Products

25001 products


  • EDA008186205.jpg@c4644d6275e5043a608a8ebb1bcb9221

    AMAOE 0.12mm Reballing Stencil For iPhone 14 Series

    1. Featuring a 0.12mm ultra-thin design, it fits precisely to the chip surface, significantly improving reballing success rates and ensuring optimal performance for high-precision IC chip repairs.2. Made of high-quality stainless steel, it offers excellent heat resistance and corrosion resistance, maintaining its shape without bending or deforming even after prolonged use, ensuring consistent reballing results every time.3. Specifically designed for Apple chip models, fully compatible with CPUs, basebands, power management ICs, and other common chips, meeting diverse repair demands.4. Utilizing laser micron-level cutting technology, the stencil features uniform aperture sizes and highly accurate solder ball alignment, effectively minimizing misalignment, solder bridging, and enhancing overall soldering yield.5. Precisely aligned hole positions allow for quick and easy operation, greatly improving reballing efficiency, reducing rework rates, and making it suitable for both individual technicians and professional mass production environments.6. Highly durable and wear-resistant, easy to clean, and capable of withstanding hundreds of reuse cycles under normal conditions, offering excellent cost-effectiveness and significantly lowering repair costs.Specification: General Compatible with Apple:  iPhone 14 Plus , iPhone 14 , iPhone 14 Pro , iPhone 14 Pro Max Package Weight One Package Weight 0.05kgs / 0.12lb One Package Size 10cm * 10cm * 1cm / 3.94inch * 3.94inch * 0.39inch Qty per Carton 360 Carton Weight 19.00kgs / 41.89lb Carton Size 42cm * 32cm * 32cm / 16.54inch * 12.6inch * 12.6inch Loading Container 20GP: 620 cartons * 360 pcs = 223200 pcs 40HQ: 1439 cartons * 360 pcs = 518040 pcs

    $12.47

  • EDA008186202.jpg@94e39938498c52b499f163dc98621418

    AMAOE 0.12mm Reballing Stencil For iPhone 15 Series

    1. Featuring a 0.12mm ultra-thin design, it fits precisely to the chip surface, significantly improving reballing success rates and ensuring optimal performance for high-precision IC chip repairs.2. Made of high-quality stainless steel, it offers excellent heat resistance and corrosion resistance, maintaining its shape without bending or deforming even after prolonged use, ensuring consistent reballing results every time.3. Specifically designed for Apple chip models, fully compatible with CPUs, basebands, power management ICs, and other common chips, meeting diverse repair demands.4. Utilizing laser micron-level cutting technology, the stencil features uniform aperture sizes and highly accurate solder ball alignment, effectively minimizing misalignment, solder bridging, and enhancing overall soldering yield.5. Precisely aligned hole positions allow for quick and easy operation, greatly improving reballing efficiency, reducing rework rates, and making it suitable for both individual technicians and professional mass production environments.6. Highly durable and wear-resistant, easy to clean, and capable of withstanding hundreds of reuse cycles under normal conditions, offering excellent cost-effectiveness and significantly lowering repair costs.Specification: General Compatible with Apple:  iPhone 15 Pro Max , iPhone 15 Pro , iPhone 15 , iPhone 15 Plus Package Weight One Package Weight 0.05kgs / 0.12lb One Package Size 10cm * 10cm * 1cm / 3.94inch * 3.94inch * 0.39inch Qty per Carton 360 Carton Weight 19.00kgs / 41.89lb Carton Size 42cm * 32cm * 32cm / 16.54inch * 12.6inch * 12.6inch Loading Container 20GP: 620 cartons * 360 pcs = 223200 pcs 40HQ: 1439 cartons * 360 pcs = 518040 pcs

    $12.72

  • EDA008186201.jpg@674b5b153f5d478204eb40648d6c0822

    AMAOE 0.12mm Reballing Stencil For iPhone 16 Series

    1. Featuring a 0.12mm ultra-thin design, it fits precisely to the chip surface, significantly improving reballing success rates and ensuring optimal performance for high-precision IC chip repairs.2. Made of high-quality stainless steel, it offers excellent heat resistance and corrosion resistance, maintaining its shape without bending or deforming even after prolonged use, ensuring consistent reballing results every time.3. Specifically designed for Apple chip models, fully compatible with CPUs, basebands, power management ICs, and other common chips, meeting diverse repair demands.4. Utilizing laser micron-level cutting technology, the stencil features uniform aperture sizes and highly accurate solder ball alignment, effectively minimizing misalignment, solder bridging, and enhancing overall soldering yield.5. Precisely aligned hole positions allow for quick and easy operation, greatly improving reballing efficiency, reducing rework rates, and making it suitable for both individual technicians and professional mass production environments.6. Highly durable and wear-resistant, easy to clean, and capable of withstanding hundreds of reuse cycles under normal conditions, offering excellent cost-effectiveness and significantly lowering repair costs.Specification: General Compatible with Apple:  iPhone 16 Pro Max , iPhone 16 Plus , iPhone 16 , iPhone 16 Pro Package Weight One Package Weight 0.05kgs / 0.12lb One Package Size 10cm * 10cm * 1cm / 3.94inch * 3.94inch * 0.39inch Qty per Carton 360 Carton Weight 19.00kgs / 41.89lb Carton Size 42cm * 32cm * 32cm / 16.54inch * 12.6inch * 12.6inch Loading Container 20GP: 620 cartons * 360 pcs = 223200 pcs 40HQ: 1439 cartons * 360 pcs = 518040 pcs

    $12.72

  • EDA008186203.jpg@2e7f59e249790fe5bb6d5d228f3079ba

    AMAOE 0.12mm Reballing Stencil For iPhone 6-15 Series Baseband

    1. Featuring a 0.12mm ultra-thin design, it fits precisely to the chip surface, significantly improving reballing success rates and ensuring optimal performance for high-precision IC chip repairs.2. Made of high-quality stainless steel, it offers excellent heat resistance and corrosion resistance, maintaining its shape without bending or deforming even after prolonged use, ensuring consistent reballing results every time.3. Specifically designed for Apple chip models, fully compatible with CPUs, basebands, power management ICs, and other common chips, meeting diverse repair demands.4. Utilizing laser micron-level cutting technology, the stencil features uniform aperture sizes and highly accurate solder ball alignment, effectively minimizing misalignment, solder bridging, and enhancing overall soldering yield.5. Precisely aligned hole positions allow for quick and easy operation, greatly improving reballing efficiency, reducing rework rates, and making it suitable for both individual technicians and professional mass production environments.6. Highly durable and wear-resistant, easy to clean, and capable of withstanding hundreds of reuse cycles under normal conditions, offering excellent cost-effectiveness and significantly lowering repair costs.Specification: General Compatible with Apple:  iPhone 15 Pro Max , iPhone 15 Pro , iPhone 15 , iPhone 15 Plus , iPhone 14 Plus , iPhone 14 , iPhone 14 Pro , iPhone 14 Pro Max , iPhone 13 Pro Max , iPhone 13 , iPhone 13 mini , iPhone 13 Pro , iPhone 12 , iPhone 12 Pro Max , iPhone 12 Pro , iPhone 12 mini , iPhone 11 Pro , iPhone 11 Pro Max , iPhone XS , iPhone XS Max , iPhone XR , iPhone 8 Plus , iPhone 8 , iPhone 7 , iPhone 7 Plus , iPhone 6s Plus , iPhone 6s , iPhone 6 Plus , iPhone 6 Package Weight One Package Weight 0.05kgs / 0.12lb One Package Size 10cm * 10cm * 1cm / 3.94inch * 3.94inch * 0.39inch Qty per Carton 360 Carton Weight 19.00kgs / 41.89lb Carton Size 42cm * 32cm * 32cm / 16.54inch * 12.6inch * 12.6inch Loading Container 20GP: 620 cartons * 360 pcs = 223200 pcs 40HQ: 1439 cartons * 360 pcs = 518040 pcs

