3. Excellent high-temperature resistance, suitable for hot air gun reflow soldering.4. Helps form uniform, rounded solder balls, reducing the risk of bridging or missing solder balls.5. Suitable for high-volume chip refurbishment in repair shops.6. Compact desktop design, for mobile phone repair shops and repair labs.Specification: Package Weight One Package Weight 0.03kgs / 0.07lb One Package Size 10cm * 10cm * 5cm / 3.94inch * 3.94inch * 1.97inch Qty per Carton 160 Carton Weight 5.80kgs / 12.79lb Carton Size 52cm * 42cm * 42cm / 20.47inch * 16.54inch * 16.54inch Loading Container 20GP: 290 cartons * 160 pcs = 46400 pcs 40HQ: 674 cartons * 160 pcs = 107840 pcs

Read more less

1. Designed specifically for reinstalling CPU, RAM, NAND flash memory, and other BGA-packaged chips on smartphone motherboards.2. Built-in magnetic base securely holds the positioning plate and stencil, enabling fast and accurate chip stencil alignment.3. Excellent high-temperature resistance, suitable for hot air gun reflow soldering.4. Helps form uniform, rounded solder balls, reducing the risk of bridging or missing solder balls.5. Suitable for high-volume chip refurbishment in repair shops.6. Compact desktop design, for mobile phone repair shops and repair labs.Specification: Package Weight One Package Weight 0.03kgs / 0.07lb One Package Size 10cm * 10cm * 5cm / 3.94inch * 3.94inch * 1.97inch Qty per Carton 160 Carton Weight 5.80kgs / 12.79lb Carton Size 52cm * 42cm * 42cm / 20.47inch * 16.54inch * 16.54inch Loading Container 20GP: 290 cartons * 160 pcs = 46400 pcs 40HQ: 674 cartons * 160 pcs = 107840 pcs

Read more less

1. Designed specifically for reinstalling CPU, RAM, NAND flash memory, and other BGA-packaged chips on smartphone motherboards.2. Built-in magnetic base securely holds the positioning plate and stencil, enabling fast and accurate chip stencil alignment.3. Excellent high-temperature resistance, suitable for hot air gun reflow soldering.4. Helps form uniform, rounded solder balls, reducing the risk of bridging or missing solder balls.5. Suitable for high-volume chip refurbishment in repair shops.6. Compact desktop design, for mobile phone repair shops and repair labs.Specification: Package Weight One Package Weight 0.03kgs / 0.07lb One Package Size 10cm * 10cm * 5cm / 3.94inch * 3.94inch * 1.97inch Qty per Carton 160 Carton Weight 5.80kgs / 12.79lb Carton Size 52cm * 42cm * 42cm / 20.47inch * 16.54inch * 16.54inch Loading Container 20GP: 290 cartons * 160 pcs = 46400 pcs 40HQ: 674 cartons * 160 pcs = 107840 pcs

Read more less

1. Designed specifically for reinstalling CPU, RAM, NAND flash memory, and other BGA-packaged chips on smartphone motherboards.2. Built-in magnetic base securely holds the positioning plate and stencil, enabling fast and accurate chip stencil alignment.3. Excellent high-temperature resistance, suitable for hot air gun reflow soldering.4. Helps form uniform, rounded solder balls, reducing the risk of bridging or missing solder balls.5. Suitable for high-volume chip refurbishment in repair shops.6. Compact desktop design, for mobile phone repair shops and repair labs.Specification: General Compatible with Apple:  iPhone 17 Pro , iPhone Air , iPhone 17 Pro Max , iPhone 17 , iPhone 16e , iPhone 16 Plus , iPhone 16 , iPhone 16 Pro Max , iPhone 16 Pro , iPhone 15 , iPhone 15 Pro Max , iPhone 15 Pro , iPhone 15 Plus , iPhone 14 Plus , iPhone 14 , iPhone 14 Pro , iPhone 14 Pro Max , iPhone SE 2022 , iPhone 13 Pro Max , iPhone 13 , iPhone 13 mini , iPhone 13 Pro , iPhone 12 , iPhone 12 Pro Max , iPhone 12 Pro , iPhone 12 mini , iPhone SE 2020 , iPhone 11 Pro , iPhone 11 Pro Max , iPhone 11 , iPhone XS , iPhone XR , iPhone XS Max , iPhone X Package Weight One Package Weight 0.03kgs / 0.07lb One Package Size 10cm * 10cm * 5cm / 3.94inch * 3.94inch * 1.97inch Qty per Carton 160 Carton Weight 5.80kgs / 12.79lb Carton Size 52cm * 42cm * 42cm / 20.47inch * 16.54inch * 16.54inch Loading Container 20GP: 290 cartons * 160 pcs = 46400 pcs 40HQ: 674 cartons * 160 pcs = 107840 pcs

