SUNSHINE SS-T12B 9 In 1 Mobile Phone Motherboard Smart Repair Heating Platform Kit Support IP7G-16PM/Android Universal


1. Operating voltage: AC220V/50Hz (AC110V can be customized)
2. Temperature range: 80-250°C
3. Net weight: 13 in 1 about 1000g, 9 in 1 about 915g
4. Size: host about 13.5 x 13 x 2.8cm, heating area about 5.2 x 9.5cm
5. Packing list: 13 in 1: host x 1/module x 12/instruction manual x 1/power cable x 1, 9 in 1: host x 1/module x 8/instruction manual x 1/power cable x 1

Functional features:
1. Large heating area, good compatibility, support a variety of motherboard components desoldering operation, more convenient and fast
2. Modular design, a variety of combinations of modules, base universal module, scalability, easy to expand the new module
3. Intelligent temperature control, customized according to different melting point debugging temperature, with fast heating, long life, temperature uniformity
4. 360-degree rotating snap rail design, suitable for different shapes of the motherboard precision clamping, improve maintenance efficiency
5. Accurate positioning module, set up with positioning columns, can be accurately separated and fit the motherboard, easy to pick up, heat dissipation and non-slip
6. No air gun and no soldering iron, support IP7G-16PM/Android series of various sizes of cell phone motherboard layering/tinning/laminating/desoldering
7. Real machine testing to ensure accuracy, suitable for IP16/16Plus/16Pro/16Pro Max, to meet your maintenance needs


Specification:
Package Weight
One Package Weight 1.14kgs / 2.52lb
One Package Size 28cm * 18cm * 9cm / 11.02inch * 7.09inch * 3.54inch
Qty per Carton 10
Carton Weight 12.50kgs / 27.56lb
Carton Size 47cm * 38cm * 30cm / 18.5inch * 14.96inch * 11.81inch
Loading Container 20GP: 497 cartons * 10 pcs = 4970 pcs
40HQ: 1155 cartons * 10 pcs = 11550 pcs

SUNSHINE SS-T12B 9 In 1 Mobile Phone Motherboard Smart Repair Heating Platform Kit Support IP7G-16PM/Android Universal

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SKU: TBD0605769902

  • In stock (Processing Time 1 - 72 hours)

€181,72

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    Description


    1. Operating voltage: AC220V/50Hz (AC110V can be customized)
    2. Temperature range: 80-250°C
    3. Net weight: 13 in 1 about 1000g, 9 in 1 about 915g
    4. Size: host about 13.5 x 13 x 2.8cm, heating area about 5.2 x 9.5cm
    5. Packing list: 13 in 1: host x 1/module x 12/instruction manual x 1/power cable x 1, 9 in 1: host x 1/module x 8/instruction manual x 1/power cable x 1

    Functional features:
    1. Large heating area, good compatibility, support a variety of motherboard components desoldering operation, more convenient and fast
    2. Modular design, a variety of combinations of modules, base universal module, scalability, easy to expand the new module
    3. Intelligent temperature control, customized according to different melting point debugging temperature, with fast heating, long life, temperature uniformity
    4. 360-degree rotating snap rail design, suitable for different shapes of the motherboard precision clamping, improve maintenance efficiency
    5. Accurate positioning module, set up with positioning columns, can be accurately separated and fit the motherboard, easy to pick up, heat dissipation and non-slip
    6. No air gun and no soldering iron, support IP7G-16PM/Android series of various sizes of cell phone motherboard layering/tinning/laminating/desoldering
    7. Real machine testing to ensure accuracy, suitable for IP16/16Plus/16Pro/16Pro Max, to meet your maintenance needs


    Specification:
    Package Weight
    One Package Weight 1.14kgs / 2.52lb
    One Package Size 28cm * 18cm * 9cm / 11.02inch * 7.09inch * 3.54inch
    Qty per Carton 10
    Carton Weight 12.50kgs / 27.56lb
    Carton Size 47cm * 38cm * 30cm / 18.5inch * 14.96inch * 11.81inch
    Loading Container 20GP: 497 cartons * 10 pcs = 4970 pcs
    40HQ: 1155 cartons * 10 pcs = 11550 pcs

    Additional Information

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