Repair Tools Manual

1. Built-in strong magnet firmly secures various BGA stencils, preventing stencil shifting during soldering and ensuring precise placement.2. Comes with a high-temperature resistant silicone pad, able to withstand high-temperature operation with a hot air gun, resistant to melting and deformation, heat-resistant and durable, suitable for long-term chip soldering repairs.3. Arc-shaped fitting design ensures a tight fit with the stencil without gaps, reducing solder leakage and significantly improving the success rate of soldering.4. Widely compatible with the full range of 2UUL soldering stencils, supporting CPU, IC chips, and motherboard BGA soldering, meeting various repair scenarios for mobile phone motherboards.5. Does not occupy workbench space, easy to store and carry, suitable for repair shops and on-site repair technicians.6. Simple disassembly and assembly, easy cleaning of solder paste residue, reusable.Specification: Package Weight One Package Weight 0.17kgs / 0.38lb One Package Size 9cm * 7cm * 2cm / 3.54inch * 2.76inch * 0.79inch Qty per Carton 120 Carton Weight 21.40kgs / 47.18lb Carton Size 38cm * 23cm * 22cm / 14.96inch * 9.06inch * 8.66inch Loading Container 20GP: 1386 cartons * 120 pcs = 166320 pcs 40HQ: 3219 cartons * 120 pcs = 386280 pcs

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1. Provides a safe and comfortable grip, stable operation for both left and right hands.2. Precision-machined blades efficiently remove solder without damaging the delicate stencil.3. Available in 15mm and 9mm blade widths to meet different soldering needs.4. Anti-roll design prevents the tool from rolling off the work surface, keeping the work area clean and organized.5. Package contents: Solder blades x2Specification: Package Weight One Package Weight 0.04kgs / 0.10lb One Package Size 21cm * 7cm * 2cm / 8.27inch * 2.76inch * 0.79inch Qty per Carton 280 Carton Weight 12.20kgs / 26.90lb Carton Size 51cm * 44cm * 42cm / 20.08inch * 17.32inch * 16.54inch Loading Container 20GP: 282 cartons * 280 pcs = 78960 pcs 40HQ: 656 cartons * 280 pcs = 183680 pcs

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1. Specialized repair tool designed for mid-layer tin plating work on the S25 Ultra.2. Facilitates precise solder plating and restoration during advanced smartphone motherboard repair.3. Helps technicians perform controlled tin plating work on fine motherboard areas and connection points.4. Suitable for professional technicians handling PCB repair, solder restoration and component-level maintenance.5. A practical tool for mobile phone repair shops, motherboard technicians and electronics repair workstations.6. Note: Only for Samsung Galaxy S25 Ultra.Specification: Package Weight One Package Weight 0.05kgs / 0.12lb One Package Size 10cm * 10cm * 5cm / 3.94inch * 3.94inch * 1.97inch Qty per Carton 160 Carton Weight 9.00kgs / 19.84lb Carton Size 42cm * 42cm * 52cm / 16.54inch * 16.54inch * 20.47inch Loading Container 20GP: 290 cartons * 160 pcs = 46400 pcs 40HQ: 674 cartons * 160 pcs = 107840 pcs

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1. Specialized repair tool designed for mid-layer tin plating work on the S25 Ultra.2. Facilitates precise solder plating and restoration during advanced smartphone motherboard repair.3. Helps technicians perform controlled tin plating work on fine motherboard areas and connection points.4. Suitable for professional technicians handling PCB repair, solder restoration and component-level maintenance.5. A practical tool for mobile phone repair shops, motherboard technicians and electronics repair workstations.6. Note: Only for Samsung Galaxy S25 Ultra.Specification: Package Weight One Package Weight 0.05kgs / 0.12lb One Package Size 10cm * 10cm * 5cm / 3.94inch * 3.94inch * 1.97inch Qty per Carton 160 Carton Weight 9.00kgs / 19.84lb Carton Size 42cm * 42cm * 52cm / 16.54inch * 16.54inch * 20.47inch Loading Container 20GP: 290 cartons * 160 pcs = 46400 pcs 40HQ: 674 cartons * 160 pcs = 107840 pcs

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1. Made of high-carbon steel, offering high toughness and corrosion resistance, preventing breakage during adhesive removal and screen disassembly.2. Ultra-thin at 0.01mm, with a flexible texture, allowing it to reach into narrow gaps between the screen and frame, cleaning adhesive layers without scratching the casing.3. Double-edged, sharp blade for cutting screen sealant and removing frame adhesive, suitable for both flat and curved screen disassembly.4. A longer blade is suitable for curved screens, while a shorter blade is suitable for flat screens, improving repair efficiency.5. Individually packaged for convenient access and storage, reducing the risk of blade scratches.Specification: Package Weight One Package Weight 0.12kgs / 0.27lb One Package Size 14cm * 11cm * 2cm / 5.51inch * 4.33inch * 0.79inch Qty per Carton 150 Carton Weight 19.00kgs / 41.89lb Carton Size 57cm * 44cm * 22cm / 22.44inch * 17.32inch * 8.66inch Loading Container 20GP: 483 cartons * 150 pcs = 72450 pcs 40HQ: 1121 cartons * 150 pcs = 168150 pcs

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1. Made of highly durable, anti-static silicone material with a diamond-shaped heat dissipation vent design on the bottom, it offers excellent high-temperature resistance and resistance to deformation, making it suitable for desoldering with a heat gun and circuit board repairs.2. One corner of the work mat features an integrated, multi-functional rotating screwdriver/tweezers holder, allowing repair tools to be stored upright to keep the work surface neat and organized.3. Equipped with compartmentalized storage slots to prevent screws and small parts from rolling away.4. Features a portable phone holder, making it convenient to view the screen or consult schematics during repairs.5. The edges feature a flush-edge design, allowing for smoother and more convenient cleaning of debris, solder residue, or grease, and preventing the buildup of dirt.6. Material: Silicone7. Thickness: Approx. 4 mm8. Dimensions: Approx. 45 x 28 cm / 79 x 30 cm9. Weight: Approx. 650 g for the 45 x 28 cm model; approx. 1200 g for the 79 x 30 cm model10. Note: Includes only the mat; no other items are includedSpecification: Package Weight One Package Weight 0.67kgs / 1.49lb One Package Size 30cm * 10cm * 10cm / 11.81inch * 3.94inch * 3.94inch Qty per Carton 20 Carton Weight 14.40kgs / 31.75lb Carton Size 52cm * 42cm * 32cm / 20.47inch * 16.54inch * 12.6inch Loading Container 20GP: 381 cartons * 20 pcs = 7620 pcs 40HQ: 885 cartons * 20 pcs = 17700 pcs