Read more less

1. Designed specifically for reinstalling CPU, RAM, NAND flash memory, and other BGA-packaged chips on smartphone motherboards.2. Built-in magnetic base securely holds the positioning plate and stencil, enabling fast and accurate chip stencil alignment.3. Excellent high-temperature resistance, suitable for hot air gun reflow soldering.4. Helps form uniform, rounded solder balls, reducing the risk of bridging or missing solder balls.5. Suitable for high-volume chip refurbishment in repair shops.6. Compact desktop design, for mobile phone repair shops and repair labs.Specification: General Compatible with Apple:  iPhone 17 Pro , iPhone Air , iPhone 17 Pro Max , iPhone 17 , iPhone 16e , iPhone 16 Plus , iPhone 16 , iPhone 16 Pro Max , iPhone 16 Pro , iPhone 15 , iPhone 15 Pro Max , iPhone 15 Pro , iPhone 15 Plus , iPhone 14 Plus , iPhone 14 , iPhone 14 Pro , iPhone 14 Pro Max , iPhone SE 2022 , iPhone 13 Pro Max , iPhone 13 , iPhone 13 mini , iPhone 13 Pro , iPhone 12 , iPhone 12 Pro Max , iPhone 12 Pro , iPhone 12 mini , iPhone SE 2020 , iPhone 11 Pro , iPhone 11 Pro Max , iPhone 11 , iPhone XS , iPhone XR , iPhone XS Max , iPhone X Package Weight One Package Weight 0.03kgs / 0.07lb One Package Size 10cm * 10cm * 5cm / 3.94inch * 3.94inch * 1.97inch Qty per Carton 160 Carton Weight 5.80kgs / 12.79lb Carton Size 52cm * 42cm * 42cm / 20.47inch * 16.54inch * 16.54inch Loading Container 20GP: 290 cartons * 160 pcs = 46400 pcs 40HQ: 674 cartons * 160 pcs = 107840 pcs

Read more less

1. Specifically designed for vivo X80 Pro Dimensity Edition mid-layer, helping technicians accurately reball and repair the corresponding chip area.2. Precisely arranged openings help control solder paste or solder ball placement, improving reballing accuracy and consistency.3. The magnetic stencil helps maintain a stable position during operation, reducing unwanted movement and improving working efficiency.4. Features a 0.12 mm thickness for controlled solder application and reliable alignment during motherboard repair.5. The compact 70 x 70 mm format is convenient for handling, positioning, and storage on a professional repair workbench.Specification: General Compatible with Vivo:  X80 Pro Package Weight One Package Weight 0.03kgs / 0.07lb One Package Size 10cm * 5cm * 1cm / 3.94inch * 1.97inch * 0.39inch Qty per Carton 600 Carton Weight 19.00kgs / 41.89lb Carton Size 42cm * 27cm * 32cm / 16.54inch * 10.63inch * 12.6inch Loading Container 20GP: 734 cartons * 600 pcs = 440400 pcs 40HQ: 1705 cartons * 600 pcs = 1023000 pcs

Read more less

1. Durable: PU + plastic material, wear-resistant and durable. With good performance and high quality can be used for a long time.2. 3 Folding Stand: The magnetic cover and be folded into a comfortable viewing or typing stand.3. Auto Sleep / Wake: Built-in magnets instantly wake your tablet when you open the cover and put it to sleep when you close it.4. Protection: It adequately protects devices from the normal scratches, dirt, tear and wear.4. Convenience: All buttons and ports can be accessed, charged, and connected to the headphone cable without removing the case.