    $12.72

  • EDA008186204.jpg@ced6682bbf519068954b1df807475485

    AMAOE 0.12mm Reballing Stencil For iPhone 7-15 Series

    1. Featuring a 0.12mm ultra-thin design, it fits precisely to the chip surface, significantly improving reballing success rates and ensuring optimal performance for high-precision IC chip repairs.2. Made of high-quality stainless steel, it offers excellent heat resistance and corrosion resistance, maintaining its shape without bending or deforming even after prolonged use, ensuring consistent reballing results every time.3. Specifically designed for Apple chip models, fully compatible with CPUs, basebands, power management ICs, and other common chips, meeting diverse repair demands.4. Utilizing laser micron-level cutting technology, the stencil features uniform aperture sizes and highly accurate solder ball alignment, effectively minimizing misalignment, solder bridging, and enhancing overall soldering yield.5. Precisely aligned hole positions allow for quick and easy operation, greatly improving reballing efficiency, reducing rework rates, and making it suitable for both individual technicians and professional mass production environments.6. Highly durable and wear-resistant, easy to clean, and capable of withstanding hundreds of reuse cycles under normal conditions, offering excellent cost-effectiveness and significantly lowering repair costs.Specification: General Compatible with Apple:  iPhone 15 Pro Max , iPhone 15 Pro , iPhone 15 , iPhone 15 Plus , iPhone 14 Plus , iPhone 14 , iPhone 14 Pro , iPhone 14 Pro Max , iPhone 13 Pro Max , iPhone 13 , iPhone 13 mini , iPhone 13 Pro , iPhone 12 , iPhone 12 Pro Max , iPhone 12 Pro , iPhone 12 mini , iPhone 11 Pro , iPhone 11 Pro Max , iPhone 11 , iPhone XS , iPhone XS Max , iPhone XR , iPhone X , iPhone 8 Plus , iPhone 8 , iPhone 7 , iPhone 7 Plus Package Weight One Package Weight 0.05kgs / 0.12lb One Package Size 10cm * 10cm * 1cm / 3.94inch * 3.94inch * 0.39inch Qty per Carton 360 Carton Weight 19.00kgs / 41.89lb Carton Size 42cm * 32cm * 32cm / 16.54inch * 12.6inch * 12.6inch Loading Container 20GP: 620 cartons * 360 pcs = 223200 pcs 40HQ: 1439 cartons * 360 pcs = 518040 pcs

    $12.72

  • EDA008186206.jpg@2a104b4168c1efa2e340055ffe76fb7e

    AMAOE 0.12mm Reballing Stencil For WiFi Comprehensive

    1. Featuring a 0.12mm ultra-thin design, it fits precisely to the chip surface, significantly improving reballing success rates and ensuring optimal performance for high-precision IC chip repairs.2. Made of high-quality stainless steel, it offers excellent heat resistance and corrosion resistance, maintaining its shape without bending or deforming even after prolonged use, ensuring consistent reballing results every time.3. Specifically designed for Apple chip models, fully compatible with CPUs, basebands, power management ICs, and other common chips, meeting diverse repair demands.4. Utilizing laser micron-level cutting technology, the stencil features uniform aperture sizes and highly accurate solder ball alignment, effectively minimizing misalignment, solder bridging, and enhancing overall soldering yield.5. Precisely aligned hole positions allow for quick and easy operation, greatly improving reballing efficiency, reducing rework rates, and making it suitable for both individual technicians and professional mass production environments.6. Highly durable and wear-resistant, easy to clean, and capable of withstanding hundreds of reuse cycles under normal conditions, offering excellent cost-effectiveness and significantly lowering repair costs.Specification: Package Weight One Package Weight 0.05kgs / 0.12lb One Package Size 10cm * 10cm * 1cm / 3.94inch * 3.94inch * 0.39inch Qty per Carton 360 Carton Weight 19.00kgs / 41.89lb Carton Size 42cm * 32cm * 32cm / 16.54inch * 12.6inch * 12.6inch Loading Container 20GP: 620 cartons * 360 pcs = 223200 pcs 40HQ: 1439 cartons * 360 pcs = 518040 pcs

    $12.47

  • TBD0606473801.jpg@910d4bdda759e7f767d8a86f1d502160

    AMAOE For Samsung BGA Reballing Stencil Soldering Repair Tool, Model: SAM15 S21/S21 Ultra

    1. SAM15: Suitable for Qualcomm Snapdragon 888 SM8350/Exynos 2100 CPU series, Samsung S21/S21+/S21 Ultra G998U/G996U/Z Flip 3/Z Fold 3/W22, etc. 2. SAM16: Suitable for Exynos 1280/Samsung E8825 CPU universal series, A53/A536, etc. 3. SAM17: Suitable for Exynos 2200/E9925, Snapdragon 8 Gen 1/SM8450 CPU universal series, Samsung S22/S22 Plus/S22 Ultra/S901/S906/S908, etc. 4. SAM18: Suitable for Exynos 1330-E8535P/1380-E8835P CPU universal series, Samsung A14/A54, etc. 5. SAM19: Suitable for Snapdragon 8 Gen 2 SM8550/8 Gen 3 SM8650 CPU universal series, Samsung S23/S23 Ultra/S24/S24 Ultra, etc. 6. SAM20: Suitable for MediaTek Dimensity 6100+ MT6835V CPU universal series, Samsung A156U/A156E, etc. 7. SAM21: Suitable for Snapdragon 8 Ultimate Edition SM8750 CPU universal series, Samsung S25/S25 Plus, etc.Specification: General Compatible with Samsung:  W22 5G , Galaxy Z Fold3 5G , Galaxy Z Flip3 5G , Galaxy S21+ 5G , Galaxy S21 Ultra 5G , Galaxy S21 5G Package Weight One Package Weight 0.05kgs / 0.12lb One Package Size 10cm * 10cm * 2cm / 3.94inch * 3.94inch * 0.79inch Qty per Carton 360 Carton Weight 19.00kgs / 41.89lb Carton Size 42cm * 32cm * 32cm / 16.54inch * 12.6inch * 12.6inch Loading Container 20GP: 620 cartons * 360 pcs = 223200 pcs 40HQ: 1439 cartons * 360 pcs = 518040 pcs

    $11.36

  • TBD0606473802.jpg@bbb408d45405797760dd08ac716e49b1

    AMAOE For Samsung BGA Reballing Stencil Soldering Repair Tool, Model: SAM16 A53/A536

    1. SAM15: Suitable for Qualcomm Snapdragon 888 SM8350/Exynos 2100 CPU series, Samsung S21/S21+/S21 Ultra G998U/G996U/Z Flip 3/Z Fold 3/W22, etc. 2. SAM16: Suitable for Exynos 1280/Samsung E8825 CPU universal series, A53/A536, etc. 3. SAM17: Suitable for Exynos 2200/E9925, Snapdragon 8 Gen 1/SM8450 CPU universal series, Samsung S22/S22 Plus/S22 Ultra/S901/S906/S908, etc. 4. SAM18: Suitable for Exynos 1330-E8535P/1380-E8835P CPU universal series, Samsung A14/A54, etc. 5. SAM19: Suitable for Snapdragon 8 Gen 2 SM8550/8 Gen 3 SM8650 CPU universal series, Samsung S23/S23 Ultra/S24/S24 Ultra, etc. 6. SAM20: Suitable for MediaTek Dimensity 6100+ MT6835V CPU universal series, Samsung A156U/A156E, etc. 7. SAM21: Suitable for Snapdragon 8 Ultimate Edition SM8750 CPU universal series, Samsung S25/S25 Plus, etc.Specification: General Compatible with Samsung:  Galaxy A53 5G , Galaxy A53 Package Weight One Package Weight 0.05kgs / 0.12lb One Package Size 10cm * 10cm * 2cm / 3.94inch * 3.94inch * 0.79inch Qty per Carton 360 Carton Weight 19.00kgs / 41.89lb Carton Size 42cm * 32cm * 32cm / 16.54inch * 12.6inch * 12.6inch Loading Container 20GP: 620 cartons * 360 pcs = 223200 pcs 40HQ: 1439 cartons * 360 pcs = 518040 pcs

    $11.36

  • TBD0606473803.jpg@7dcf20067b551a22377bf3863b0b74f3

    AMAOE For Samsung BGA Reballing Stencil Soldering Repair Tool, Model: SAM17 S22/S22 Ultra

    1. SAM15: Suitable for Qualcomm Snapdragon 888 SM8350/Exynos 2100 CPU series, Samsung S21/S21+/S21 Ultra G998U/G996U/Z Flip 3/Z Fold 3/W22, etc. 2. SAM16: Suitable for Exynos 1280/Samsung E8825 CPU universal series, A53/A536, etc. 3. SAM17: Suitable for Exynos 2200/E9925, Snapdragon 8 Gen 1/SM8450 CPU universal series, Samsung S22/S22 Plus/S22 Ultra/S901/S906/S908, etc. 4. SAM18: Suitable for Exynos 1330-E8535P/1380-E8835P CPU universal series, Samsung A14/A54, etc. 5. SAM19: Suitable for Snapdragon 8 Gen 2 SM8550/8 Gen 3 SM8650 CPU universal series, Samsung S23/S23 Ultra/S24/S24 Ultra, etc. 6. SAM20: Suitable for MediaTek Dimensity 6100+ MT6835V CPU universal series, Samsung A156U/A156E, etc. 7. SAM21: Suitable for Snapdragon 8 Ultimate Edition SM8750 CPU universal series, Samsung S25/S25 Plus, etc.Specification: General Compatible with Samsung:  Galaxy S22 5G , Galaxy S22 Ultra 5G , Galaxy S22+ 5G Package Weight One Package Weight 0.05kgs / 0.12lb One Package Size 10cm * 10cm * 2cm / 3.94inch * 3.94inch * 0.79inch Qty per Carton 360 Carton Weight 19.00kgs / 41.89lb Carton Size 42cm * 32cm * 32cm / 16.54inch * 12.6inch * 12.6inch Loading Container 20GP: 620 cartons * 360 pcs = 223200 pcs 40HQ: 1439 cartons * 360 pcs = 518040 pcs