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1. Made of highly durable, anti-static silicone material with a diamond-shaped heat dissipation vent design on the bottom, it offers excellent high-temperature resistance and resistance to deformation, making it suitable for desoldering with a heat gun and circuit board repairs.2. One corner of the work mat features an integrated, multi-functional rotating screwdriver/tweezers holder, allowing repair tools to be stored upright to keep the work surface neat and organized.3. Equipped with compartmentalized storage slots to prevent screws and small parts from rolling away.4. Features a portable phone holder, making it convenient to view the screen or consult schematics during repairs.5. The edges feature a flush-edge design, allowing for smoother and more convenient cleaning of debris, solder residue, or grease, and preventing the buildup of dirt.6. Material: Silicone7. Thickness: Approx. 4 mm8. Dimensions: Approx. 45 x 28 cm / 79 x 30 cm9. Weight: Approx. 650 g for the 45 x 28 cm model; approx. 1200 g for the 79 x 30 cm model10. Note: Includes only the mat; no other items are includedSpecification: Package Weight One Package Weight 0.67kgs / 1.49lb One Package Size 30cm * 10cm * 10cm / 11.81inch * 3.94inch * 3.94inch Qty per Carton 20 Carton Weight 14.40kgs / 31.75lb Carton Size 52cm * 42cm * 32cm / 20.47inch * 16.54inch * 12.6inch Loading Container 20GP: 381 cartons * 20 pcs = 7620 pcs 40HQ: 885 cartons * 20 pcs = 17700 pcs

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1. Combines straight-edge and rounded-corner frame correction in one tool for versatile smartphone frame repair.2. Designed to correct and reshape different mobile phone frame profiles with dedicated working stations.3. Dual-station structure allows fast switching between straight-edge and rounded-corner correction to improve repair efficiency.4. Helps restore deformed or bent phone frames and improve frame alignment during repair and refurbishment.5. Screw-driven adjustment mechanism provides controlled pressure for precise frame correction.Specification: Package Weight One Package Weight 0.20kgs / 0.45lb One Package Size 10cm * 10cm * 7cm / 3.94inch * 3.94inch * 2.76inch Qty per Carton 100 Carton Weight 21.00kgs / 46.30lb Carton Size 52cm * 42cm * 37cm / 20.47inch * 16.54inch * 14.57inch Loading Container 20GP: 330 cartons * 100 pcs = 33000 pcs 40HQ: 766 cartons * 100 pcs = 76600 pcs

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1. Specialized repair tool designed for mid-layer tin plating work on the S25 Ultra.2. Facilitates precise solder plating and restoration during advanced smartphone motherboard repair.3. Helps technicians perform controlled tin plating work on fine motherboard areas and connection points.4. Suitable for professional technicians handling PCB repair, solder restoration and component-level maintenance.5. A practical tool for mobile phone repair shops, motherboard technicians and electronics repair workstations.6. Note: Only for Samsung Galaxy S25 Ultra.Specification: Package Weight One Package Weight 0.05kgs / 0.12lb One Package Size 10cm * 10cm * 5cm / 3.94inch * 3.94inch * 1.97inch Qty per Carton 160 Carton Weight 9.00kgs / 19.84lb Carton Size 42cm * 42cm * 52cm / 16.54inch * 16.54inch * 20.47inch Loading Container 20GP: 290 cartons * 160 pcs = 46400 pcs 40HQ: 674 cartons * 160 pcs = 107840 pcs

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1. Supports multi-point temperature settings, with both standard curve and peak reflux modes.2. Covers most mobile phone motherboard sizes, ensuring uniform heat conduction and consistent heating across the entire motherboard.3. Slide-type rotatable clamp with spring-loaded structure, capable of securing motherboards and modules of different sizes.4. Color display shows real-time temperature, temperature curve, and operating status.5. Equipped with a Type-C data communication interface and power interface, compact design saves workbench space.6. Used for motherboard layering, BGA chip desoldering, motherboard separation, and other repairs, adaptable to various international environments.Specification: Package Weight One Package Weight 0.50kgs / 1.11lb One Package Size 20cm * 15cm * 8cm / 7.87inch * 5.91inch * 3.15inch Qty per Carton 40 Carton Weight 21.00kgs / 46.30lb Carton Size 62cm * 42cm * 42cm / 24.41inch * 16.54inch * 16.54inch Loading Container 20GP: 243 cartons * 40 pcs = 9720 pcs 40HQ: 566 cartons * 40 pcs = 22640 pcs

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1. Built-in dual high-strength magnetic cores provide strong magnetic force, firmly attracting metal tools of all sizes.2. Water-resistant, moisture-proof, and rust-proof surface treatment ensures strong magnetic force even in humid repair environments and prevents rust and corrosion.3. Quick two-step installation; fits workbenches, walls, and metal panels; multiple strips can be combined to adapt to different spaces.4. Stores mobile phone repair screwdrivers, pliers, wrenches, and other repair tools; also suitable for storing hardware tools and kitchen metal utensils.5. Conveniently stores small tools and screws during repairs, reducing parts loss and saving time searching for tools.6. Simple, elongated design saves space.Specification: Package Weight One Package Weight 0.19kgs / 0.43lb One Package Size 26cm * 5cm * 5cm / 10.24inch * 1.97inch * 1.97inch Qty per Carton 96 Carton Weight 19.24kgs / 42.42lb Carton Size 54cm * 42cm * 32cm / 21.26inch * 16.54inch * 12.6inch Loading Container 20GP: 367 cartons * 96 pcs = 35232 pcs 40HQ: 852 cartons * 96 pcs = 81792 pcs

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1. X99 Sony 1/1.8 inch 4K 8MP CMOS sensor camera, next-gen multi-function, industrial camera, high precision, high stability, high compatibility2. 4K output at full speed, ultimate HD vision, includes HDMI & high-speed Type-C cables3. Heat Sink Fins Design, Ensures Stable 4K Output, Unique Heat Sink Fin, Design on the Back4. Highly Integrated Flexible Use, Compact Size, Powerful Performance5. C/CS Adapter Included, Compatible with Various Devices6. Photo & Video Stable Output with Remote Control, Photo & Video with Remote Control, Stable OutputSpecification: Package Weight One Package Weight 0.50kgs / 1.11lb One Package Size 15cm * 15cm * 11cm / 5.91inch * 5.91inch * 4.33inch Qty per Carton 16 Carton Weight 9.00kgs / 19.84lb Carton Size 32cm * 32cm * 46cm / 12.6inch * 12.6inch * 18.11inch Loading Container 20GP: 566 cartons * 16 pcs = 9056 pcs 40HQ: 1314 cartons * 16 pcs = 21024 pcs