Read more less

1. Material: Monofilament 2. Height: 1.5m 3. Extended Diameter: 3.0m 4. Feature: thick and durable, folding and portable, quick-drying, fine workmanship, corrosion-resistant 5. Product use: outdoor fishing at shallow sea, river, lake, pond and so on.Specification: General Line Length 14m Size 1.5m Weight 1.87kg Package Weight One Package Weight 1.55kgs / 3.42lb One Package Size 50cm * 15cm * 8cm / 19.69inch * 5.91inch * 3.15inch Qty per Carton 8 Carton Weight 13.00kgs / 28.66lb Carton Size 50cm * 30cm * 32cm / 19.69inch * 11.81inch * 12.6inch Loading Container 20GP: 555 cartons * 8 pcs = 4440 pcs 40HQ: 1289 cartons * 8 pcs = 10312 pcs

Read more less

1. Material: Monofilament 2. Height: 1.2m 3. Extended Diameter: 2.4m 4. Feature: thick and durable, folding and portable, quick-drying, fine workmanship, corrosion-resistant 5. Product use: outdoor fishing at shallow sea, river, lake, pond and so on.Specification: General Line Length 14m Size 1.2m Weight 1.48kg Package Weight One Package Weight 1.24kgs / 2.74lb One Package Size 50cm * 15cm * 8cm / 19.69inch * 5.91inch * 3.15inch Qty per Carton 8 Carton Weight 13.00kgs / 28.66lb Carton Size 50cm * 30cm * 32cm / 19.69inch * 11.81inch * 12.6inch Loading Container 20GP: 555 cartons * 8 pcs = 4440 pcs 40HQ: 1289 cartons * 8 pcs = 10312 pcs

Read more less

1. Material: Tire Cords 2. Height: 1.5m 3. Extended Diameter: 3.0m 4. Feature: thick and durable, folding and portable, quick-drying, fine workmanship, corrosion-resistant 5. Product use: outdoor fishing at shallow sea, river, lake, pond and so on.Specification: General Line Length 14m Size 1.5m Weight 2.05kg Package Weight One Package Weight 1.78kgs / 3.92lb One Package Size 50cm * 15cm * 8cm / 19.69inch * 5.91inch * 3.15inch Qty per Carton 8 Carton Weight 13.00kgs / 28.66lb Carton Size 50cm * 30cm * 32cm / 19.69inch * 11.81inch * 12.6inch Loading Container 20GP: 555 cartons * 8 pcs = 4440 pcs 40HQ: 1289 cartons * 8 pcs = 10312 pcs

Read more less

1. Material: Tire Cords 2. Height: 1.2m 3. Extended Diameter: 2.4m 4. Feature: thick and durable, folding and portable, quick-drying, fine workmanship, corrosion-resistant 5. Product use: outdoor fishing at shallow sea, river, lake, pond and so on.Specification: General Line Length 14m Size 1.2m Weight 1.65kg Package Weight One Package Weight 1.45kgs / 3.19lb One Package Size 50cm * 15cm * 8cm / 19.69inch * 5.91inch * 3.15inch Qty per Carton 8 Carton Weight 13.00kgs / 28.66lb Carton Size 50cm * 30cm * 32cm / 19.69inch * 11.81inch * 12.6inch Loading Container 20GP: 555 cartons * 8 pcs = 4440 pcs 40HQ: 1289 cartons * 8 pcs = 10312 pcs