    $11.36

  • TBD0606473804.jpg@0123398a117767e6e843d4a9fe7b3744

    AMAOE For Samsung BGA Reballing Stencil Soldering Repair Tool, Model: SAM18 A14/A54

    1. SAM15: Suitable for Qualcomm Snapdragon 888 SM8350/Exynos 2100 CPU series, Samsung S21/S21+/S21 Ultra G998U/G996U/Z Flip 3/Z Fold 3/W22, etc. 2. SAM16: Suitable for Exynos 1280/Samsung E8825 CPU universal series, A53/A536, etc. 3. SAM17: Suitable for Exynos 2200/E9925, Snapdragon 8 Gen 1/SM8450 CPU universal series, Samsung S22/S22 Plus/S22 Ultra/S901/S906/S908, etc. 4. SAM18: Suitable for Exynos 1330-E8535P/1380-E8835P CPU universal series, Samsung A14/A54, etc. 5. SAM19: Suitable for Snapdragon 8 Gen 2 SM8550/8 Gen 3 SM8650 CPU universal series, Samsung S23/S23 Ultra/S24/S24 Ultra, etc. 6. SAM20: Suitable for MediaTek Dimensity 6100+ MT6835V CPU universal series, Samsung A156U/A156E, etc. 7. SAM21: Suitable for Snapdragon 8 Ultimate Edition SM8750 CPU universal series, Samsung S25/S25 Plus, etc.Specification: General Compatible with Samsung:  Galaxy A14 4G , Galaxy A54 5G Package Weight One Package Weight 0.05kgs / 0.12lb One Package Size 10cm * 10cm * 2cm / 3.94inch * 3.94inch * 0.79inch Qty per Carton 360 Carton Weight 19.00kgs / 41.89lb Carton Size 42cm * 32cm * 32cm / 16.54inch * 12.6inch * 12.6inch Loading Container 20GP: 620 cartons * 360 pcs = 223200 pcs 40HQ: 1439 cartons * 360 pcs = 518040 pcs

    $11.36

  • TBD0606473805.jpg@3f6381be169685876fd47d30e4579e3c

    AMAOE For Samsung BGA Reballing Stencil Soldering Repair Tool, Model: SAM19 S23/S24

    1. SAM15: Suitable for Qualcomm Snapdragon 888 SM8350/Exynos 2100 CPU series, Samsung S21/S21+/S21 Ultra G998U/G996U/Z Flip 3/Z Fold 3/W22, etc. 2. SAM16: Suitable for Exynos 1280/Samsung E8825 CPU universal series, A53/A536, etc. 3. SAM17: Suitable for Exynos 2200/E9925, Snapdragon 8 Gen 1/SM8450 CPU universal series, Samsung S22/S22 Plus/S22 Ultra/S901/S906/S908, etc. 4. SAM18: Suitable for Exynos 1330-E8535P/1380-E8835P CPU universal series, Samsung A14/A54, etc. 5. SAM19: Suitable for Snapdragon 8 Gen 2 SM8550/8 Gen 3 SM8650 CPU universal series, Samsung S23/S23 Ultra/S24/S24 Ultra, etc. 6. SAM20: Suitable for MediaTek Dimensity 6100+ MT6835V CPU universal series, Samsung A156U/A156E, etc. 7. SAM21: Suitable for Snapdragon 8 Ultimate Edition SM8750 CPU universal series, Samsung S25/S25 Plus, etc.Specification: General Compatible with Samsung:  Galaxy S24 Ultra 5G , Galaxy S24+ 5G , Galaxy S24 5G , Galaxy S23+ 5G , Galaxy S23 Ultra 5G , Galaxy S23 5G Package Weight One Package Weight 0.05kgs / 0.12lb One Package Size 10cm * 10cm * 2cm / 3.94inch * 3.94inch * 0.79inch Qty per Carton 360 Carton Weight 19.00kgs / 41.89lb Carton Size 42cm * 32cm * 32cm / 16.54inch * 12.6inch * 12.6inch Loading Container 20GP: 620 cartons * 360 pcs = 223200 pcs 40HQ: 1439 cartons * 360 pcs = 518040 pcs

    $11.36

  • TBD0606473806.jpg@96cb1ab7dc219ee3ac175b6372cdcf61

    AMAOE For Samsung BGA Reballing Stencil Soldering Repair Tool, Model: SAM20 A156U/A156E

    1. SAM15: Suitable for Qualcomm Snapdragon 888 SM8350/Exynos 2100 CPU series, Samsung S21/S21+/S21 Ultra G998U/G996U/Z Flip 3/Z Fold 3/W22, etc. 2. SAM16: Suitable for Exynos 1280/Samsung E8825 CPU universal series, A53/A536, etc. 3. SAM17: Suitable for Exynos 2200/E9925, Snapdragon 8 Gen 1/SM8450 CPU universal series, Samsung S22/S22 Plus/S22 Ultra/S901/S906/S908, etc. 4. SAM18: Suitable for Exynos 1330-E8535P/1380-E8835P CPU universal series, Samsung A14/A54, etc. 5. SAM19: Suitable for Snapdragon 8 Gen 2 SM8550/8 Gen 3 SM8650 CPU universal series, Samsung S23/S23 Ultra/S24/S24 Ultra, etc. 6. SAM20: Suitable for MediaTek Dimensity 6100+ MT6835V CPU universal series, Samsung A156U/A156E, etc. 7. SAM21: Suitable for Snapdragon 8 Ultimate Edition SM8750 CPU universal series, Samsung S25/S25 Plus, etc.Specification: General Compatible with Samsung:  Galaxy A15 5G Package Weight One Package Weight 0.05kgs / 0.12lb One Package Size 10cm * 10cm * 2cm / 3.94inch * 3.94inch * 0.79inch Qty per Carton 360 Carton Weight 19.00kgs / 41.89lb Carton Size 42cm * 32cm * 32cm / 16.54inch * 12.6inch * 12.6inch Loading Container 20GP: 620 cartons * 360 pcs = 223200 pcs 40HQ: 1439 cartons * 360 pcs = 518040 pcs

    $11.36

  • TBD0606473807.jpg@09b65ae0fff421a0443616478f349c2b

    AMAOE For Samsung BGA Reballing Stencil Soldering Repair Tool, Model: SAM21 S25/S25+

    1. SAM15: Suitable for Qualcomm Snapdragon 888 SM8350/Exynos 2100 CPU series, Samsung S21/S21+/S21 Ultra G998U/G996U/Z Flip 3/Z Fold 3/W22, etc. 2. SAM16: Suitable for Exynos 1280/Samsung E8825 CPU universal series, A53/A536, etc. 3. SAM17: Suitable for Exynos 2200/E9925, Snapdragon 8 Gen 1/SM8450 CPU universal series, Samsung S22/S22 Plus/S22 Ultra/S901/S906/S908, etc. 4. SAM18: Suitable for Exynos 1330-E8535P/1380-E8835P CPU universal series, Samsung A14/A54, etc. 5. SAM19: Suitable for Snapdragon 8 Gen 2 SM8550/8 Gen 3 SM8650 CPU universal series, Samsung S23/S23 Ultra/S24/S24 Ultra, etc. 6. SAM20: Suitable for MediaTek Dimensity 6100+ MT6835V CPU universal series, Samsung A156U/A156E, etc. 7. SAM21: Suitable for Snapdragon 8 Ultimate Edition SM8750 CPU universal series, Samsung S25/S25 Plus, etc.Specification: General Compatible with Samsung:  Galaxy S25+ 5G , Galaxy S25 5G Package Weight One Package Weight 0.05kgs / 0.12lb One Package Size 10cm * 10cm * 2cm / 3.94inch * 3.94inch * 0.79inch Qty per Carton 360 Carton Weight 19.00kgs / 41.89lb Carton Size 42cm * 32cm * 32cm / 16.54inch * 12.6inch * 12.6inch Loading Container 20GP: 620 cartons * 360 pcs = 223200 pcs 40HQ: 1439 cartons * 360 pcs = 518040 pcs