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1. Dual-station worktable for easy adhesive removal2. Tempered glass, high temperature resistant and easy to clean3. Precisely adjustable clamping width, compatible with chips of various sizes4. Suitable for adhesive removal and pin repair of BGA, CPU, IC and other components5. Specifically designed for removing black adhesive from mobile phone CPUs, memory ICs, power management ICs and various BGA chips, cleaning solder balls and repairing pins6. Employs a steplessly adjustable clamping structure, equipped with dual thickness limiting baffles (0.2mm / 0.4mm) and a high-temperature resistant tempered glass work panel, enabling stable chip fixation, safe adhesive removal and efficient chip refurbishment.Specification: Package Weight One Package Weight 0.12kgs / 0.27lb One Package Size 11cm * 8cm * 5cm / 4.33inch * 3.15inch * 1.97inch Qty per Carton 200 Carton Weight 25.00kgs / 55.12lb Carton Size 52cm * 46cm * 42cm / 20.47inch * 18.11inch * 16.54inch Loading Container 20GP: 265 cartons * 200 pcs = 53000 pcs 40HQ: 616 cartons * 200 pcs = 123200 pcs

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1. Fast melting speed, good solder diffusion, forming strong, highly conductive, and neat solder joints.2. Solder wire specifically designed for small battery panels, no soldering machine required.3. High activity, low melting point, and fast soldering speed.4. High insulation resistance, good conductivity, strong and durable.5. For soldering small metal plates, nickel sheets, cell terminals, and flexible battery connectors for battery BMS.Specification: Package Weight One Package Weight 0.03kgs / 0.07lb One Package Size 10cm * 5cm * 5cm / 3.94inch * 1.97inch * 1.97inch Qty per Carton 240 Carton Weight 8.20kgs / 18.08lb Carton Size 52cm * 42cm * 32cm / 20.47inch * 16.54inch * 12.6inch Loading Container 20GP: 381 cartons * 240 pcs = 91440 pcs 40HQ: 885 cartons * 240 pcs = 212400 pcs

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1. Equipped with a high-resolution Sony CMOS sensor for clear, detailed imaging of PCBs, ICs, solder joints and electronic components.2. Delivers sharp 4K image quality for high-detail real-time inspection, analysis and professional demonstrations.3. Supports both HDMI and Type-C output options for flexible connection to monitors, computers and other compatible devices.4. Designed for professional microscope imaging, suitable for electronics inspection, precision repair and industrial applications.5. High-resolution imaging helps technicians clearly observe tiny components, soldering points and circuit traces.6. Well-suited for smartphone repair, PCB inspection, IC rework, soldering and electronic component analysis.7. Useful for capturing inspection images and video, technical demonstrations, repair training and quality-control workflows.Specification: Package Weight One Package Weight 0.50kgs / 1.11lb One Package Size 14cm * 14cm * 10cm / 5.51inch * 5.51inch * 3.94inch Qty per Carton 16 Carton Weight 9.00kgs / 19.84lb Carton Size 30cm * 30cm * 42cm / 11.81inch * 11.81inch * 16.54inch Loading Container 20GP: 705 cartons * 16 pcs = 11280 pcs 40HQ: 1637 cartons * 16 pcs = 26192 pcs

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1. Specialized repair tool designed for mid-layer tin plating work on the S25 Ultra.2. Facilitates precise solder plating and restoration during advanced smartphone motherboard repair.3. Helps technicians perform controlled tin plating work on fine motherboard areas and connection points.4. Suitable for professional technicians handling PCB repair, solder restoration and component-level maintenance.5. A practical tool for mobile phone repair shops, motherboard technicians and electronics repair workstations.6. Note: Only for Samsung Galaxy S25 Ultra.Specification: Package Weight One Package Weight 0.05kgs / 0.12lb One Package Size 10cm * 10cm * 5cm / 3.94inch * 3.94inch * 1.97inch Qty per Carton 160 Carton Weight 9.00kgs / 19.84lb Carton Size 42cm * 42cm * 52cm / 16.54inch * 16.54inch * 20.47inch Loading Container 20GP: 290 cartons * 160 pcs = 46400 pcs 40HQ: 674 cartons * 160 pcs = 107840 pcs

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1. Input Voltage: 5V/1A2. Charging Method: Type-C3. Battery Capacity: 1800mAh4. Output Voltage: 3.7V5. Four adjustable speeds, forward and reverse function, meeting different removal needs for soft OCA dry adhesive and stubborn residue on flat and curved mobile phone LCD screens6. Efficiently removes residual OCA adhesive after screen separation, suitable for LCD refurbishment of most smartphone flat screens and curved flexible screens7. Wireless charging design, no power cord restrictions on the repair table8. For mobile phone repair shops, repair workshops, and DIY screen refurbishmentSpecification: Package Weight One Package Weight 0.30kgs / 0.67lb One Package Size 18cm * 8cm * 5cm / 7.09inch * 3.15inch * 1.97inch Qty per Carton 90 Carton Weight 28.00kgs / 61.73lb Carton Size 56cm * 42cm * 32cm / 22.05inch * 16.54inch * 12.6inch Loading Container 20GP: 354 cartons * 90 pcs = 31860 pcs 40HQ: 822 cartons * 90 pcs = 73980 pcs

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1. Equipped with an upgraded RP2354A third-generation chip, ensuring stable device recognition and fast response.2. One-click automatic entry into DFU, PWND, USBLiter8, and purple screen modes, making mobile phone repair efficient and convenient.3. Features independent buttons for DFU, PWND, and RES reset, allowing for one-click mode switching and device reset/reboot.4. Type-C expansion interface supports firmware upgrades, enabling future expansion to more compatible models.5. Can read device information, erase data, back up and restore activation data, and perform baseband backup and repair, among other device parameters.6. Built-in illustrated tutorials provide detailed explanations of how to enter DFU/PWND mode on mobile phones and tablets, lowering the barrier to entry for repair personnel.7. Compact size, easy to store and carry, suitable for desktop use in repair shops and for field repair work.Specification: Package Weight One Package Weight 0.03kgs / 0.07lb One Package Size 10cm * 10cm * 5cm / 3.94inch * 3.94inch * 1.97inch Qty per Carton 240 Carton Weight 8.20kgs / 18.08lb Carton Size 62cm * 52cm * 42cm / 24.41inch * 20.47inch * 16.54inch Loading Container 20GP: 196 cartons * 240 pcs = 47040 pcs 40HQ: 457 cartons * 240 pcs = 109680 pcs