Read more less

1. Material: PCB2. The module can be directly powered by USB 5V to generate infrared images3. Use the amg8833 infrared heat sensor4. The resolution is 8x85. Sensing distance: 7 meters6. Can be used to check electronic products7. Portable and compact, high performance, easy to use8. High Performance High Gain: Typical 2.5 Typical 4.5 degrees Fahrenheit9. High Performance Low Gain: Typical 3.0 Typical 5.4 degrees Fahrenheit10. Human sensing distance: 7 meters or less (reference value) 22,966 feet11. Measuring temperature: 0-80 degrees Celsius12. Viewing angle: typical 60 degrees13. Current Consumption: 4.5ma typical (normal mode); 0.2m typical (sleep mode); 0.8m typical (sleep mode)14. Setup time: typical 50ms (time to enable communication after installation); typical 15s (time to stabilize output after installation)15. Number of pixels: 64 (vertical array 8x horizontal 8)16. External interface: 1 cc (quick mode)17. Frame rate: typically 10 frames/second or 1 frame/second18. Operation Mode: Normal, Sleep, Standby (10s or 60s flash)19. Output mode: temperature output20. Calculation method: no moving average or double moving average21. Temperature output resolution: 0.25 degrees Celsius/32.45 degrees Fahrenheit22. Number of sensor addresses: 2 (1 address c slave address)23. Output thermistor temperature range: -20 80 80 80 80 (-4 176 degrees Fahrenheit)24. Thermistor output resolution: 0.0625 degrees Fahrenheit / 32.1125 degrees Fahrenheit Item25. Dimensions: 38x36x17mm26. Weight: 17 gramsSpecification: Package Weight One Package Weight 0.02kgs / 0.05lb One Package Size 9cm * 8cm * 2cm / 3.54inch * 3.15inch * 0.79inch Qty per Carton 500 Carton Weight 11.00kgs / 24.25lb Carton Size 30cm * 50cm * 36.7cm / 11.81inch * 19.69inch * 14.45inch Loading Container 20GP: 484 cartons * 500 pcs = 242000 pcs 40HQ: 1124 cartons * 500 pcs = 562000 pcs

Read more less

1. Material: plastic, rubber paint2. Sensor type: CMOS3. Digital zoom: 16x4. LCD size: 3.0 inch5. Screen type: HD screen6. Storage media: TF card (not included)7. Anti-shake performance: electronic anti-shake8. Battery capacity: 1500mAh9. Data interface: USB 2.010. Self-timer: single / 2 seconds / 5 seconds / 10 seconds11. Weight: about 280g12. Packing list: camera x 1, battery x 1, data cable x 1, shoulder strap x 1, manual x 1Functional features:1. The camera supports 24 megapixel HD shooting and 1080P video recording, recording the wonderful moments in detail with your family and friends at any time2. 16X digital zoom and 3.0-inch TFT color LCD screen allows you to clearly see near and far, instantly watch what you are shooting or video/photo playback3. Digital camera with a variety of functions, such as multiple snapshots, self-timer, face beauty, face recognition, smile capture, anti-shake, one-touch mute, etc., support for TF memory cards up to 32GB (not included)4. Built-in flash, you can take bright and beautiful photos even in dark environment; high-capacity battery, more than 2 hours of battery life, easy to use5. Compact and lightweight, this digital camera is an ideal birthday or holiday gift for kids/teens/friends, easy to operate, suitable for novice users, experience the fun of photographySpecification: Package Weight One Package Weight 0.40kgs / 0.89lb One Package Size 17cm * 13cm * 9cm / 6.69inch * 5.12inch * 3.54inch Qty per Carton 28 Carton Weight 16.80kgs / 37.04lb Carton Size 60cm * 35cm * 27cm / 23.62inch * 13.78inch * 10.63inch Loading Container 20GP: 470 cartons * 28 pcs = 13160 pcs 40HQ: 1091 cartons * 28 pcs = 30548 pcs

Read more less

1. Material: plastic, rubber paint2. Sensor type: CMOS3. Digital zoom: 16x4. LCD size: 3.0 inch5. Screen type: HD screen6. Storage media: TF card (not included)7. Anti-shake performance: electronic anti-shake8. Battery capacity: 1500mAh9. Data interface: USB 2.010. Self-timer: single / 2 seconds / 5 seconds / 10 seconds11. Weight: about 280g12. Packing list: camera x 1, battery x 1, data cable x 1, shoulder strap x 1, manual x 1Functional features:1. The camera supports 24 megapixel HD shooting and 1080P video recording, recording the wonderful moments in detail with your family and friends at any time2. 16X digital zoom and 3.0-inch TFT color LCD screen allows you to clearly see near and far, instantly watch what you are shooting or video/photo playback3. Digital camera with a variety of functions, such as multiple snapshots, self-timer, face beauty, face recognition, smile capture, anti-shake, one-touch mute, etc., support for TF memory cards up to 32GB (not included)4. Built-in flash, you can take bright and beautiful photos even in dark environment; high-capacity battery, more than 2 hours of battery life, easy to use5. Compact and lightweight, this digital camera is an ideal birthday or holiday gift for kids/teens/friends, easy to operate, suitable for novice users, experience the fun of photographySpecification: Package Weight One Package Weight 0.40kgs / 0.89lb One Package Size 17cm * 13cm * 9cm / 6.69inch * 5.12inch * 3.54inch Qty per Carton 28 Carton Weight 16.80kgs / 37.04lb Carton Size 60cm * 35cm * 27cm / 23.62inch * 13.78inch * 10.63inch Loading Container 20GP: 470 cartons * 28 pcs = 13160 pcs 40HQ: 1091 cartons * 28 pcs = 30548 pcs