    $11.36

  • EDA010217207.jpg@384a6b8060e6b5c966449b944057af90

    AMAOE Mid Layer Soldering Tool For Huawei Mate60/60 Pro, Model:Mate 60 Mid-frame Mesh Size 0.08

    1. Built-in magnetic base securely locks the positioning plate and dedicated middle-layer stencil.2. Enables rapid and precise alignment of solder pads and stencil, effectively reducing manual offset errors, improving ball placement consistency, and enhancing daily work efficiency in the repair workshop.3. High-temperature resistant, suitable for hot air gun reflow soldering.4. Employs gradient temperature hot air heating to complete solder joint reflow molding, specifically designed for Android high-end motherboard layer repair scenarios.5. Compact desktop design, saving repair table space.6. Specifically designed for Huawei Mate60 and Mate60 Pro dual-layer motherboards, effectively solving the ball placement needs of separated dual-layer motherboard interconnection pads during repair work.Specification: Package Weight One Package Weight 0.02kgs / 0.05lb One Package Size 10cm * 10cm * 5cm / 3.94inch * 3.94inch * 1.97inch Qty per Carton 240 Carton Weight 5.80kgs / 12.79lb Carton Size 62cm * 52cm * 42cm / 24.41inch * 20.47inch * 16.54inch Loading Container 20GP: 196 cartons * 240 pcs = 47040 pcs 40HQ: 457 cartons * 240 pcs = 109680 pcs

    $11.38

  • EDA010217208.jpg@ac564b6ca163880af0a4a3c436c3243b

    AMAOE Mid Layer Soldering Tool For Huawei Mate60/60 Pro, Model:Mate 60 Mid-frame Mesh Size 0.12

    1. Built-in magnetic base securely locks the positioning plate and dedicated middle-layer stencil.2. Enables rapid and precise alignment of solder pads and stencil, effectively reducing manual offset errors, improving ball placement consistency, and enhancing daily work efficiency in the repair workshop.3. High-temperature resistant, suitable for hot air gun reflow soldering.4. Employs gradient temperature hot air heating to complete solder joint reflow molding, specifically designed for Android high-end motherboard layer repair scenarios.5. Compact desktop design, saving repair table space.6. Specifically designed for Huawei Mate60 and Mate60 Pro dual-layer motherboards, effectively solving the ball placement needs of separated dual-layer motherboard interconnection pads during repair work.Specification: Package Weight One Package Weight 0.02kgs / 0.05lb One Package Size 10cm * 10cm * 5cm / 3.94inch * 3.94inch * 1.97inch Qty per Carton 240 Carton Weight 5.80kgs / 12.79lb Carton Size 62cm * 52cm * 42cm / 24.41inch * 20.47inch * 16.54inch Loading Container 20GP: 196 cartons * 240 pcs = 47040 pcs 40HQ: 457 cartons * 240 pcs = 109680 pcs

    $11.40

  • EDA010217205.jpg@fba45d917cc8b89f0cb5df193e23acba

    AMAOE Mid Layer Soldering Tool For Huawei Mate60/60 Pro, Model:Mate 60 Mid-layer Network Board 0.08

    1. Built-in magnetic base securely locks the positioning plate and dedicated middle-layer stencil.2. Enables rapid and precise alignment of solder pads and stencil, effectively reducing manual offset errors, improving ball placement consistency, and enhancing daily work efficiency in the repair workshop.3. High-temperature resistant, suitable for hot air gun reflow soldering.4. Employs gradient temperature hot air heating to complete solder joint reflow molding, specifically designed for Android high-end motherboard layer repair scenarios.5. Compact desktop design, saving repair table space.6. Specifically designed for Huawei Mate60 and Mate60 Pro dual-layer motherboards, effectively solving the ball placement needs of separated dual-layer motherboard interconnection pads during repair work.Specification: Package Weight One Package Weight 0.02kgs / 0.05lb One Package Size 10cm * 10cm * 5cm / 3.94inch * 3.94inch * 1.97inch Qty per Carton 240 Carton Weight 5.80kgs / 12.79lb Carton Size 62cm * 52cm * 42cm / 24.41inch * 20.47inch * 16.54inch Loading Container 20GP: 196 cartons * 240 pcs = 47040 pcs 40HQ: 457 cartons * 240 pcs = 109680 pcs

    $11.40

  • EDA010217206.jpg@98e0b546a51c1818ecf6739c6ae5176e

    AMAOE Mid Layer Soldering Tool For Huawei Mate60/60 Pro, Model:Mate 60 Mid-layer Network Board 0.12

    1. Built-in magnetic base securely locks the positioning plate and dedicated middle-layer stencil.2. Enables rapid and precise alignment of solder pads and stencil, effectively reducing manual offset errors, improving ball placement consistency, and enhancing daily work efficiency in the repair workshop.3. High-temperature resistant, suitable for hot air gun reflow soldering.4. Employs gradient temperature hot air heating to complete solder joint reflow molding, specifically designed for Android high-end motherboard layer repair scenarios.5. Compact desktop design, saving repair table space.6. Specifically designed for Huawei Mate60 and Mate60 Pro dual-layer motherboards, effectively solving the ball placement needs of separated dual-layer motherboard interconnection pads during repair work.Specification: Package Weight One Package Weight 0.02kgs / 0.05lb One Package Size 10cm * 10cm * 5cm / 3.94inch * 3.94inch * 1.97inch Qty per Carton 240 Carton Weight 5.80kgs / 12.79lb Carton Size 62cm * 52cm * 42cm / 24.41inch * 20.47inch * 16.54inch Loading Container 20GP: 196 cartons * 240 pcs = 47040 pcs 40HQ: 457 cartons * 240 pcs = 109680 pcs

    $11.40

  • EDA010217203.jpg@d96d498a016edb6320617030677f36e0

    AMAOE Mid Layer Soldering Tool For Huawei Mate60/60 Pro, Model:Mate 60 Pro Mid-frame Mesh Size 0.08

    1. Built-in magnetic base securely locks the positioning plate and dedicated middle-layer stencil.2. Enables rapid and precise alignment of solder pads and stencil, effectively reducing manual offset errors, improving ball placement consistency, and enhancing daily work efficiency in the repair workshop.3. High-temperature resistant, suitable for hot air gun reflow soldering.4. Employs gradient temperature hot air heating to complete solder joint reflow molding, specifically designed for Android high-end motherboard layer repair scenarios.5. Compact desktop design, saving repair table space.6. Specifically designed for Huawei Mate60 and Mate60 Pro dual-layer motherboards, effectively solving the ball placement needs of separated dual-layer motherboard interconnection pads during repair work.Specification: Package Weight One Package Weight 0.02kgs / 0.05lb One Package Size 10cm * 10cm * 5cm / 3.94inch * 3.94inch * 1.97inch Qty per Carton 240 Carton Weight 5.80kgs / 12.79lb Carton Size 62cm * 52cm * 42cm / 24.41inch * 20.47inch * 16.54inch Loading Container 20GP: 196 cartons * 240 pcs = 47040 pcs 40HQ: 457 cartons * 240 pcs = 109680 pcs

    $11.38

  • EDA010217204.jpg@d7d704dbb364a8c31f63064bc1af055a

    AMAOE Mid Layer Soldering Tool For Huawei Mate60/60 Pro, Model:Mate 60 Pro Mid-frame Mesh Size 0.12

    1. Built-in magnetic base securely locks the positioning plate and dedicated middle-layer stencil.2. Enables rapid and precise alignment of solder pads and stencil, effectively reducing manual offset errors, improving ball placement consistency, and enhancing daily work efficiency in the repair workshop.3. High-temperature resistant, suitable for hot air gun reflow soldering.4. Employs gradient temperature hot air heating to complete solder joint reflow molding, specifically designed for Android high-end motherboard layer repair scenarios.5. Compact desktop design, saving repair table space.6. Specifically designed for Huawei Mate60 and Mate60 Pro dual-layer motherboards, effectively solving the ball placement needs of separated dual-layer motherboard interconnection pads during repair work.Specification: Package Weight One Package Weight 0.02kgs / 0.05lb One Package Size 10cm * 10cm * 5cm / 3.94inch * 3.94inch * 1.97inch Qty per Carton 240 Carton Weight 5.80kgs / 12.79lb Carton Size 62cm * 52cm * 42cm / 24.41inch * 20.47inch * 16.54inch Loading Container 20GP: 196 cartons * 240 pcs = 47040 pcs 40HQ: 457 cartons * 240 pcs = 109680 pcs

    $11.38

  • EDA010217201.jpg@c51f0929fa27d6c5a42f02b25767478d

    AMAOE Mid Layer Soldering Tool For Huawei Mate60/60 Pro, Model:Mate 60 Pro Mid-layer Mesh Board 0.08