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1. When tightening the screw to the preset torque value, the handle emits a "DADA" prompt sound and automatically idles, preventing the screw from being stripped or damaged due to over-tightening (adjustable torque: 0.35N.cm~0.55N.cm)2. Removable bit design with secure fit, no shaking, just a simple twist, rotate, and lock, the bits can be quickly replaced.3. Magnetic: Strong magnetic bit for easy use. Tight engagement for effortless removal, sturdy and durable magnetic bits4. Ergonomic handle design for comfortable grip and easy operation. Spiral texture anti-slip design increases friction, preventing slippage during use.5. Package includes:1 x Screwdriver Handle5 x BitSpecification: Package Weight One Package Weight 0.10kgs / 0.23lb One Package Size 15cm * 4cm * 3cm / 5.91inch * 1.57inch * 1.18inch Qty per Carton 200 Carton Weight 21.00kgs / 46.30lb Carton Size 42cm * 32cm * 32cm / 16.54inch * 12.6inch * 12.6inch Loading Container 20GP: 620 cartons * 200 pcs = 124000 pcs 40HQ: 1439 cartons * 200 pcs = 287800 pcs

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1. The YCS Divine Dragon Flame CH898 Heating Stage is engineered for precision repair of mobile phone motherboards, supporting layer separation, lamination, and dot matrix repair. It delivers consistent, even heating to protect delicate components during complex repairs.2. Adjustable temperature: 40 to 260 degrees Celsius (via digital controls). One-click switching for 3 common presets: 100 / 220 / 240 degrees Celsius (ideal for micro-soldering/Android/Apple and multi-excavation repair modes).3. The 96x53mm oversized platform fits most mobile phone motherboards (and small PCBs). Its aluminum alloy construction ensures rapid, uniform heat distribution—boosting repair efficiency by 30%+ compared to standard stages.4. Stable, scratch-free clamps secure your motherboard in place. The arms slide along dedicated slots (front/back of the platform) and rotate 360 degrees, enabling easy access to all edges for precise, hassle-free repairs.5. Aluminum alloy heating technology eliminates hot spots, ensuring consistent temperature across the entire platform. This reduces repair time and prevents thermal damage to sensitive components.6. Compact & Lightweight: Fits any workspace (desk/repair bench) without clutter.7. Clear Dual Display: Real-time temperature (degrees Celsius) and time tracking for precise control.8. Anti-Slip Feet: Rubber pads on the base prevent slipping during operation.Specification: Package Weight One Package Weight 0.35kgs / 0.78lb One Package Size 17cm * 17cm * 6cm / 6.69inch * 6.69inch * 2.36inch Qty per Carton 20 Carton Weight 8.00kgs / 17.64lb Carton Size 36cm * 36cm * 32cm / 14.17inch * 14.17inch * 12.6inch Loading Container 20GP: 643 cartons * 20 pcs = 12860 pcs 40HQ: 1492 cartons * 20 pcs = 29840 pcs

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1. Compatible with mainstream iOS flashing software, performing firmware flashing, system recovery, and repairing bricked or infinitely rebooting iOS devices.2. No manual button operation required, ideal for routine maintenance and system recovery in large-scale repair shops.3. Incompatible with projectors, Android phones, or other hardware.4. Works with DFU or recovery mode on iPhone 6-14 Pro-Max series, eliminating the need for complex manual button operations.5. Compact and portable design, suitable for deployment at repair stations.Specification: Package Weight One Package Weight 0.03kgs / 0.07lb One Package Size 10cm * 8cm * 6cm / 3.94inch * 3.15inch * 2.36inch Qty per Carton 150 Carton Weight 5.50kgs / 12.13lb Carton Size 52cm * 42cm * 38cm / 20.47inch * 16.54inch * 14.96inch Loading Container 20GP: 321 cartons * 150 pcs = 48150 pcs 40HQ: 745 cartons * 150 pcs = 111750 pcs

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1. Clearly illuminates fine CPU traces, micro pads, jumpers, and solder joints, significantly improving visibility for micro-soldering and pad repair operations under a stereo microscope.2. Built-in strong magnet securely attaches to most mainstream BGA fixtures, adhesive removal fixtures, and metal worktables.3. Adjustable illumination angle, saving operating space.4. Plug and play, easy to operate, providing stable and continuous illumination to meet the needs of long-term repair work.5. Specifically designed for smartphone CPU jumper soldering, pad repair, BGA chip ball placement, and underfill adhesive removal.6. Perfectly matches the workflow of a trinocular stereo microscope for chip-level maintenance of mobile phone motherboards.7. Lightweight and portable, saving limited worktable space.8. An essential auxiliary lighting tool for high-precision micro-soldering operations in professional repair workshops.Specification: Package Weight One Package Weight 0.07kgs / 0.16lb One Package Size 10cm * 10cm * 5cm / 3.94inch * 3.94inch * 1.97inch Qty per Carton 120 Carton Weight 9.40kgs / 20.72lb Carton Size 52cm * 42cm * 32cm / 20.47inch * 16.54inch * 12.6inch Loading Container 20GP: 381 cartons * 120 pcs = 45720 pcs 40HQ: 885 cartons * 120 pcs = 106200 pcs

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1. Operating temperature: 50-120 degrees Celsius2. Timing range: 1-99 minutes3. Integrated green dust indicator clearly displays fine dust particles, residual adhesive, and stains on the screen surface.4. Made of high-quality flexible double-layer silicone material, it can be rolled up freely after complete cooling, saving space.5. Supports AC110-240V universal wide voltage input, suitable for repair shops worldwide.6. For screen separation, back cover glass removal, and preheating before screen replacement for iPhone and Android smartphones and small tablets.Specification: Package Weight One Package Weight 0.43kgs / 0.96lb One Package Size 15cm * 12cm * 6cm / 5.91inch * 4.72inch * 2.36inch Qty per Carton 60 Carton Weight 26.80kgs / 59.08lb Carton Size 50cm * 47cm * 32cm / 19.69inch * 18.5inch * 12.6inch Loading Container 20GP: 354 cartons * 60 pcs = 21240 pcs 40HQ: 823 cartons * 60 pcs = 49380 pcs