Read more less

About the product1. Replacement LCD display + touch screen digitizer assembly (AMOLED material) for Xiaomi Mi Mix 4. 2. Replace your broken or unusable item with a new one. 3. Make your device look more refreshing than ever. 4. Completely fit and work. 5. Each item has been checked and in good condition before shipping. 6. Professional installation is highly recommended. We will not be responsible once the screen is installed. Before Installation Notes1. Tips 1: Test before installation When testing, do not remove any protective film or tags. Please pay attention to the problem of static electricity. Before attempting any repair, be sure to ground yourself is an ESD (electro static discharge) strap. This will prevent static electricity from damaging the electronic components within the phone. Ensure you wear eye protection and use caution not to cut your finger with the glass splinters. 2. Tips 2: Simulates testing Screen replacement is very fragile product. We strongly suggest test before installation. Please simulates testing, which means mobile phone apart, (motherboard + LCD or screen) connected audio cable and new replacement, power on, test finished. If test OK, please install it. If it can not show, please contact us at the very first time. And please do not force it to be installed in mobile phone. We will not be responsible once the screen is installed. 3. Tips 3: Do not over-bend cable Please make sure LCD cable Do not over-bend. Over 90 degrees bent will cause black display. Specification: General Compatible with Xiaomi:  Mi Mix 4 Package Weight One Package Weight 0.15kgs / 0.33lb One Package Size 25cm * 13cm * 5cm / 9.84inch * 5.12inch * 1.97inch Qty per Carton 66 Carton Weight 9.50kgs / 20.94lb Carton Size 40cm * 36cm * 36cm / 15.75inch * 14.17inch * 14.17inch Loading Container 20GP: 514 cartons * 66 pcs = 33924 pcs 40HQ: 1194 cartons * 66 pcs = 78804 pcs

Read more less

Before Installation NotesTips 1: Test before installationWhen testing, do not remove any protective film or tags. Please pay attention to the problem of static electricity.Before attempting any repair, be sure to ground yourself is an ESD (electro static discharge) strap. This will prevent static electricity from damaging the electronic components within the phone.Ensure you wear eye protection and use caution not to cut your finger with the glass splinters.Tips 2: Simulates testingScreen replacement is very fragile product. We strongly suggest test before installation. Please simulates testing, which means mobile phone apart, (motherboard + LCD or screen) connected audio cable and new replacement, power on, test finished. If test OK, please install it. If it can not show, please contact us at the very first time. And please do not force it to be installed in mobile phone. We will not be responsible once the screen is installed.Tips 3: Do not over-bend cablePlease make sure LCD cable Do not over-bend. Over 90 degrees bent will cause black display.About the product1. Replacement LCD screen + touch screen digitizer assembly for Asus ROG Phone 5 Pro ZS673KS 2. Replace your broken or unusable item with a new one 3. Make your device look more refreshing than ever 4. Completely fit and work 5. Each item has been checked and in good condition before shipping 6. Professional installation is highly recommended. We will not be responsible once the screen is installed Specification: General Compatible with Asus:  ROG Phone 5 Pro Package Weight One Package Weight 0.15kgs / 0.33lb One Package Size 25cm * 13cm * 5cm / 9.84inch * 5.12inch * 1.97inch Qty per Carton 66 Carton Weight 9.50kgs / 20.94lb Carton Size 40cm * 36cm * 36cm / 15.75inch * 14.17inch * 14.17inch Loading Container 20GP: 514 cartons * 66 pcs = 33924 pcs 40HQ: 1194 cartons * 66 pcs = 78804 pcs