    1. Built-in magnetic base securely locks the positioning plate and dedicated middle-layer stencil.2. Enables rapid and precise alignment of solder pads and stencil, effectively reducing manual offset errors, improving ball placement consistency, and enhancing daily work efficiency in the repair workshop.3. High-temperature resistant, suitable for hot air gun reflow soldering.4. Employs gradient temperature hot air heating to complete solder joint reflow molding, specifically designed for Android high-end motherboard layer repair scenarios.5. Compact desktop design, saving repair table space.6. Specifically designed for Huawei Mate60 and Mate60 Pro dual-layer motherboards, effectively solving the ball placement needs of separated dual-layer motherboard interconnection pads during repair work.Specification: Package Weight One Package Weight 0.02kgs / 0.05lb One Package Size 10cm * 10cm * 5cm / 3.94inch * 3.94inch * 1.97inch Qty per Carton 240 Carton Weight 5.80kgs / 12.79lb Carton Size 62cm * 52cm * 42cm / 24.41inch * 20.47inch * 16.54inch Loading Container 20GP: 196 cartons * 240 pcs = 47040 pcs 40HQ: 457 cartons * 240 pcs = 109680 pcs

    $11.40

  • EDA010217202.jpg@562e0e6879217ec63cde9cfb45853627

    AMAOE Mid Layer Soldering Tool For Huawei Mate60/60 Pro, Model:Mate 60 Pro Mid-layer Mesh Board 0.12

    1. Built-in magnetic base securely locks the positioning plate and dedicated middle-layer stencil.2. Enables rapid and precise alignment of solder pads and stencil, effectively reducing manual offset errors, improving ball placement consistency, and enhancing daily work efficiency in the repair workshop.3. High-temperature resistant, suitable for hot air gun reflow soldering.4. Employs gradient temperature hot air heating to complete solder joint reflow molding, specifically designed for Android high-end motherboard layer repair scenarios.5. Compact desktop design, saving repair table space.6. Specifically designed for Huawei Mate60 and Mate60 Pro dual-layer motherboards, effectively solving the ball placement needs of separated dual-layer motherboard interconnection pads during repair work.Specification: Package Weight One Package Weight 0.02kgs / 0.05lb One Package Size 10cm * 10cm * 5cm / 3.94inch * 3.94inch * 1.97inch Qty per Carton 240 Carton Weight 5.80kgs / 12.79lb Carton Size 62cm * 52cm * 42cm / 24.41inch * 20.47inch * 16.54inch Loading Container 20GP: 196 cartons * 240 pcs = 47040 pcs 40HQ: 457 cartons * 240 pcs = 109680 pcs

    $11.38

  • EDA010216301.jpg@43094dd0c4fbd0d43830f8b2da4d9007

    AMAOE RTX3080Ti Laptop Mobile Version Soldering Station, Model:Plant Tin Network

    1. Built-in magnetic base securely locks the positioning frame and stencil, enabling quick and precise alignment of the chip and stencil, preventing misalignment during ball placement.2. Compatible with two common rework processes: applying solder paste or directly placing solder balls.3. The stainless steel stencil can withstand direct heat from a hot air gun, and the robust clamping base ensures stability on the repair bench.4. Compact desktop design, ideal for laptop motherboard maintenance, GPU chip rework, and high-volume repair work.5. Specifically designed for laptop mobile RTX 3080 Ti GN20-E8 graphics chips.Specification: Package Weight One Package Weight 0.03kgs / 0.07lb One Package Size 10cm * 10cm * 5cm / 3.94inch * 3.94inch * 1.97inch Qty per Carton 240 Carton Weight 8.20kgs / 18.08lb Carton Size 62cm * 52cm * 42cm / 24.41inch * 20.47inch * 16.54inch Loading Container 20GP: 196 cartons * 240 pcs = 47040 pcs 40HQ: 457 cartons * 240 pcs = 109680 pcs

    $15.28

  • EDA010216303.jpg@8ef469cc896b01251ba15d16b9ed015c

    AMAOE RTX3080Ti Laptop Mobile Version Soldering Station, Model:Plantation

    1. Built-in magnetic base securely locks the positioning frame and stencil, enabling quick and precise alignment of the chip and stencil, preventing misalignment during ball placement.2. Compatible with two common rework processes: applying solder paste or directly placing solder balls.3. The stainless steel stencil can withstand direct heat from a hot air gun, and the robust clamping base ensures stability on the repair bench.4. Compact desktop design, ideal for laptop motherboard maintenance, GPU chip rework, and high-volume repair work.5. Specifically designed for laptop mobile RTX 3080 Ti GN20-E8 graphics chips.Specification: Package Weight One Package Weight 0.03kgs / 0.07lb One Package Size 10cm * 10cm * 5cm / 3.94inch * 3.94inch * 1.97inch Qty per Carton 240 Carton Weight 8.20kgs / 18.08lb Carton Size 62cm * 52cm * 42cm / 24.41inch * 20.47inch * 16.54inch Loading Container 20GP: 196 cartons * 240 pcs = 47040 pcs 40HQ: 457 cartons * 240 pcs = 109680 pcs

    $69.55

  • EDA010216302.jpg@1053e63a05e435d035354ea0fc4c3888

    AMAOE RTX3080Ti Laptop Mobile Version Soldering Station, Model:Positioning Plate

    1. Built-in magnetic base securely locks the positioning frame and stencil, enabling quick and precise alignment of the chip and stencil, preventing misalignment during ball placement.2. Compatible with two common rework processes: applying solder paste or directly placing solder balls.3. The stainless steel stencil can withstand direct heat from a hot air gun, and the robust clamping base ensures stability on the repair bench.4. Compact desktop design, ideal for laptop motherboard maintenance, GPU chip rework, and high-volume repair work.5. Specifically designed for laptop mobile RTX 3080 Ti GN20-E8 graphics chips.Specification: Package Weight One Package Weight 0.03kgs / 0.07lb One Package Size 10cm * 10cm * 5cm / 3.94inch * 3.94inch * 1.97inch Qty per Carton 240 Carton Weight 8.20kgs / 18.08lb Carton Size 62cm * 52cm * 42cm / 24.41inch * 20.47inch * 16.54inch Loading Container 20GP: 196 cartons * 240 pcs = 47040 pcs 40HQ: 457 cartons * 240 pcs = 109680 pcs

    $29.64

  • EDA010210401.jpg@5ad5ea8911aa156b219720961f830a9e

    AMAOE S938 Mid Layer Tin Plating Tool For Galaxy S25 Ultra, Model:Full Set

    1. Specialized repair tool designed for mid-layer tin plating work on the S25 Ultra.2. Facilitates precise solder plating and restoration during advanced smartphone motherboard repair.3. Helps technicians perform controlled tin plating work on fine motherboard areas and connection points.4. Suitable for professional technicians handling PCB repair, solder restoration and component-level maintenance.5. A practical tool for mobile phone repair shops, motherboard technicians and electronics repair workstations.6. Note: Only for Samsung Galaxy S25 Ultra.Specification: Package Weight One Package Weight 0.05kgs / 0.12lb One Package Size 10cm * 10cm * 5cm / 3.94inch * 3.94inch * 1.97inch Qty per Carton 160 Carton Weight 9.00kgs / 19.84lb Carton Size 42cm * 42cm * 52cm / 16.54inch * 16.54inch * 20.47inch Loading Container 20GP: 290 cartons * 160 pcs = 46400 pcs 40HQ: 674 cartons * 160 pcs = 107840 pcs

    $59.85

  • EDA010210404.jpg@50ddecc7061336f395eab963a796b03b

    AMAOE S938 Mid Layer Tin Plating Tool For Galaxy S25 Ultra, Model:Only Base

    1. Specialized repair tool designed for mid-layer tin plating work on the S25 Ultra.2. Facilitates precise solder plating and restoration during advanced smartphone motherboard repair.3. Helps technicians perform controlled tin plating work on fine motherboard areas and connection points.4. Suitable for professional technicians handling PCB repair, solder restoration and component-level maintenance.5. A practical tool for mobile phone repair shops, motherboard technicians and electronics repair workstations.6. Note: Only for Samsung Galaxy S25 Ultra.Specification: Package Weight One Package Weight 0.05kgs / 0.12lb One Package Size 10cm * 10cm * 5cm / 3.94inch * 3.94inch * 1.97inch Qty per Carton 160 Carton Weight 9.00kgs / 19.84lb Carton Size 42cm * 42cm * 52cm / 16.54inch * 16.54inch * 20.47inch Loading Container 20GP: 290 cartons * 160 pcs = 46400 pcs 40HQ: 674 cartons * 160 pcs = 107840 pcs