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1. Supports convenient one-click switching to DFU and PWN modes, simplifying device servicing and reducing complicated manual operations.2. Features a built-in DCSD interface designed to support True Tone-related data transfer and display servicing workflows.3. Streamlines the DFU/PWN process with automated operation, helping improve efficiency for professional repair technicians.4. Supports intelligent channel switching for a more convenient and efficient repair workflow.5. Provides SysCFG read/write functionality for repair and engineering applications.6. Equipped with a convenient USB Type-C port for connection with compatible devices and repair equipment.7. Combines multiple operating functions with a multi-protection circuit design to provide a more reliable experience during professional repair work.8. Specifically designed for iPhone XR/XS/XS Max/11/11 Pro and 11 Pro Max repair and engineering applications.Specification: General Compatible with Apple:  iPhone 11 Pro , iPhone 11 Pro Max , iPhone 11 , iPhone XS , iPhone XS Max , iPhone XR , iPhone X Package Weight One Package Weight 0.10kgs / 0.23lb One Package Size 10cm * 1cm * 5cm / 3.94inch * 0.39inch * 1.97inch Qty per Carton 160 Carton Weight 17.00kgs / 37.48lb Carton Size 42cm * 42cm * 52cm / 16.54inch * 16.54inch * 20.47inch Loading Container 20GP: 290 cartons * 160 pcs = 46400 pcs 40HQ: 674 cartons * 160 pcs = 107840 pcs

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1. Operating temperature: 50-120 degrees Celsius2. Timing range: 1-99 minutes3. Integrated green dust indicator clearly displays fine dust particles, residual adhesive, and stains on the screen surface.4. Made of high-quality flexible double-layer silicone material, it can be rolled up freely after complete cooling, saving space.5. Supports AC110-240V universal wide voltage input, suitable for repair shops worldwide.6. For screen separation, back cover glass removal, and preheating before screen replacement for iPhone and Android smartphones and small tablets.Specification: Package Weight One Package Weight 0.43kgs / 0.96lb One Package Size 15cm * 12cm * 6cm / 5.91inch * 4.72inch * 2.36inch Qty per Carton 60 Carton Weight 26.80kgs / 59.08lb Carton Size 50cm * 47cm * 32cm / 19.69inch * 18.5inch * 12.6inch Loading Container 20GP: 354 cartons * 60 pcs = 21240 pcs 40HQ: 823 cartons * 60 pcs = 49380 pcs

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1. Built-in magnetic base securely locks the positioning plate and dedicated middle-layer stencil.2. Enables rapid and precise alignment of solder pads and stencil, effectively reducing manual offset errors, improving ball placement consistency, and enhancing daily work efficiency in the repair workshop.3. High-temperature resistant, suitable for hot air gun reflow soldering.4. Employs gradient temperature hot air heating to complete solder joint reflow molding, specifically designed for Android high-end motherboard layer repair scenarios.5. Compact desktop design, saving repair table space.Specification: Package Weight One Package Weight 0.05kgs / 0.12lb One Package Size 10cm * 10cm * 5cm / 3.94inch * 3.94inch * 1.97inch Qty per Carton 240 Carton Weight 13.00kgs / 28.66lb Carton Size 62cm * 52cm * 42cm / 24.41inch * 20.47inch * 16.54inch Loading Container 20GP: 196 cartons * 240 pcs = 47040 pcs 40HQ: 457 cartons * 240 pcs = 109680 pcs

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1. Built-in magnetic base securely locks the positioning plate and dedicated middle-layer stencil.2. Enables rapid and precise alignment of solder pads and stencil, effectively reducing manual offset errors, improving ball placement consistency, and enhancing daily work efficiency in the repair workshop.3. High-temperature resistant, suitable for hot air gun reflow soldering.4. Employs gradient temperature hot air heating to complete solder joint reflow molding, specifically designed for Android high-end motherboard layer repair scenarios.5. Compact desktop design, saving repair table space.Specification: Package Weight One Package Weight 0.05kgs / 0.12lb One Package Size 10cm * 10cm * 5cm / 3.94inch * 3.94inch * 1.97inch Qty per Carton 240 Carton Weight 13.00kgs / 28.66lb Carton Size 62cm * 52cm * 42cm / 24.41inch * 20.47inch * 16.54inch Loading Container 20GP: 196 cartons * 240 pcs = 47040 pcs 40HQ: 457 cartons * 240 pcs = 109680 pcs

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1. Designed specifically for reinstalling CPU, RAM, NAND flash memory, and other BGA-packaged chips on smartphone motherboards.2. Built-in magnetic base securely holds the positioning plate and stencil, enabling fast and accurate chip stencil alignment.3. Excellent high-temperature resistance, suitable for hot air gun reflow soldering.4. Helps form uniform, rounded solder balls, reducing the risk of bridging or missing solder balls.5. Suitable for high-volume chip refurbishment in repair shops.6. Compact desktop design, for mobile phone repair shops and repair labs.Specification: Package Weight One Package Weight 0.03kgs / 0.07lb One Package Size 10cm * 10cm * 5cm / 3.94inch * 3.94inch * 1.97inch Qty per Carton 160 Carton Weight 5.80kgs / 12.79lb Carton Size 52cm * 42cm * 42cm / 20.47inch * 16.54inch * 16.54inch Loading Container 20GP: 290 cartons * 160 pcs = 46400 pcs 40HQ: 674 cartons * 160 pcs = 107840 pcs

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1. Designed specifically for reinstalling CPU, RAM, NAND flash memory, and other BGA-packaged chips on smartphone motherboards.2. Built-in magnetic base securely holds the positioning plate and stencil, enabling fast and accurate chip stencil alignment.3. Excellent high-temperature resistance, suitable for hot air gun reflow soldering.4. Helps form uniform, rounded solder balls, reducing the risk of bridging or missing solder balls.5. Suitable for high-volume chip refurbishment in repair shops.6. Compact desktop design, for mobile phone repair shops and repair labs.Specification: Package Weight One Package Weight 0.03kgs / 0.07lb One Package Size 10cm * 10cm * 5cm / 3.94inch * 3.94inch * 1.97inch Qty per Carton 160 Carton Weight 5.80kgs / 12.79lb Carton Size 52cm * 42cm * 42cm / 20.47inch * 16.54inch * 16.54inch Loading Container 20GP: 290 cartons * 160 pcs = 46400 pcs 40HQ: 674 cartons * 160 pcs = 107840 pcs