Read more less

Before Installation NotesTips 1: Test before installationWhen testing, do not remove any protective film or tags. Please pay attention to the problem of static electricity.Before attempting any repair, be sure to ground yourself is an ESD (electro static discharge) strap. This will prevent static electricity from damaging the electronic components within the phone.Ensure you wear eye protection and use caution not to cut your finger with the glass splinters.Tips 2: Simulates testingScreen replacement is very fragile product. We strongly suggest test before installation. Please simulates testing, which means mobile phone apart, (motherboard + LCD or screen) connected audio cable and new replacement, power on, test finished. If test OK, please install it. If it can not show, please contact us at the very first time. And please do not force it to be installed in mobile phone. We will not be responsible once the screen is installed.Tips 3: Do not over-bend cablePlease make sure LCD cable Do not over-bend. Over 90 degrees bent will cause black display.About the product1. Replacement LCD screen + touch screen digitizer assembly for Asus ROG Phone 5 Ultimate ZS673KS 2. Replace your broken or unusable item with a new one 3. Make your device look more refreshing than ever 4. Completely fit and work 5. Each item has been checked and in good condition before shipping 6. Professional installation is highly recommended. We will not be responsible once the screen is installed Specification: General Compatible with Asus:  ROG Phone 5 Ultimate Package Weight One Package Weight 0.15kgs / 0.33lb One Package Size 25cm * 13cm * 5cm / 9.84inch * 5.12inch * 1.97inch Qty per Carton 66 Carton Weight 9.50kgs / 20.94lb Carton Size 40cm * 36cm * 36cm / 15.75inch * 14.17inch * 14.17inch Loading Container 20GP: 514 cartons * 66 pcs = 33924 pcs 40HQ: 1194 cartons * 66 pcs = 78804 pcs

Read more less

Before Installation NotesTips 1: Test before installationWhen testing, do not remove any protective film or tags. Please pay attention to the problem of static electricity.Before attempting any repair, be sure to ground yourself is an ESD (electro static discharge) strap. This will prevent static electricity from damaging the electronic components within the phone.Ensure you wear eye protection and use caution not to cut your finger with the glass splinters.Tips 2: Simulates testingScreen replacement is very fragile product. We strongly suggest test before installation. Please simulates testing, which means mobile phone apart, (motherboard + LCD or screen) connected audio cable and new replacement, power on, test finished. If test OK, please install it. If it can not show, please contact us at the very first time. And please do not force it to be installed in mobile phone. We will not be responsible once the screen is installed.Tips 3: Do not over-bend cablePlease make sure LCD cable Do not over-bend. Over 90 degrees bent will cause black display.About the product1. Replacement LCD screen + touch screen digitizer assembly for Asus ROG Phone 5s ZS676KS 2. Replace your broken or unusable item with a new one 3. Make your device look more refreshing than ever 4. Completely fit and work 5. Each item has been checked and in good condition before shipping 6. Professional installation is highly recommended. We will not be responsible once the screen is installed Specification: General Compatible with Asus:  ROG Phone 5s Package Weight One Package Weight 0.15kgs / 0.33lb One Package Size 25cm * 13cm * 5cm / 9.84inch * 5.12inch * 1.97inch Qty per Carton 66 Carton Weight 9.50kgs / 20.94lb Carton Size 40cm * 36cm * 36cm / 15.75inch * 14.17inch * 14.17inch Loading Container 20GP: 514 cartons * 66 pcs = 33924 pcs 40HQ: 1194 cartons * 66 pcs = 78804 pcs

Read more less

Before Installation NotesTips 1: Test before installationWhen testing, do not remove any protective film or tags. Please pay attention to the problem of static electricity.Before attempting any repair, be sure to ground yourself is an ESD (electro static discharge) strap. This will prevent static electricity from damaging the electronic components within the phone.Ensure you wear eye protection and use caution not to cut your finger with the glass splinters.Tips 2: Simulates testingScreen replacement is very fragile product. We strongly suggest test before installation. Please simulates testing, which means mobile phone apart, (motherboard + LCD or screen) connected audio cable and new replacement, power on, test finished. If test OK, please install it. If it can not show, please contact us at the very first time. And please do not force it to be installed in mobile phone. We will not be responsible once the screen is installed.Tips 3: Do not over-bend cablePlease make sure LCD cable Do not over-bend. Over 90 degrees bent will cause black display.About the product1. Replacement LCD screen + touch screen digitizer assembly for Asus ROG Phone 6 Pro 2. Replace your broken or unusable item with a new one 3. Make your device look more refreshing than ever 4. Completely fit and work 5. Each item has been checked and in good condition before shipping 6. Professional installation is highly recommended. We will not be responsible once the screen is installed Specification: General Compatible with Asus:  ROG Phone 6 Pro Package Weight One Package Weight 0.15kgs / 0.33lb One Package Size 25cm * 13cm * 5cm / 9.84inch * 5.12inch * 1.97inch Qty per Carton 66 Carton Weight 9.50kgs / 20.94lb Carton Size 40cm * 36cm * 36cm / 15.75inch * 14.17inch * 14.17inch Loading Container 20GP: 514 cartons * 66 pcs = 33924 pcs 40HQ: 1194 cartons * 66 pcs = 78804 pcs