    $38.42

  • EDA010210403.jpg@b3d28fe0e33d7f915fa93205b8f887c7

    AMAOE S938 Mid Layer Tin Plating Tool For Galaxy S25 Ultra, Model:Only Stencil

    1. Specialized repair tool designed for mid-layer tin plating work on the S25 Ultra.2. Facilitates precise solder plating and restoration during advanced smartphone motherboard repair.3. Helps technicians perform controlled tin plating work on fine motherboard areas and connection points.4. Suitable for professional technicians handling PCB repair, solder restoration and component-level maintenance.5. A practical tool for mobile phone repair shops, motherboard technicians and electronics repair workstations.6. Note: Only for Samsung Galaxy S25 Ultra.Specification: Package Weight One Package Weight 0.05kgs / 0.12lb One Package Size 10cm * 10cm * 5cm / 3.94inch * 3.94inch * 1.97inch Qty per Carton 160 Carton Weight 9.00kgs / 19.84lb Carton Size 42cm * 42cm * 52cm / 16.54inch * 16.54inch * 20.47inch Loading Container 20GP: 290 cartons * 160 pcs = 46400 pcs 40HQ: 674 cartons * 160 pcs = 107840 pcs

    $11.89

  • EDA010210402.jpg@b05ab7aa22cee3f1739cdda4f7294358

    AMAOE S938 Mid Layer Tin Plating Tool For Galaxy S25 Ultra, Model:Positioning Plate

    1. Specialized repair tool designed for mid-layer tin plating work on the S25 Ultra.2. Facilitates precise solder plating and restoration during advanced smartphone motherboard repair.3. Helps technicians perform controlled tin plating work on fine motherboard areas and connection points.4. Suitable for professional technicians handling PCB repair, solder restoration and component-level maintenance.5. A practical tool for mobile phone repair shops, motherboard technicians and electronics repair workstations.6. Note: Only for Samsung Galaxy S25 Ultra.Specification: Package Weight One Package Weight 0.05kgs / 0.12lb One Package Size 10cm * 10cm * 5cm / 3.94inch * 3.94inch * 1.97inch Qty per Carton 160 Carton Weight 9.00kgs / 19.84lb Carton Size 42cm * 42cm * 52cm / 16.54inch * 16.54inch * 20.47inch Loading Container 20GP: 290 cartons * 160 pcs = 46400 pcs 40HQ: 674 cartons * 160 pcs = 107840 pcs

    $24.72

  • EDA010220901.jpg@f1e4ab7ef5aef4a02a85f12b60031189

    AMAOE Soldering Tool, Model:CXD90060GG Positioning Plate

    1. Built-in magnetic base securely locks the positioning plate and dedicated middle-layer stencil.2. Enables rapid and precise alignment of solder pads and stencil, effectively reducing manual offset errors, improving ball placement consistency, and enhancing daily work efficiency in the repair workshop.3. High-temperature resistant, suitable for hot air gun reflow soldering.4. Employs gradient temperature hot air heating to complete solder joint reflow molding, specifically designed for Android high-end motherboard layer repair scenarios.5. Compact desktop design, saving repair table space.Specification: Package Weight One Package Weight 0.05kgs / 0.12lb One Package Size 10cm * 10cm * 5cm / 3.94inch * 3.94inch * 1.97inch Qty per Carton 240 Carton Weight 13.00kgs / 28.66lb Carton Size 62cm * 52cm * 42cm / 24.41inch * 20.47inch * 16.54inch Loading Container 20GP: 196 cartons * 240 pcs = 47040 pcs 40HQ: 457 cartons * 240 pcs = 109680 pcs

    $26.38

  • EDA010220902.jpg@00b66666d50d5d09763e816439da63b7

    AMAOE Soldering Tool, Model:CXD90060GG Stencil

    1. Built-in magnetic base securely locks the positioning plate and dedicated middle-layer stencil.2. Enables rapid and precise alignment of solder pads and stencil, effectively reducing manual offset errors, improving ball placement consistency, and enhancing daily work efficiency in the repair workshop.3. High-temperature resistant, suitable for hot air gun reflow soldering.4. Employs gradient temperature hot air heating to complete solder joint reflow molding, specifically designed for Android high-end motherboard layer repair scenarios.5. Compact desktop design, saving repair table space.Specification: Package Weight One Package Weight 0.05kgs / 0.12lb One Package Size 10cm * 10cm * 5cm / 3.94inch * 3.94inch * 1.97inch Qty per Carton 240 Carton Weight 13.00kgs / 28.66lb Carton Size 62cm * 52cm * 42cm / 24.41inch * 20.47inch * 16.54inch Loading Container 20GP: 196 cartons * 240 pcs = 47040 pcs 40HQ: 457 cartons * 240 pcs = 109680 pcs

    $15.31

  • EDA010220903.jpg@e625e310c08ca07657ba043cbfe67255

    AMAOE Soldering Tool, Model:CXD90060GG Tin Plant

    1. Built-in magnetic base securely locks the positioning plate and dedicated middle-layer stencil.2. Enables rapid and precise alignment of solder pads and stencil, effectively reducing manual offset errors, improving ball placement consistency, and enhancing daily work efficiency in the repair workshop.3. High-temperature resistant, suitable for hot air gun reflow soldering.4. Employs gradient temperature hot air heating to complete solder joint reflow molding, specifically designed for Android high-end motherboard layer repair scenarios.5. Compact desktop design, saving repair table space.Specification: Package Weight One Package Weight 0.05kgs / 0.12lb One Package Size 10cm * 10cm * 5cm / 3.94inch * 3.94inch * 1.97inch Qty per Carton 240 Carton Weight 13.00kgs / 28.66lb Carton Size 62cm * 52cm * 42cm / 24.41inch * 20.47inch * 16.54inch Loading Container 20GP: 196 cartons * 240 pcs = 47040 pcs 40HQ: 457 cartons * 240 pcs = 109680 pcs

    $65.79

  • EDA010220906.jpg@a632e91ce7b71c8f84221b39f465e5cf

    AMAOE Soldering Tool, Model:CXD90061GG Planting Tin Network

    1. Built-in magnetic base securely locks the positioning plate and dedicated middle-layer stencil.2. Enables rapid and precise alignment of solder pads and stencil, effectively reducing manual offset errors, improving ball placement consistency, and enhancing daily work efficiency in the repair workshop.3. High-temperature resistant, suitable for hot air gun reflow soldering.4. Employs gradient temperature hot air heating to complete solder joint reflow molding, specifically designed for Android high-end motherboard layer repair scenarios.5. Compact desktop design, saving repair table space.Specification: Package Weight One Package Weight 0.05kgs / 0.12lb One Package Size 10cm * 10cm * 5cm / 3.94inch * 3.94inch * 1.97inch Qty per Carton 240 Carton Weight 13.00kgs / 28.66lb Carton Size 62cm * 52cm * 42cm / 24.41inch * 20.47inch * 16.54inch Loading Container 20GP: 196 cartons * 240 pcs = 47040 pcs 40HQ: 457 cartons * 240 pcs = 109680 pcs

    $15.28

  • EDA010220904.jpg@3fc3ce6255754f70005b9c6a26143294

    AMAOE Soldering Tool, Model:CXD90061GG Tin Plant

    1. Built-in magnetic base securely locks the positioning plate and dedicated middle-layer stencil.2. Enables rapid and precise alignment of solder pads and stencil, effectively reducing manual offset errors, improving ball placement consistency, and enhancing daily work efficiency in the repair workshop.3. High-temperature resistant, suitable for hot air gun reflow soldering.4. Employs gradient temperature hot air heating to complete solder joint reflow molding, specifically designed for Android high-end motherboard layer repair scenarios.5. Compact desktop design, saving repair table space.Specification: Package Weight One Package Weight 0.05kgs / 0.12lb One Package Size 10cm * 10cm * 5cm / 3.94inch * 3.94inch * 1.97inch Qty per Carton 240 Carton Weight 13.00kgs / 28.66lb Carton Size 62cm * 52cm * 42cm / 24.41inch * 20.47inch * 16.54inch Loading Container 20GP: 196 cartons * 240 pcs = 47040 pcs 40HQ: 457 cartons * 240 pcs = 109680 pcs