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1. Designed specifically for reinstalling CPU, RAM, NAND flash memory, and other BGA-packaged chips on smartphone motherboards.2. Built-in magnetic base securely holds the positioning plate and stencil, enabling fast and accurate chip stencil alignment.3. Excellent high-temperature resistance, suitable for hot air gun reflow soldering.4. Helps form uniform, rounded solder balls, reducing the risk of bridging or missing solder balls.5. Suitable for high-volume chip refurbishment in repair shops.6. Compact desktop design, for mobile phone repair shops and repair labs.Specification: Package Weight One Package Weight 0.03kgs / 0.07lb One Package Size 10cm * 10cm * 5cm / 3.94inch * 3.94inch * 1.97inch Qty per Carton 160 Carton Weight 5.80kgs / 12.79lb Carton Size 52cm * 42cm * 42cm / 20.47inch * 16.54inch * 16.54inch Loading Container 20GP: 290 cartons * 160 pcs = 46400 pcs 40HQ: 674 cartons * 160 pcs = 107840 pcs

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1. Designed specifically for reinstalling CPU, RAM, NAND flash memory, and other BGA-packaged chips on smartphone motherboards.2. Built-in magnetic base securely holds the positioning plate and stencil, enabling fast and accurate chip stencil alignment.3. Excellent high-temperature resistance, suitable for hot air gun reflow soldering.4. Helps form uniform, rounded solder balls, reducing the risk of bridging or missing solder balls.5. Suitable for high-volume chip refurbishment in repair shops.6. Compact desktop design, for mobile phone repair shops and repair labs.Specification: Package Weight One Package Weight 0.03kgs / 0.07lb One Package Size 10cm * 10cm * 5cm / 3.94inch * 3.94inch * 1.97inch Qty per Carton 160 Carton Weight 5.80kgs / 12.79lb Carton Size 52cm * 42cm * 42cm / 20.47inch * 16.54inch * 16.54inch Loading Container 20GP: 290 cartons * 160 pcs = 46400 pcs 40HQ: 674 cartons * 160 pcs = 107840 pcs

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1. Built-in magnetic base securely locks the positioning plate and dedicated middle-layer stencil.2. Enables rapid and precise alignment of solder pads and stencil, effectively reducing manual offset errors, improving ball placement consistency, and enhancing daily work efficiency in the repair workshop.3. High-temperature resistant, suitable for hot air gun reflow soldering.4. Employs gradient temperature hot air heating to complete solder joint reflow molding, specifically designed for Android high-end motherboard layer repair scenarios.5. Compact desktop design, saving repair table space.Specification: Package Weight One Package Weight 0.05kgs / 0.12lb One Package Size 10cm * 10cm * 5cm / 3.94inch * 3.94inch * 1.97inch Qty per Carton 240 Carton Weight 13.00kgs / 28.66lb Carton Size 62cm * 52cm * 42cm / 24.41inch * 20.47inch * 16.54inch Loading Container 20GP: 196 cartons * 240 pcs = 47040 pcs 40HQ: 457 cartons * 240 pcs = 109680 pcs

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1. Built-in magnetic base securely locks the positioning plate and dedicated middle-layer stencil.2. Enables rapid and precise alignment of solder pads and stencil, effectively reducing manual offset errors, improving ball placement consistency, and enhancing daily work efficiency in the repair workshop.3. High-temperature resistant, suitable for hot air gun reflow soldering.4. Employs gradient temperature hot air heating to complete solder joint reflow molding, specifically designed for Android high-end motherboard layer repair scenarios.5. Compact desktop design, saving repair table space.Specification: Package Weight One Package Weight 0.05kgs / 0.12lb One Package Size 10cm * 10cm * 5cm / 3.94inch * 3.94inch * 1.97inch Qty per Carton 240 Carton Weight 13.00kgs / 28.66lb Carton Size 62cm * 52cm * 42cm / 24.41inch * 20.47inch * 16.54inch Loading Container 20GP: 196 cartons * 240 pcs = 47040 pcs 40HQ: 457 cartons * 240 pcs = 109680 pcs

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1. Built-in magnetic base securely locks the positioning plate and dedicated middle-layer stencil.2. Enables rapid and precise alignment of solder pads and stencil, effectively reducing manual offset errors, improving ball placement consistency, and enhancing daily work efficiency in the repair workshop.3. High-temperature resistant, suitable for hot air gun reflow soldering.4. Employs gradient temperature hot air heating to complete solder joint reflow molding, specifically designed for Android high-end motherboard layer repair scenarios.5. Compact desktop design, saving repair table space.6. Specifically designed for Huawei Mate60 and Mate60 Pro dual-layer motherboards, effectively solving the ball placement needs of separated dual-layer motherboard interconnection pads during repair work.Specification: Package Weight One Package Weight 0.02kgs / 0.05lb One Package Size 10cm * 10cm * 5cm / 3.94inch * 3.94inch * 1.97inch Qty per Carton 240 Carton Weight 5.80kgs / 12.79lb Carton Size 62cm * 52cm * 42cm / 24.41inch * 20.47inch * 16.54inch Loading Container 20GP: 196 cartons * 240 pcs = 47040 pcs 40HQ: 457 cartons * 240 pcs = 109680 pcs

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1. Input Voltage: 0-36V2. External Interface: 1/4-inch screw holes3. Output Voltage: 0-36V4. Input Current: 0-8A5. Output Current: 0-8A6. Millisecond-level response, capturing instantaneous changes7. Three detection modes: pointer/curve/multimeter, freely switchable as needed8. Clear identification, suitable for micro-current observation and complex circuit diagnosis9. Real-time power visualization; simply connect the device to observe voltage, current, and power change trends10. Multi-functional: combines waveform monitoring and basic electrical testing, covering more maintenance scenariosSpecification: Package Weight One Package Weight 0.27kgs / 0.60lb One Package Size 20cm * 12cm * 5cm / 7.87inch * 4.72inch * 1.97inch Qty per Carton 40 Carton Weight 11.80kgs / 26.01lb Carton Size 50cm * 42cm * 27cm / 19.69inch * 16.54inch * 10.63inch Loading Container 20GP: 470 cartons * 40 pcs = 18800 pcs 40HQ: 1091 cartons * 40 pcs = 43640 pcs

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1. Built-in magnetic base securely locks the positioning frame and stencil, enabling quick and precise alignment of the chip and stencil, preventing misalignment during ball placement.2. Compatible with two common rework processes: applying solder paste or directly placing solder balls.3. The stainless steel stencil can withstand direct heat from a hot air gun, and the robust clamping base ensures stability on the repair bench.4. Compact desktop design, ideal for laptop motherboard maintenance, GPU chip rework, and high-volume repair work.5. Specifically designed for laptop mobile RTX 3080 Ti GN20-E8 graphics chips.Specification: Package Weight One Package Weight 0.03kgs / 0.07lb One Package Size 10cm * 10cm * 5cm / 3.94inch * 3.94inch * 1.97inch Qty per Carton 240 Carton Weight 8.20kgs / 18.08lb Carton Size 62cm * 52cm * 42cm / 24.41inch * 20.47inch * 16.54inch Loading Container 20GP: 196 cartons * 240 pcs = 47040 pcs 40HQ: 457 cartons * 240 pcs = 109680 pcs