Read more less

Before Installation NotesTips 1: Test before installationWhen testing, do not remove any protective film or tags. Please pay attention to the problem of static electricity.Before attempting any repair, be sure to ground yourself is an ESD (electro static discharge) strap. This will prevent static electricity from damaging the electronic components within the phone.Ensure you wear eye protection and use caution not to cut your finger with the glass splinters.Tips 2: Simulates testingScreen replacement is very fragile product. We strongly suggest test before installation. Please simulates testing, which means mobile phone apart, (motherboard + LCD or screen) connected audio cable and new replacement, power on, test finished. If test OK, please install it. If it can not show, please contact us at the very first time. And please do not force it to be installed in mobile phone. We will not be responsible once the screen is installed.Tips 3: Do not over-bend cablePlease make sure LCD cable Do not over-bend. Over 90 degrees bent will cause black display.About the product1. Replacement LCD screen + touch screen digitizer assembly for Asus ROG Phone 6 2. Replace your broken or unusable item with a new one 3. Make your device look more refreshing than ever 4. Completely fit and work 5. Each item has been checked and in good condition before shipping 6. Professional installation is highly recommended. We will not be responsible once the screen is installed Specification: General Compatible with Asus:  ROG Phone 6 Package Weight One Package Weight 0.15kgs / 0.33lb One Package Size 25cm * 13cm * 5cm / 9.84inch * 5.12inch * 1.97inch Qty per Carton 66 Carton Weight 9.50kgs / 20.94lb Carton Size 40cm * 36cm * 36cm / 15.75inch * 14.17inch * 14.17inch Loading Container 20GP: 514 cartons * 66 pcs = 33924 pcs 40HQ: 1194 cartons * 66 pcs = 78804 pcs

Read more less

Before Installation NotesTips 1: Test before installationWhen testing, do not remove any protective film or tags. Please pay attention to the problem of static electricity.Before attempting any repair, be sure to ground yourself is an ESD (electro static discharge) strap. This will prevent static electricity from damaging the electronic components within the phone.Ensure you wear eye protection and use caution not to cut your finger with the glass splinters.Tips 2: Simulates testingScreen replacement is very fragile product. We strongly suggest test before installation. Please simulates testing, which means mobile phone apart, (motherboard + LCD or screen) connected audio cable and new replacement, power on, test finished. If test OK, please install it. If it can not show, please contact us at the very first time. And please do not force it to be installed in mobile phone. We will not be responsible once the screen is installed.Tips 3: Do not over-bend cablePlease make sure LCD cable Do not over-bend. Over 90 degrees bent will cause black display.About the product1. Replacement LCD screen + touch screen digitizer assembly for Asus Smartphone for Snapdragon Insiders 2. Replace your broken or unusable item with a new one 3. Make your device look more refreshing than ever 4. Completely fit and work 5. Each item has been checked and in good condition before shipping 6. Professional installation is highly recommended. We will not be responsible once the screen is installed Specification: General Compatible with Asus:  Smartphone for Snapdragon Insiders Package Weight One Package Weight 0.15kgs / 0.33lb One Package Size 25cm * 13cm * 5cm / 9.84inch * 5.12inch * 1.97inch Qty per Carton 66 Carton Weight 9.50kgs / 20.94lb Carton Size 40cm * 36cm * 36cm / 15.75inch * 14.17inch * 14.17inch Loading Container 20GP: 514 cartons * 66 pcs = 33924 pcs 40HQ: 1194 cartons * 66 pcs = 78804 pcs

Read more less