    $26.40

  • EDA010220905.jpg@66d9fd13c96ef7deeead14423b752047

    AMAOE Soldering Tool, Model:CXD90061GG Tin Planting Platform

    1. Built-in magnetic base securely locks the positioning plate and dedicated middle-layer stencil.2. Enables rapid and precise alignment of solder pads and stencil, effectively reducing manual offset errors, improving ball placement consistency, and enhancing daily work efficiency in the repair workshop.3. High-temperature resistant, suitable for hot air gun reflow soldering.4. Employs gradient temperature hot air heating to complete solder joint reflow molding, specifically designed for Android high-end motherboard layer repair scenarios.5. Compact desktop design, saving repair table space.Specification: Package Weight One Package Weight 0.05kgs / 0.12lb One Package Size 10cm * 10cm * 5cm / 3.94inch * 3.94inch * 1.97inch Qty per Carton 240 Carton Weight 13.00kgs / 28.66lb Carton Size 62cm * 52cm * 42cm / 24.41inch * 20.47inch * 16.54inch Loading Container 20GP: 196 cartons * 240 pcs = 47040 pcs 40HQ: 457 cartons * 240 pcs = 109680 pcs

    $61.95

  • EDA010220910.jpg@5994e43fcdb6c9b303e48d2e5940ad0c

    AMAOE Soldering Tool, Model:CXD90062GG Planting Tin Network

    1. Built-in magnetic base securely locks the positioning plate and dedicated middle-layer stencil.2. Enables rapid and precise alignment of solder pads and stencil, effectively reducing manual offset errors, improving ball placement consistency, and enhancing daily work efficiency in the repair workshop.3. High-temperature resistant, suitable for hot air gun reflow soldering.4. Employs gradient temperature hot air heating to complete solder joint reflow molding, specifically designed for Android high-end motherboard layer repair scenarios.5. Compact desktop design, saving repair table space.Specification: Package Weight One Package Weight 0.05kgs / 0.12lb One Package Size 10cm * 10cm * 5cm / 3.94inch * 3.94inch * 1.97inch Qty per Carton 240 Carton Weight 13.00kgs / 28.66lb Carton Size 62cm * 52cm * 42cm / 24.41inch * 20.47inch * 16.54inch Loading Container 20GP: 196 cartons * 240 pcs = 47040 pcs 40HQ: 457 cartons * 240 pcs = 109680 pcs

    $15.31

  • EDA010220907.jpg@b4c54a71fa17cc2ec8154be7fe10b94a

    AMAOE Soldering Tool, Model:CXD90062GG Positioning Plate

    1. Built-in magnetic base securely locks the positioning plate and dedicated middle-layer stencil.2. Enables rapid and precise alignment of solder pads and stencil, effectively reducing manual offset errors, improving ball placement consistency, and enhancing daily work efficiency in the repair workshop.3. High-temperature resistant, suitable for hot air gun reflow soldering.4. Employs gradient temperature hot air heating to complete solder joint reflow molding, specifically designed for Android high-end motherboard layer repair scenarios.5. Compact desktop design, saving repair table space.Specification: Package Weight One Package Weight 0.05kgs / 0.12lb One Package Size 10cm * 10cm * 5cm / 3.94inch * 3.94inch * 1.97inch Qty per Carton 240 Carton Weight 13.00kgs / 28.66lb Carton Size 62cm * 52cm * 42cm / 24.41inch * 20.47inch * 16.54inch Loading Container 20GP: 196 cartons * 240 pcs = 47040 pcs 40HQ: 457 cartons * 240 pcs = 109680 pcs

    $26.40

  • EDA010220908.jpg@f5333270f27213fd4496a254c834db5f

    AMAOE Soldering Tool, Model:CXD90062GG Tin Planting Platform

    1. Built-in magnetic base securely locks the positioning plate and dedicated middle-layer stencil.2. Enables rapid and precise alignment of solder pads and stencil, effectively reducing manual offset errors, improving ball placement consistency, and enhancing daily work efficiency in the repair workshop.3. High-temperature resistant, suitable for hot air gun reflow soldering.4. Employs gradient temperature hot air heating to complete solder joint reflow molding, specifically designed for Android high-end motherboard layer repair scenarios.5. Compact desktop design, saving repair table space.Specification: Package Weight One Package Weight 0.05kgs / 0.12lb One Package Size 10cm * 10cm * 5cm / 3.94inch * 3.94inch * 1.97inch Qty per Carton 240 Carton Weight 13.00kgs / 28.66lb Carton Size 62cm * 52cm * 42cm / 24.41inch * 20.47inch * 16.54inch Loading Container 20GP: 196 cartons * 240 pcs = 47040 pcs 40HQ: 457 cartons * 240 pcs = 109680 pcs

    $61.88

  • EDA010220909.jpg@66d2bf825c02ef581eace4309222dc79

    AMAOE Soldering Tool, Model:Double Magnet Base

    1. Built-in magnetic base securely locks the positioning plate and dedicated middle-layer stencil.2. Enables rapid and precise alignment of solder pads and stencil, effectively reducing manual offset errors, improving ball placement consistency, and enhancing daily work efficiency in the repair workshop.3. High-temperature resistant, suitable for hot air gun reflow soldering.4. Employs gradient temperature hot air heating to complete solder joint reflow molding, specifically designed for Android high-end motherboard layer repair scenarios.5. Compact desktop design, saving repair table space.Specification: Package Weight One Package Weight 0.05kgs / 0.12lb One Package Size 10cm * 10cm * 5cm / 3.94inch * 3.94inch * 1.97inch Qty per Carton 240 Carton Weight 13.00kgs / 28.66lb Carton Size 62cm * 52cm * 42cm / 24.41inch * 20.47inch * 16.54inch Loading Container 20GP: 196 cartons * 240 pcs = 47040 pcs 40HQ: 457 cartons * 240 pcs = 109680 pcs

    $33.69

  • EDA010215313.jpg@88fd52b04294e0e500861a53fb764a5c

    AMAOE Tin Plating Tool, Model:A18/18Pro/A19 Upper-layer RAM

    1. Designed specifically for reinstalling CPU, RAM, NAND flash memory, and other BGA-packaged chips on smartphone motherboards.2. Built-in magnetic base securely holds the positioning plate and stencil, enabling fast and accurate chip stencil alignment.3. Excellent high-temperature resistance, suitable for hot air gun reflow soldering.4. Helps form uniform, rounded solder balls, reducing the risk of bridging or missing solder balls.5. Suitable for high-volume chip refurbishment in repair shops.6. Compact desktop design, for mobile phone repair shops and repair labs.Specification: Package Weight One Package Weight 0.03kgs / 0.07lb One Package Size 10cm * 10cm * 5cm / 3.94inch * 3.94inch * 1.97inch Qty per Carton 160 Carton Weight 5.80kgs / 12.79lb Carton Size 52cm * 42cm * 42cm / 20.47inch * 16.54inch * 16.54inch Loading Container 20GP: 290 cartons * 160 pcs = 46400 pcs 40HQ: 674 cartons * 160 pcs = 107840 pcs

    $11.84

  • EDA010215301.jpg@b20f11449af261fee493d020bf99206c

    AMAOE Tin Plating Tool, Model:A19 Lower Half-Engraving Edition

    1. Designed specifically for reinstalling CPU, RAM, NAND flash memory, and other BGA-packaged chips on smartphone motherboards.2. Built-in magnetic base securely holds the positioning plate and stencil, enabling fast and accurate chip stencil alignment.3. Excellent high-temperature resistance, suitable for hot air gun reflow soldering.4. Helps form uniform, rounded solder balls, reducing the risk of bridging or missing solder balls.5. Suitable for high-volume chip refurbishment in repair shops.6. Compact desktop design, for mobile phone repair shops and repair labs.Specification: Package Weight One Package Weight 0.03kgs / 0.07lb One Package Size 10cm * 10cm * 5cm / 3.94inch * 3.94inch * 1.97inch Qty per Carton 160 Carton Weight 5.80kgs / 12.79lb Carton Size 52cm * 42cm * 42cm / 20.47inch * 16.54inch * 16.54inch Loading Container 20GP: 290 cartons * 160 pcs = 46400 pcs 40HQ: 674 cartons * 160 pcs = 107840 pcs

    $11.91

  • EDA010215302.jpg@40b9eeebc2c0347a2cffc6be93259a1f

    AMAOE Tin Plating Tool, Model:A19 Lower Layer Engraved Plate

    1. Designed specifically for reinstalling CPU, RAM, NAND flash memory, and other BGA-packaged chips on smartphone motherboards.2. Built-in magnetic base securely holds the positioning plate and stencil, enabling fast and accurate chip stencil alignment.3. Excellent high-temperature resistance, suitable for hot air gun reflow soldering.4. Helps form uniform, rounded solder balls, reducing the risk of bridging or missing solder balls.5. Suitable for high-volume chip refurbishment in repair shops.6. Compact desktop design, for mobile phone repair shops and repair labs.Specification: Package Weight One Package Weight 0.03kgs / 0.07lb One Package Size 10cm * 10cm * 5cm / 3.94inch * 3.94inch * 1.97inch Qty per Carton 160 Carton Weight 5.80kgs / 12.79lb Carton Size 52cm * 42cm * 42cm / 20.47inch * 16.54inch * 16.54inch Loading Container 20GP: 290 cartons * 160 pcs = 46400 pcs 40HQ: 674 cartons * 160 pcs = 107840 pcs