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1. Built-in magnetic base securely locks the positioning plate and dedicated middle-layer stencil.2. Enables rapid and precise alignment of solder pads and stencil, effectively reducing manual offset errors, improving ball placement consistency, and enhancing daily work efficiency in the repair workshop.3. High-temperature resistant, suitable for hot air gun reflow soldering.4. Employs gradient temperature hot air heating to complete solder joint reflow molding, specifically designed for Android high-end motherboard layer repair scenarios.5. Compact desktop design, saving repair table space.Specification: Package Weight One Package Weight 0.05kgs / 0.12lb One Package Size 10cm * 10cm * 5cm / 3.94inch * 3.94inch * 1.97inch Qty per Carton 240 Carton Weight 13.00kgs / 28.66lb Carton Size 62cm * 52cm * 42cm / 24.41inch * 20.47inch * 16.54inch Loading Container 20GP: 196 cartons * 240 pcs = 47040 pcs 40HQ: 457 cartons * 240 pcs = 109680 pcs

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1. Built-in magnetic base securely locks the positioning plate and dedicated middle-layer stencil.2. Enables rapid and precise alignment of solder pads and stencil, effectively reducing manual offset errors, improving ball placement consistency, and enhancing daily work efficiency in the repair workshop.3. High-temperature resistant, suitable for hot air gun reflow soldering.4. Employs gradient temperature hot air heating to complete solder joint reflow molding, specifically designed for Android high-end motherboard layer repair scenarios.5. Compact desktop design, saving repair table space.Specification: Package Weight One Package Weight 0.05kgs / 0.12lb One Package Size 10cm * 10cm * 5cm / 3.94inch * 3.94inch * 1.97inch Qty per Carton 240 Carton Weight 13.00kgs / 28.66lb Carton Size 62cm * 52cm * 42cm / 24.41inch * 20.47inch * 16.54inch Loading Container 20GP: 196 cartons * 240 pcs = 47040 pcs 40HQ: 457 cartons * 240 pcs = 109680 pcs

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1. Built-in magnetic base securely locks the positioning plate and dedicated middle-layer stencil.2. Enables rapid and precise alignment of solder pads and stencil, effectively reducing manual offset errors, improving ball placement consistency, and enhancing daily work efficiency in the repair workshop.3. High-temperature resistant, suitable for hot air gun reflow soldering.4. Employs gradient temperature hot air heating to complete solder joint reflow molding, specifically designed for Android high-end motherboard layer repair scenarios.5. Compact desktop design, saving repair table space.6. Specifically designed for Huawei Mate60 and Mate60 Pro dual-layer motherboards, effectively solving the ball placement needs of separated dual-layer motherboard interconnection pads during repair work.Specification: Package Weight One Package Weight 0.02kgs / 0.05lb One Package Size 10cm * 10cm * 5cm / 3.94inch * 3.94inch * 1.97inch Qty per Carton 240 Carton Weight 5.80kgs / 12.79lb Carton Size 62cm * 52cm * 42cm / 24.41inch * 20.47inch * 16.54inch Loading Container 20GP: 196 cartons * 240 pcs = 47040 pcs 40HQ: 457 cartons * 240 pcs = 109680 pcs

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1. Built-in magnetic base securely locks the positioning frame and stencil, enabling quick and precise alignment of the chip and stencil, preventing misalignment during ball placement.2. Compatible with two common rework processes: applying solder paste or directly placing solder balls.3. The stainless steel stencil can withstand direct heat from a hot air gun, and the robust clamping base ensures stability on the repair bench.4. Compact desktop design, ideal for laptop motherboard maintenance, GPU chip rework, and high-volume repair work.5. Specifically designed for laptop mobile RTX 3080 Ti GN20-E8 graphics chips.Specification: Package Weight One Package Weight 0.03kgs / 0.07lb One Package Size 10cm * 10cm * 5cm / 3.94inch * 3.94inch * 1.97inch Qty per Carton 240 Carton Weight 8.20kgs / 18.08lb Carton Size 62cm * 52cm * 42cm / 24.41inch * 20.47inch * 16.54inch Loading Container 20GP: 196 cartons * 240 pcs = 47040 pcs 40HQ: 457 cartons * 240 pcs = 109680 pcs

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1. Designed specifically for reinstalling CPU, RAM, NAND flash memory, and other BGA-packaged chips on smartphone motherboards.2. Built-in magnetic base securely holds the positioning plate and stencil, enabling fast and accurate chip stencil alignment.3. Excellent high-temperature resistance, suitable for hot air gun reflow soldering.4. Helps form uniform, rounded solder balls, reducing the risk of bridging or missing solder balls.5. Suitable for high-volume chip refurbishment in repair shops.6. Compact desktop design, for mobile phone repair shops and repair labs.Specification: Package Weight One Package Weight 0.03kgs / 0.07lb One Package Size 10cm * 10cm * 5cm / 3.94inch * 3.94inch * 1.97inch Qty per Carton 160 Carton Weight 5.80kgs / 12.79lb Carton Size 52cm * 42cm * 42cm / 20.47inch * 16.54inch * 16.54inch Loading Container 20GP: 290 cartons * 160 pcs = 46400 pcs 40HQ: 674 cartons * 160 pcs = 107840 pcs

Read more less

1. Built-in magnetic base securely locks the positioning plate and dedicated middle-layer stencil.2. Enables rapid and precise alignment of solder pads and stencil, effectively reducing manual offset errors, improving ball placement consistency, and enhancing daily work efficiency in the repair workshop.3. High-temperature resistant, suitable for hot air gun reflow soldering.4. Employs gradient temperature hot air heating to complete solder joint reflow molding, specifically designed for Android high-end motherboard layer repair scenarios.5. Compact desktop design, saving repair table space.6. Specifically designed for Huawei Mate60 and Mate60 Pro dual-layer motherboards, effectively solving the ball placement needs of separated dual-layer motherboard interconnection pads during repair work.Specification: Package Weight One Package Weight 0.02kgs / 0.05lb One Package Size 10cm * 10cm * 5cm / 3.94inch * 3.94inch * 1.97inch Qty per Carton 240 Carton Weight 5.80kgs / 12.79lb Carton Size 62cm * 52cm * 42cm / 24.41inch * 20.47inch * 16.54inch Loading Container 20GP: 196 cartons * 240 pcs = 47040 pcs 40HQ: 457 cartons * 240 pcs = 109680 pcs