    $11.91

  • EDA010215303.jpg@f1201397fc8ee9741aee37f7989d1a47

    AMAOE Tin Plating Tool, Model:A19 Pro Lower Half-Engraving

    1. Designed specifically for reinstalling CPU, RAM, NAND flash memory, and other BGA-packaged chips on smartphone motherboards.2. Built-in magnetic base securely holds the positioning plate and stencil, enabling fast and accurate chip stencil alignment.3. Excellent high-temperature resistance, suitable for hot air gun reflow soldering.4. Helps form uniform, rounded solder balls, reducing the risk of bridging or missing solder balls.5. Suitable for high-volume chip refurbishment in repair shops.6. Compact desktop design, for mobile phone repair shops and repair labs.Specification: Package Weight One Package Weight 0.03kgs / 0.07lb One Package Size 10cm * 10cm * 5cm / 3.94inch * 3.94inch * 1.97inch Qty per Carton 160 Carton Weight 5.80kgs / 12.79lb Carton Size 52cm * 42cm * 42cm / 20.47inch * 16.54inch * 16.54inch Loading Container 20GP: 290 cartons * 160 pcs = 46400 pcs 40HQ: 674 cartons * 160 pcs = 107840 pcs

    $11.91

  • EDA010215304.jpg@30dac8cbd1f0005d66576c07fb80e609

    AMAOE Tin Plating Tool, Model:A19 Pro Lower Layer Engraving

    1. Designed specifically for reinstalling CPU, RAM, NAND flash memory, and other BGA-packaged chips on smartphone motherboards.2. Built-in magnetic base securely holds the positioning plate and stencil, enabling fast and accurate chip stencil alignment.3. Excellent high-temperature resistance, suitable for hot air gun reflow soldering.4. Helps form uniform, rounded solder balls, reducing the risk of bridging or missing solder balls.5. Suitable for high-volume chip refurbishment in repair shops.6. Compact desktop design, for mobile phone repair shops and repair labs.Specification: Package Weight One Package Weight 0.03kgs / 0.07lb One Package Size 10cm * 10cm * 5cm / 3.94inch * 3.94inch * 1.97inch Qty per Carton 160 Carton Weight 5.80kgs / 12.79lb Carton Size 52cm * 42cm * 42cm / 20.47inch * 16.54inch * 16.54inch Loading Container 20GP: 290 cartons * 160 pcs = 46400 pcs 40HQ: 674 cartons * 160 pcs = 107840 pcs

    $11.89

  • EDA010215314.jpg@6b8a3c749e7b9c0cd84cfe0314ac23c8

    AMAOE Tin Plating Tool, Model:A19 Pro Upper-layer RAM

    1. Designed specifically for reinstalling CPU, RAM, NAND flash memory, and other BGA-packaged chips on smartphone motherboards.2. Built-in magnetic base securely holds the positioning plate and stencil, enabling fast and accurate chip stencil alignment.3. Excellent high-temperature resistance, suitable for hot air gun reflow soldering.4. Helps form uniform, rounded solder balls, reducing the risk of bridging or missing solder balls.5. Suitable for high-volume chip refurbishment in repair shops.6. Compact desktop design, for mobile phone repair shops and repair labs.Specification: Package Weight One Package Weight 0.03kgs / 0.07lb One Package Size 10cm * 10cm * 5cm / 3.94inch * 3.94inch * 1.97inch Qty per Carton 160 Carton Weight 5.80kgs / 12.79lb Carton Size 52cm * 42cm * 42cm / 20.47inch * 16.54inch * 16.54inch Loading Container 20GP: 290 cartons * 160 pcs = 46400 pcs 40HQ: 674 cartons * 160 pcs = 107840 pcs

    $11.84

  • EDA010215306.jpg@5f1704638c03a5a792a59a3f801fe293

    AMAOE Tin Plating Tool, Model:A19/Pro 1 Board 2 Mesh Half-cut

    1. Designed specifically for reinstalling CPU, RAM, NAND flash memory, and other BGA-packaged chips on smartphone motherboards.2. Built-in magnetic base securely holds the positioning plate and stencil, enabling fast and accurate chip stencil alignment.3. Excellent high-temperature resistance, suitable for hot air gun reflow soldering.4. Helps form uniform, rounded solder balls, reducing the risk of bridging or missing solder balls.5. Suitable for high-volume chip refurbishment in repair shops.6. Compact desktop design, for mobile phone repair shops and repair labs.Specification: Package Weight One Package Weight 0.03kgs / 0.07lb One Package Size 10cm * 10cm * 5cm / 3.94inch * 3.94inch * 1.97inch Qty per Carton 160 Carton Weight 5.80kgs / 12.79lb Carton Size 52cm * 42cm * 42cm / 20.47inch * 16.54inch * 16.54inch Loading Container 20GP: 290 cartons * 160 pcs = 46400 pcs 40HQ: 674 cartons * 160 pcs = 107840 pcs

    $30.24

  • EDA010215307.jpg@368a58bb067a335c046448ae0b1016bd

    AMAOE Tin Plating Tool, Model:A19/Pro 1 Board 2 Mesh Printing

    1. Designed specifically for reinstalling CPU, RAM, NAND flash memory, and other BGA-packaged chips on smartphone motherboards.2. Built-in magnetic base securely holds the positioning plate and stencil, enabling fast and accurate chip stencil alignment.3. Excellent high-temperature resistance, suitable for hot air gun reflow soldering.4. Helps form uniform, rounded solder balls, reducing the risk of bridging or missing solder balls.5. Suitable for high-volume chip refurbishment in repair shops.6. Compact desktop design, for mobile phone repair shops and repair labs.Specification: Package Weight One Package Weight 0.03kgs / 0.07lb One Package Size 10cm * 10cm * 5cm / 3.94inch * 3.94inch * 1.97inch Qty per Carton 160 Carton Weight 5.80kgs / 12.79lb Carton Size 52cm * 42cm * 42cm / 20.47inch * 16.54inch * 16.54inch Loading Container 20GP: 290 cartons * 160 pcs = 46400 pcs 40HQ: 674 cartons * 160 pcs = 107840 pcs

    $30.24

  • EDA010215308.jpg@5e5a66b9ec10c031358f67390848f63c

    AMAOE Tin Plating Tool, Model:A19/Pro Plating Stand Half-Cut

    1. Designed specifically for reinstalling CPU, RAM, NAND flash memory, and other BGA-packaged chips on smartphone motherboards.2. Built-in magnetic base securely holds the positioning plate and stencil, enabling fast and accurate chip stencil alignment.3. Excellent high-temperature resistance, suitable for hot air gun reflow soldering.4. Helps form uniform, rounded solder balls, reducing the risk of bridging or missing solder balls.5. Suitable for high-volume chip refurbishment in repair shops.6. Compact desktop design, for mobile phone repair shops and repair labs.Specification: Package Weight One Package Weight 0.03kgs / 0.07lb One Package Size 10cm * 10cm * 5cm / 3.94inch * 3.94inch * 1.97inch Qty per Carton 160 Carton Weight 5.80kgs / 12.79lb Carton Size 52cm * 42cm * 42cm / 20.47inch * 16.54inch * 16.54inch Loading Container 20GP: 290 cartons * 160 pcs = 46400 pcs 40HQ: 674 cartons * 160 pcs = 107840 pcs

    $53.87

  • EDA010215309.jpg@d3c81e4ecb057f21c1b7cc17a9c15d2c

    AMAOE Tin Plating Tool, Model:A19/Pro Plating Station Engraving

    1. Designed specifically for reinstalling CPU, RAM, NAND flash memory, and other BGA-packaged chips on smartphone motherboards.2. Built-in magnetic base securely holds the positioning plate and stencil, enabling fast and accurate chip stencil alignment.3. Excellent high-temperature resistance, suitable for hot air gun reflow soldering.4. Helps form uniform, rounded solder balls, reducing the risk of bridging or missing solder balls.5. Suitable for high-volume chip refurbishment in repair shops.6. Compact desktop design, for mobile phone repair shops and repair labs.Specification: Package Weight One Package Weight 0.03kgs / 0.07lb One Package Size 10cm * 10cm * 5cm / 3.94inch * 3.94inch * 1.97inch Qty per Carton 160 Carton Weight 5.80kgs / 12.79lb Carton Size 52cm * 42cm * 42cm / 20.47inch * 16.54inch * 16.54inch Loading Container 20GP: 290 cartons * 160 pcs = 46400 pcs 40HQ: 674 cartons * 160 pcs = 107840 pcs

    $53.87

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