Read more less

1. Built-in magnetic base securely locks the positioning plate and dedicated middle-layer stencil.2. Enables rapid and precise alignment of solder pads and stencil, effectively reducing manual offset errors, improving ball placement consistency, and enhancing daily work efficiency in the repair workshop.3. High-temperature resistant, suitable for hot air gun reflow soldering.4. Employs gradient temperature hot air heating to complete solder joint reflow molding, specifically designed for Android high-end motherboard layer repair scenarios.5. Compact desktop design, saving repair table space.6. Specifically designed for Huawei Mate60 and Mate60 Pro dual-layer motherboards, effectively solving the ball placement needs of separated dual-layer motherboard interconnection pads during repair work.Specification: Package Weight One Package Weight 0.02kgs / 0.05lb One Package Size 10cm * 10cm * 5cm / 3.94inch * 3.94inch * 1.97inch Qty per Carton 240 Carton Weight 5.80kgs / 12.79lb Carton Size 62cm * 52cm * 42cm / 24.41inch * 20.47inch * 16.54inch Loading Container 20GP: 196 cartons * 240 pcs = 47040 pcs 40HQ: 457 cartons * 240 pcs = 109680 pcs

Read more less

1. Built-in magnetic base securely locks the positioning plate and dedicated middle-layer stencil.2. Enables rapid and precise alignment of solder pads and stencil, effectively reducing manual offset errors, improving ball placement consistency, and enhancing daily work efficiency in the repair workshop.3. High-temperature resistant, suitable for hot air gun reflow soldering.4. Employs gradient temperature hot air heating to complete solder joint reflow molding, specifically designed for Android high-end motherboard layer repair scenarios.5. Compact desktop design, saving repair table space.Specification: Package Weight One Package Weight 0.05kgs / 0.12lb One Package Size 10cm * 10cm * 5cm / 3.94inch * 3.94inch * 1.97inch Qty per Carton 240 Carton Weight 13.00kgs / 28.66lb Carton Size 62cm * 52cm * 42cm / 24.41inch * 20.47inch * 16.54inch Loading Container 20GP: 196 cartons * 240 pcs = 47040 pcs 40HQ: 457 cartons * 240 pcs = 109680 pcs

Read more less

1. Built-in magnetic base securely locks the positioning plate and dedicated middle-layer stencil.2. Enables rapid and precise alignment of solder pads and stencil, effectively reducing manual offset errors, improving ball placement consistency, and enhancing daily work efficiency in the repair workshop.3. High-temperature resistant, suitable for hot air gun reflow soldering.4. Employs gradient temperature hot air heating to complete solder joint reflow molding, specifically designed for Android high-end motherboard layer repair scenarios.5. Compact desktop design, saving repair table space.Specification: Package Weight One Package Weight 0.05kgs / 0.12lb One Package Size 10cm * 10cm * 5cm / 3.94inch * 3.94inch * 1.97inch Qty per Carton 240 Carton Weight 13.00kgs / 28.66lb Carton Size 62cm * 52cm * 42cm / 24.41inch * 20.47inch * 16.54inch Loading Container 20GP: 196 cartons * 240 pcs = 47040 pcs 40HQ: 457 cartons * 240 pcs = 109680 pcs

Read more less

1. Designed specifically for reinstalling CPU, RAM, NAND flash memory, and other BGA-packaged chips on smartphone motherboards.2. Built-in magnetic base securely holds the positioning plate and stencil, enabling fast and accurate chip stencil alignment.3. Excellent high-temperature resistance, suitable for hot air gun reflow soldering.4. Helps form uniform, rounded solder balls, reducing the risk of bridging or missing solder balls.5. Suitable for high-volume chip refurbishment in repair shops.6. Compact desktop design, for mobile phone repair shops and repair labs.Specification: Package Weight One Package Weight 0.03kgs / 0.07lb One Package Size 10cm * 10cm * 5cm / 3.94inch * 3.94inch * 1.97inch Qty per Carton 160 Carton Weight 5.80kgs / 12.79lb Carton Size 52cm * 42cm * 42cm / 20.47inch * 16.54inch * 16.54inch Loading Container 20GP: 290 cartons * 160 pcs = 46400 pcs 40HQ: 674 cartons * 160 pcs = 107840 pcs

Read more less

1. Designed specifically for reinstalling CPU, RAM, NAND flash memory, and other BGA-packaged chips on smartphone motherboards.2. Built-in magnetic base securely holds the positioning plate and stencil, enabling fast and accurate chip stencil alignment.3. Excellent high-temperature resistance, suitable for hot air gun reflow soldering.4. Helps form uniform, rounded solder balls, reducing the risk of bridging or missing solder balls.5. Suitable for high-volume chip refurbishment in repair shops.6. Compact desktop design, for mobile phone repair shops and repair labs.Specification: Package Weight One Package Weight 0.03kgs / 0.07lb One Package Size 10cm * 10cm * 5cm / 3.94inch * 3.94inch * 1.97inch Qty per Carton 160 Carton Weight 5.80kgs / 12.79lb Carton Size 52cm * 42cm * 42cm / 20.47inch * 16.54inch * 16.54inch Loading Container 20GP: 290 cartons * 160 pcs = 46400 pcs 40HQ: 674 cartons * 160 pcs = 107840 pcs

Read more less

1. Built-in magnetic base securely locks the positioning plate and dedicated middle-layer stencil.2. Enables rapid and precise alignment of solder pads and stencil, effectively reducing manual offset errors, improving ball placement consistency, and enhancing daily work efficiency in the repair workshop.3. High-temperature resistant, suitable for hot air gun reflow soldering.4. Employs gradient temperature hot air heating to complete solder joint reflow molding, specifically designed for Android high-end motherboard layer repair scenarios.5. Compact desktop design, saving repair table space.Specification: Package Weight One Package Weight 0.05kgs / 0.12lb One Package Size 10cm * 10cm * 5cm / 3.94inch * 3.94inch * 1.97inch Qty per Carton 240 Carton Weight 13.00kgs / 28.66lb Carton Size 62cm * 52cm * 42cm / 24.41inch * 20.47inch * 16.54inch Loading Container 20GP: 196 cartons * 240 pcs = 47040 pcs 40HQ: 457 cartons * 240 pcs = 109680 pcs

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